SG74679A1 - Ball grid array type package for semiconductor device - Google Patents

Ball grid array type package for semiconductor device

Info

Publication number
SG74679A1
SG74679A1 SG1998005061A SG1998005061A SG74679A1 SG 74679 A1 SG74679 A1 SG 74679A1 SG 1998005061 A SG1998005061 A SG 1998005061A SG 1998005061 A SG1998005061 A SG 1998005061A SG 74679 A1 SG74679 A1 SG 74679A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
grid array
ball grid
array type
type package
Prior art date
Application number
SG1998005061A
Other languages
English (en)
Inventor
Eiji Takano
Eiichi Hosomi
Chiaki Takubo
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of SG74679A1 publication Critical patent/SG74679A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG1998005061A 1997-12-01 1998-12-01 Ball grid array type package for semiconductor device SG74679A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33021097A JP3462979B2 (ja) 1997-12-01 1997-12-01 半導体装置

Publications (1)

Publication Number Publication Date
SG74679A1 true SG74679A1 (en) 2000-08-22

Family

ID=18230083

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998005061A SG74679A1 (en) 1997-12-01 1998-12-01 Ball grid array type package for semiconductor device

Country Status (5)

Country Link
US (1) US6376907B1 (ja)
JP (1) JP3462979B2 (ja)
KR (1) KR100360146B1 (ja)
SG (1) SG74679A1 (ja)
TW (1) TW439234B (ja)

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US6197619B1 (en) * 1999-01-28 2001-03-06 International Business Machines Corporation Method for reinforcing a semiconductor device to prevent cracking
US6559537B1 (en) * 2000-08-31 2003-05-06 Micron Technology, Inc. Ball grid array packages with thermally conductive containers
US20020079572A1 (en) * 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US7215022B2 (en) * 2001-06-21 2007-05-08 Ati Technologies Inc. Multi-die module
US20030131975A1 (en) * 2002-01-11 2003-07-17 Sabina Houle Integrated heat spreader with mechanical interlock designs
US6657866B2 (en) * 2002-03-15 2003-12-02 Robert C. Morelock Electronics assembly with improved heatsink configuration
JP3960156B2 (ja) 2002-07-19 2007-08-15 千住金属工業株式会社 板状基板封止用リッドの製造方法
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
KR100629764B1 (ko) * 2002-10-25 2006-09-28 마쯔시다덴기산교 가부시키가이샤 반도체 디바이스 및 반도체 디바이스를 조립하기 위한수지 바인더
TW200428623A (en) * 2003-06-11 2004-12-16 Siliconware Precision Industries Co Ltd Semiconductor package with heat sink
JP2005026518A (ja) 2003-07-03 2005-01-27 Toshiba Corp 半導体装置、電子回路装置および半導体装置の実装方法
US7180173B2 (en) * 2003-11-20 2007-02-20 Taiwan Semiconductor Manufacturing Co. Ltd. Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
US7575956B2 (en) * 2003-11-24 2009-08-18 St Assembly Test Services Ltd. Fabrication method for semiconductor package heat spreaders
US20050133908A1 (en) * 2003-12-18 2005-06-23 Advanced Thermal Technologies Chip assembly with glue-strengthening holes
WO2005059995A2 (en) * 2003-12-18 2005-06-30 Rf Module And Optical Design Limited Semiconductor package with integrated heatsink and electromagnetic shield
TWM261003U (en) * 2004-02-10 2005-04-01 Uniwill Comp Corp Improved structure for obstructing spill of heat-conducting material
US7327025B2 (en) * 2004-04-30 2008-02-05 St Assembly Test Services Ltd. Heat spreader for thermally enhanced semiconductor package
US6965171B1 (en) * 2004-06-07 2005-11-15 International Business Machines Corporation Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules
CN101048863B (zh) * 2004-10-28 2010-12-01 京瓷株式会社 电子部件模块以及无线通信设备
JP2006145610A (ja) * 2004-11-16 2006-06-08 Shinko Electric Ind Co Ltd 光学部品収納用パッケージ
US7268428B2 (en) * 2005-07-19 2007-09-11 International Business Machines Corporation Thermal paste containment for semiconductor modules
JP2007042719A (ja) * 2005-08-01 2007-02-15 Nec Electronics Corp 半導体装置
TWI316748B (en) * 2006-07-17 2009-11-01 Via Tech Inc Cooling module against esd and electronic package, assembly, and system using the same
JP5489394B2 (ja) 2006-07-20 2014-05-14 三星電子株式会社 Ｃｏｆ型半導体パッケージ
TWI349351B (en) * 2007-04-04 2011-09-21 Siliconware Precision Industries Co Ltd Heat-dissipating unit and semiconductor package having the same
JP2009009957A (ja) * 2007-06-26 2009-01-15 Nec Electronics Corp 半導体装置
US20090027859A1 (en) * 2007-07-26 2009-01-29 Giacoma Lawrence M Surface mounted heat sink and electromagnetic shield
JP5171549B2 (ja) * 2008-10-30 2013-03-27 ルネサスエレクトロニクス株式会社 電子装置
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
JP5263895B2 (ja) * 2010-01-12 2013-08-14 ルネサスエレクトロニクス株式会社 半導体装置、及び半導体装置の製造方法
FR2957192B1 (fr) * 2010-03-03 2013-10-25 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
US8354747B1 (en) * 2010-06-01 2013-01-15 Amkor Technology, Inc Conductive polymer lid for a sensor package and method therefor
KR101362398B1 (ko) 2012-07-10 2014-02-13 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US8952523B2 (en) * 2010-09-27 2015-02-10 Cisco Technology, Inc. Integrated circuit package lid configured for package coplanarity
TWI424550B (zh) * 2010-12-30 2014-01-21 Ind Tech Res Inst 功率元件封裝結構
JP2012054597A (ja) * 2011-11-07 2012-03-15 Renesas Electronics Corp 半導体装置
JP6199601B2 (ja) * 2013-05-01 2017-09-20 ルネサスエレクトロニクス株式会社 半導体装置
JP6157998B2 (ja) * 2013-09-03 2017-07-05 ルネサスエレクトロニクス株式会社 半導体装置
US10163816B2 (en) 2016-06-13 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Structure and formation method of chip package with lid
JP7358857B2 (ja) * 2019-09-04 2023-10-11 富士通株式会社 電子ユニット、電子ユニットの製造方法及び電子機器
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Also Published As

Publication number Publication date
JPH11163186A (ja) 1999-06-18
KR19990062689A (ko) 1999-07-26
US6376907B1 (en) 2002-04-23
TW439234B (en) 2001-06-07
JP3462979B2 (ja) 2003-11-05
KR100360146B1 (ko) 2003-01-15

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