SG78592G - A method of and holder for holding electronic components - Google Patents

A method of and holder for holding electronic components

Info

Publication number
SG78592G
SG78592G SG785/92A SG78592A SG78592G SG 78592 G SG78592 G SG 78592G SG 785/92 A SG785/92 A SG 785/92A SG 78592 A SG78592 A SG 78592A SG 78592 G SG78592 G SG 78592G
Authority
SG
Singapore
Prior art keywords
holder
electronic components
holding electronic
holding
components
Prior art date
Application number
SG785/92A
Other languages
English (en)
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG78592G publication Critical patent/SG78592G/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49863—Assembling or joining with prestressing of part
    • Y10T29/4987—Elastic joining of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53552—Valve applying or removing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Packaging Frangible Articles (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
SG785/92A 1987-11-28 1992-08-06 A method of and holder for holding electronic components SG78592G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62301062A JPH0680602B2 (ja) 1987-11-28 1987-11-28 電子部品チップ保持治具および電子部品チップ取扱い方法

Publications (1)

Publication Number Publication Date
SG78592G true SG78592G (en) 1992-10-02

Family

ID=17892406

Family Applications (1)

Application Number Title Priority Date Filing Date
SG785/92A SG78592G (en) 1987-11-28 1992-08-06 A method of and holder for holding electronic components

Country Status (5)

Country Link
US (1) US4953283A (ja)
JP (1) JPH0680602B2 (ja)
DE (1) DE3839890C2 (ja)
GB (1) GB2212754B (ja)
SG (1) SG78592G (ja)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298576A (ja) * 1988-09-27 1990-04-10 Murata Mfg Co Ltd チップ型電子部品の保持治具およびその取り扱い方法
KR960003139B1 (ko) * 1991-12-03 1996-03-05 가부시끼가이샤 무라따 세이사꾸쇼 칩 부품 프레스 방법
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with cathodically vaporized connections and method for depositing cathodically vaporized connections on varistors.
US5337893A (en) * 1992-07-22 1994-08-16 Electro Scientific Industries, Inc. High capacity carrier plate
US5345668A (en) * 1992-12-24 1994-09-13 Motorola, Inc. Method for detecting MIS-orientation of semiconductor packages
JPH06260309A (ja) * 1993-03-05 1994-09-16 Murata Mfg Co Ltd チップ状電子部品の製造方法
DE4329791C2 (de) * 1993-09-03 1996-02-15 Teja Lichtenberg Verfahren zur automatischen Verteilung und zum Transport von Mikrofilterscheiben
DE19615674A1 (de) * 1996-04-19 1997-10-23 Mci Computer Gmbh Meßvorrichtung für integrierte Schaltkreise
DE19623841A1 (de) * 1996-06-14 1997-12-18 Mci Computer Gmbh Meßvorrichtung für integrierte Schaltkreise
DE19626505A1 (de) * 1996-07-02 1998-01-08 Mci Computer Gmbh Verfahren zur Handhabung von elektronischen Bauelementen in der Endmontage
US6505665B1 (en) 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
JP3643018B2 (ja) * 1999-07-22 2005-04-27 アイシン化工株式会社 クラッチ用摩擦板の製造方法及び製造装置
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
DE20005123U1 (de) * 2000-03-20 2001-08-02 Atg Test Systems Gmbh Vorrichtung zum Prüfen von Leiterplatten
DE10144876B4 (de) * 2001-09-12 2004-03-04 Robert Bosch Gmbh Belichtungsmaskeneinrichtung und Verfahren zur Ausrichtung einer Vielzahl von Substraten auf eine Belichtungsmaske
US6870177B2 (en) * 2001-11-27 2005-03-22 Electro Scientific Industries, Inc. Shadow-creating depression for establishing microchip location during visual inspection
TW577163B (en) * 2001-11-27 2004-02-21 Electro Scient Ind Inc A shadow-creating apparatus
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7404199B2 (en) * 2003-06-12 2008-07-22 Symbol Technologies, Inc. Method, system, and apparatus for high volume assembly of compact discs and digital video discs incorporating radio frequency identification tag technology
US7014527B2 (en) * 2003-12-16 2006-03-21 Xerox Corporation Die level testing using machine grooved storage tray with vacuum channels
US20060012387A1 (en) * 2004-06-29 2006-01-19 Symbol Technologies, Inc. Systems and methods for testing radio frequency identification tags
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
JP4693609B2 (ja) * 2005-11-30 2011-06-01 京セラキンセキ株式会社 圧電デバイスの製造方法
US20070131016A1 (en) * 2005-12-13 2007-06-14 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070139057A1 (en) * 2005-12-15 2007-06-21 Symbol Technologies, Inc. System and method for radio frequency identification tag direct connection test
US7470904B1 (en) * 2006-03-20 2008-12-30 Flir Systems, Inc. Infrared camera packaging
US20070244657A1 (en) * 2006-04-11 2007-10-18 Drago Randall A Methods and systems for testing radio frequency identification (RFID) tags having multiple antennas
JP5468497B2 (ja) * 2010-08-30 2014-04-09 積水化成品工業株式会社 部品包装用トレイ及びそれを用いた梱包体
FR2994689B1 (fr) * 2012-08-27 2015-04-24 M U L Micro Usinage Laser Dispositif de manipulation de composants, tels que des composants electroniques, et procede de fabrication
CN105580096B (zh) * 2013-09-26 2018-02-09 株式会社村田制作所 电子元器件的制造方法及电子元器件的制造装置
JP6056083B2 (ja) * 2014-01-29 2017-01-11 アキム株式会社 搬送キャリア
CN106298548B (zh) * 2015-05-27 2018-10-02 林钰期 电子器件沾银加工方法
DE102020200817B3 (de) * 2020-01-23 2021-06-17 Lpkf Laser & Electronics Aktiengesellschaft Montageverfahren für eine integrierte Halbleiter-Waver-Vorrichtung und dafür verwendbare Montagevorrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB707398A (en) * 1951-02-06 1954-04-14 Alfred Thomas Ridout Means for handling bottles
CH386091A (fr) * 1962-05-16 1964-12-31 Rivara Jean Dispositif pour poser simultanément plusieurs carreaux de revêtement sur une paroi
US3443685A (en) * 1967-05-26 1969-05-13 Illinois Tool Works Container carrier and package
US3529277A (en) * 1968-05-01 1970-09-15 Barnes Corp Integrated circuit carrier
US3617045A (en) * 1970-01-14 1971-11-02 Motorola Inc Vacuum-actuated chuck
US3828925A (en) * 1972-03-13 1974-08-13 Hilti Ag Stud magazine
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
US4393808A (en) * 1980-10-09 1983-07-19 Palomar Systems & Machines, Inc. Means for processing miniature electronic components
CA1206547A (en) * 1981-10-22 1986-06-24 Denver Braden Means for processing miniature electronic components such as capacitors or resistors
JPS60109204A (ja) * 1983-11-17 1985-06-14 株式会社村田製作所 チップ部品の外部電極形成方法

Also Published As

Publication number Publication date
GB2212754A (en) 1989-08-02
DE3839890C2 (de) 1993-10-28
JPH01143210A (ja) 1989-06-05
JPH0680602B2 (ja) 1994-10-12
GB8827775D0 (en) 1988-12-29
US4953283A (en) 1990-09-04
GB2212754B (en) 1992-04-15
DE3839890A1 (de) 1989-06-08

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