SG89391A1 - Resin molding machine and resin tablet feeding machine - Google Patents

Resin molding machine and resin tablet feeding machine

Info

Publication number
SG89391A1
SG89391A1 SG200102217A SG200102217A SG89391A1 SG 89391 A1 SG89391 A1 SG 89391A1 SG 200102217 A SG200102217 A SG 200102217A SG 200102217 A SG200102217 A SG 200102217A SG 89391 A1 SG89391 A1 SG 89391A1
Authority
SG
Singapore
Prior art keywords
resin
machine
tablet feeding
molding machine
resin molding
Prior art date
Application number
SG200102217A
Other languages
English (en)
Inventor
Junji Hirano
Tsutomu Miyagawa
Tomio Katsuie
Yasuhiko Miyashita
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000121017A external-priority patent/JP4327985B2/ja
Priority claimed from JP2000120997A external-priority patent/JP4347991B2/ja
Priority claimed from JP2000122911A external-priority patent/JP4327988B2/ja
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG89391A1 publication Critical patent/SG89391A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0084—General arrangement or lay-out of plants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B29C33/428—For altering indicia, e.g. data, numbers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B29C45/1808—Feeding measured doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
SG200102217A 2000-04-21 2001-04-20 Resin molding machine and resin tablet feeding machine SG89391A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000121017A JP4327985B2 (ja) 2000-04-21 2000-04-21 樹脂封止装置
JP2000120997A JP4347991B2 (ja) 2000-04-21 2000-04-21 樹脂封止装置
JP2000122911A JP4327988B2 (ja) 2000-04-24 2000-04-24 樹脂タブレット送り装置及び樹脂封止装置

Publications (1)

Publication Number Publication Date
SG89391A1 true SG89391A1 (en) 2002-06-18

Family

ID=27343164

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200102217A SG89391A1 (en) 2000-04-21 2001-04-20 Resin molding machine and resin tablet feeding machine

Country Status (7)

Country Link
US (1) US6814556B2 (zh)
EP (2) EP1514662B1 (zh)
KR (1) KR100427519B1 (zh)
CN (2) CN1199776C (zh)
DE (2) DE60144161D1 (zh)
SG (1) SG89391A1 (zh)
TW (1) TW509615B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3609824B1 (ja) * 2003-10-30 2005-01-12 第一精工株式会社 樹脂封止成形装置
US7241414B2 (en) * 2004-06-25 2007-07-10 Asm Technology Singapore Pte Ltd. Method and apparatus for molding a semiconductor device
US20070176326A1 (en) * 2006-02-01 2007-08-02 Fa-Shen Chen Method for filling polymer blanks into molds and an apparatus thereof
JP2007251094A (ja) * 2006-03-20 2007-09-27 Towa Corp 半導体チップの樹脂封止成形装置
KR101446268B1 (ko) * 2008-07-28 2014-10-02 한미반도체 주식회사 오토몰드장치 및 오토몰드용 클리닝장치
KR20120046633A (ko) * 2010-11-02 2012-05-10 삼성전자주식회사 반도체 패키지 몰딩 시스템 및 몰딩 방법
TWI523164B (zh) * 2010-11-25 2016-02-21 山田尖端科技股份有限公司 樹脂模塑裝置
JP5342576B2 (ja) * 2011-02-18 2013-11-13 株式会社日本製鋼所 旋回可能な下ユニットを備えた転写フィルム送り装置
JP5866398B2 (ja) * 2013-05-15 2016-02-17 東芝機械株式会社 成形システム及び成形品の製造方法
CN105818337B (zh) * 2016-04-29 2018-09-28 浙江品创知识产权服务有限公司 一种新型蓄电池外壳注塑模具
JP6212609B1 (ja) * 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
CN107521052B (zh) * 2017-08-23 2023-10-03 歌尔科技有限公司 去静电分腔机构及小型注塑件取出方法
CN110497577A (zh) * 2019-08-21 2019-11-26 苏州旭芯翔智能设备有限公司 一种半导体元器件封装自动化注塑系统及其工作方法
JP7175869B2 (ja) * 2019-10-03 2022-11-21 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形方法
JP7475232B2 (ja) * 2020-07-22 2024-04-26 株式会社ディスコ 保護部材形成装置
JP7135186B1 (ja) * 2021-09-15 2022-09-12 Ｔｏｗａ株式会社 樹脂供給装置、樹脂成形システム、及び、樹脂成形品の製造方法
CN117549483B (zh) * 2023-10-20 2024-04-05 广东百赞智能装备有限公司 一种侧射立压式注塑机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03262620A (ja) * 1990-03-14 1991-11-22 Japan Steel Works Ltd:The 射出成形設備における製品搬送制御装置及びその方法
US5770128A (en) * 1992-04-13 1998-06-23 Apic Yamada Corporation Method of transfer molding and a transfer molding machine
US6033614A (en) * 1997-04-25 2000-03-07 Micron Technology, Inc. Manual pellet loader for Boschman automolds

Family Cites Families (21)

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US3797103A (en) * 1970-05-04 1974-03-19 Gen Electric Machine and process for semiconductor device assembly
JPH01186638A (ja) * 1988-01-14 1989-07-26 Seiei Kosan Kk 自動モールディング装置
JPH0618219B2 (ja) * 1988-09-27 1994-03-09 株式会社東芝 半導体装置の樹脂封止用樹脂タブレット供給装置
JP2744324B2 (ja) 1990-04-03 1998-04-28 アピックヤマダ株式会社 樹脂タブレットの整列方法および整列装置
JPH05138681A (ja) 1991-11-18 1993-06-08 Fujitsu Miyagi Electron:Kk 振動式パーツフイーダ及び樹脂成形装置
JPH06166049A (ja) 1992-12-01 1994-06-14 Apic Yamada Kk 樹脂タブレットの供給装置
JP2555517B2 (ja) * 1992-09-16 1996-11-20 禧夫 盛合 埋設構造物の形状測定方法および装置
TW257745B (zh) * 1993-07-22 1995-09-21 Towa Kk
US6007316A (en) * 1993-07-22 1999-12-28 Towa Corporation Apparatus for molding resin to seal electronic parts
JP2932136B2 (ja) * 1993-07-22 1999-08-09 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
NL9401930A (nl) * 1994-11-18 1996-07-01 Fico Bv Modulaire omhulinrichting.
EP0759349B1 (en) * 1995-08-23 2002-06-05 Apic Yamada Corporation Automatic molding machine using release film
NL1003366C2 (nl) * 1996-06-18 1997-12-19 Fico Bv Inrichting en werkwijze voor het omhullen van produkten.
JP2820125B2 (ja) 1996-07-04 1998-11-05 日本電気株式会社 タブレット供給装置
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine
JP3642637B2 (ja) 1996-08-20 2005-04-27 アピックヤマダ株式会社 樹脂モールド装置
JP3776174B2 (ja) * 1996-09-12 2006-05-17 アピックヤマダ株式会社 半導体部品の搬送装置
JP3809233B2 (ja) * 1996-10-15 2006-08-16 アピックヤマダ株式会社 リリースフィルムを用いる樹脂モールド装置
DK1058612T3 (da) * 1997-01-29 2005-01-17 Jes Tougaard Gram Fremgangsmåde og indretning til støbning af et sammensat emne
JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP2000049175A (ja) * 1998-07-31 2000-02-18 Tsukuba Seiko Kk 半導体の封止成形方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03262620A (ja) * 1990-03-14 1991-11-22 Japan Steel Works Ltd:The 射出成形設備における製品搬送制御装置及びその方法
US5770128A (en) * 1992-04-13 1998-06-23 Apic Yamada Corporation Method of transfer molding and a transfer molding machine
US6033614A (en) * 1997-04-25 2000-03-07 Micron Technology, Inc. Manual pellet loader for Boschman automolds

Also Published As

Publication number Publication date
CN1644347A (zh) 2005-07-27
EP1147870A2 (en) 2001-10-24
CN100363166C (zh) 2008-01-23
KR20010098773A (ko) 2001-11-08
DE60144161D1 (de) 2011-04-14
EP1147870A3 (en) 2002-12-04
EP1147870B1 (en) 2008-01-02
DE60132127D1 (de) 2008-02-14
US6814556B2 (en) 2004-11-09
EP1514662B1 (en) 2011-03-02
US20010033876A1 (en) 2001-10-25
TW509615B (en) 2002-11-11
EP1514662A1 (en) 2005-03-16
CN1199776C (zh) 2005-05-04
CN1335222A (zh) 2002-02-13
KR100427519B1 (ko) 2004-04-27

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