SG82657A1 - Copper foil for printed wiring board having excellent chemical resistance and heat resistance - Google Patents

Copper foil for printed wiring board having excellent chemical resistance and heat resistance

Info

Publication number
SG82657A1
SG82657A1 SG9905992A SG1999005992A SG82657A1 SG 82657 A1 SG82657 A1 SG 82657A1 SG 9905992 A SG9905992 A SG 9905992A SG 1999005992 A SG1999005992 A SG 1999005992A SG 82657 A1 SG82657 A1 SG 82657A1
Authority
SG
Singapore
Prior art keywords
wiring board
copper foil
printed wiring
excellent chemical
heat resistance
Prior art date
Application number
SG9905992A
Other languages
English (en)
Inventor
Fujiwara Kazuhisa
Tan Hiroshi
Fujii Mitsuo
Tsushima Masanobu
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of SG82657A1 publication Critical patent/SG82657A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
SG9905992A 1998-11-30 1999-11-29 Copper foil for printed wiring board having excellent chemical resistance and heat resistance SG82657A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10340616A JP3142259B2 (ja) 1998-11-30 1998-11-30 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法

Publications (1)

Publication Number Publication Date
SG82657A1 true SG82657A1 (en) 2001-08-21

Family

ID=18338688

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9905992A SG82657A1 (en) 1998-11-30 1999-11-29 Copper foil for printed wiring board having excellent chemical resistance and heat resistance

Country Status (9)

Country Link
US (1) US6329074B1 (zh)
EP (1) EP1006763B1 (zh)
JP (1) JP3142259B2 (zh)
KR (1) KR100653336B1 (zh)
CN (1) CN1183814C (zh)
DE (1) DE69930913D1 (zh)
MY (1) MY121120A (zh)
SG (1) SG82657A1 (zh)
TW (1) TW593688B (zh)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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JP2001177204A (ja) * 1999-12-15 2001-06-29 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP3661763B2 (ja) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
US6489035B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
KR100381930B1 (ko) * 2000-03-16 2003-04-26 (주)바이오니아 유전자 변형 농산물 검출방법 및 검출용 프라이머
US6660406B2 (en) * 2000-07-07 2003-12-09 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
JP3760731B2 (ja) * 2000-07-11 2006-03-29 ソニーケミカル株式会社 バンプ付き配線回路基板及びその製造方法
KR100442564B1 (ko) * 2001-10-23 2004-07-30 엘지전선 주식회사 아연-코발트-비소 합금의 배리어층이 형성된 피씨비용전해동박 및 그 표면 처리방법
JP3664708B2 (ja) * 2001-12-10 2005-06-29 三井化学株式会社 ポリイミド金属積層板およびその製造方法
TW584596B (en) * 2001-12-10 2004-04-21 Mitsui Chemicals Inc Method for manufacturing a polyimide and metal compound sheet
EP1481796B1 (en) * 2002-03-05 2015-08-19 Hitachi Chemical Co., Ltd. Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
KR20030090994A (ko) * 2002-05-24 2003-12-01 홍유표 Ｃｕ판을 포함하는 다층의 클래드 판재 제조 방법
WO2004005588A1 (ja) * 2002-07-04 2004-01-15 Mitsui Mining & Smelting Co.,Ltd. キャリア箔付電解銅箔
JP4686106B2 (ja) * 2002-10-23 2011-05-18 三井化学株式会社 ポリイミド金属箔積層板
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
JP2004349693A (ja) * 2003-04-30 2004-12-09 Mec Kk 銅表面の対樹脂接着層
JP4572363B2 (ja) * 2003-04-30 2010-11-04 メック株式会社 銅と配線基板用樹脂との接着層形成液及びその液を用いた銅と配線基板用樹脂との接着層の製造方法
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP4492434B2 (ja) * 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
KR100807796B1 (ko) * 2005-05-19 2008-03-06 한덕수 미세 패턴용 연성다층인쇄회로기판
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
CN100554528C (zh) * 2006-03-29 2009-10-28 哈尔滨工业大学 具有良好耐化学性及粘结力的电解铜箔镀层表面处理方法
JP5024930B2 (ja) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
JP5479668B2 (ja) * 2006-12-26 2014-04-23 古河電気工業株式会社 表面処理銅箔
KR101318871B1 (ko) * 2008-07-22 2013-10-17 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박 및 동장 적층판
KR101269745B1 (ko) * 2008-12-26 2013-05-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 회로용 압연 동박 또는 전해 동박, 이들을 사용한 전자 회로의 형성 방법 및 프린트 기판
CN102265712B (zh) * 2008-12-26 2014-10-29 吉坤日矿日石金属株式会社 电子电路的形成方法
JP5358586B2 (ja) * 2008-12-26 2013-12-04 Ｊｘ日鉱日石金属株式会社 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法
JP5457374B2 (ja) * 2009-01-29 2014-04-02 Ｊｘ日鉱日石金属株式会社 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法
JP5287976B2 (ja) 2009-03-09 2013-09-11 株式会社村田製作所 樹脂配線基板
US20120107637A1 (en) * 2009-06-05 2012-05-03 Jx Nippon Mining & Metals Corporation Copper Foil for Semiconductor Package Substrate and Substrate for Semiconductor Package
EP2444530A4 (en) * 2009-06-19 2013-01-02 Jx Nippon Mining & Metals Corp COPPER FOIL AND MANUFACTURING METHOD THEREFOR
JP5448616B2 (ja) * 2009-07-14 2014-03-19 古河電気工業株式会社 抵抗層付銅箔、該銅箔の製造方法および積層基板
JP4948579B2 (ja) * 2009-08-14 2012-06-06 古河電気工業株式会社 高周波伝送特性に優れる耐熱性銅箔及びその製造方法、回路基板、銅張積層基板及びその製造方法
CN102783255B (zh) * 2010-02-24 2017-04-19 吉坤日矿日石金属株式会社 印刷电路基板用铜箔及印刷电路基板用覆铜层压板
JP5685061B2 (ja) * 2010-11-19 2015-03-18 株式会社Ｓｈカッパープロダクツ プリント配線板用銅箔、及びプリント配線板
MY163882A (en) 2010-11-22 2017-11-15 Mitsui Mining & Smelting Co Surface-treated copper foil
JP6122847B2 (ja) * 2012-05-22 2017-04-26 三井金属鉱業株式会社 銅箔、負極集電体及び非水系二次電池の負極材
JP6030401B2 (ja) * 2012-10-12 2016-11-24 三井金属鉱業株式会社 表面処理銅箔の製造方法
CN103501580B (zh) * 2013-10-09 2016-04-27 北京科技大学 一种表面处理铜箔及其制备方法
JP6357336B2 (ja) * 2014-03-31 2018-07-11 三井金属鉱業株式会社 電解銅箔、キャリア箔付電解銅箔及びプリント配線板
JP6662685B2 (ja) * 2016-03-31 2020-03-11 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
KR102462505B1 (ko) 2016-04-22 2022-11-02 삼성전자주식회사 인쇄회로기판 및 반도체 패키지
JP2018018930A (ja) * 2016-07-27 2018-02-01 株式会社トーキン 固体電解コンデンサおよびその製造方法
TWI652163B (zh) * 2017-11-15 2019-03-01 財團法人工業技術研究院 高頻電路用銅箔及其製造方法
CN111757607B (zh) * 2019-03-29 2023-11-07 古河电气工业株式会社 表面处理铜箔、覆铜层叠板及印制布线板
CN111364071A (zh) * 2020-04-23 2020-07-03 广东嘉元科技股份有限公司 一种锂离子电池铜箔及制备方法
CN113652720B (zh) * 2021-07-15 2023-06-13 江门市瑞期精细化学工程有限公司 一种无氰镀铜打底的方法

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Publication number Priority date Publication date Assignee Title
GB2030176A (en) * 1978-07-20 1980-04-02 Mitsui Anaconda Electro Copper Copper foil suitable for use in making printed circuits
US5114543A (en) * 1989-05-17 1992-05-19 Fukuda Kinoku Hakafun Kogyo Kabushiki Kaisha Method of making thin copper foil for printed wiring board
GB2262103A (en) * 1990-06-05 1993-06-09 Fukuda Metal Foil And Powder C Surface treatment of a copper foil for printed circuit boards by electroplating and chromate treatment
US5262247A (en) * 1989-05-17 1993-11-16 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board
JPH0685455A (ja) * 1992-08-28 1994-03-25 Nikko Guurudo Foil Kk 印刷回路用銅箔の表面処理方法
FR2716329A1 (fr) * 1994-02-15 1995-08-18 Mitsui Mining & Smelting Co Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication.
JPH07321458A (ja) * 1995-03-17 1995-12-08 Fukuda Metal Foil & Powder Co Ltd 印刷回路用銅箔の表面処理方法

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JPH068455A (ja) 1992-06-29 1994-01-18 Canon Inc インクジェット記録ヘッド、その製造方法及び該記録ヘッドを備えた記録装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2030176A (en) * 1978-07-20 1980-04-02 Mitsui Anaconda Electro Copper Copper foil suitable for use in making printed circuits
US5114543A (en) * 1989-05-17 1992-05-19 Fukuda Kinoku Hakafun Kogyo Kabushiki Kaisha Method of making thin copper foil for printed wiring board
US5262247A (en) * 1989-05-17 1993-11-16 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board
GB2262103A (en) * 1990-06-05 1993-06-09 Fukuda Metal Foil And Powder C Surface treatment of a copper foil for printed circuit boards by electroplating and chromate treatment
JPH0685455A (ja) * 1992-08-28 1994-03-25 Nikko Guurudo Foil Kk 印刷回路用銅箔の表面処理方法
FR2716329A1 (fr) * 1994-02-15 1995-08-18 Mitsui Mining & Smelting Co Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication.
JPH07321458A (ja) * 1995-03-17 1995-12-08 Fukuda Metal Foil & Powder Co Ltd 印刷回路用銅箔の表面処理方法

Also Published As

Publication number Publication date
MY121120A (en) 2005-12-30
DE69930913D1 (de) 2006-05-24
JP2000165037A (ja) 2000-06-16
EP1006763B1 (en) 2006-04-19
KR100653336B1 (ko) 2006-12-01
US6329074B1 (en) 2001-12-11
CN1260684A (zh) 2000-07-19
TW593688B (en) 2004-06-21
KR20000047764A (ko) 2000-07-25
CN1183814C (zh) 2005-01-05
JP3142259B2 (ja) 2001-03-07
EP1006763A3 (en) 2002-06-19
EP1006763A2 (en) 2000-06-07

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