GB2373924B - Ball grid array package - Google Patents
Ball grid array packageInfo
- Publication number
- GB2373924B GB2373924B GB0213162A GB0213162A GB2373924B GB 2373924 B GB2373924 B GB 2373924B GB 0213162 A GB0213162 A GB 0213162A GB 0213162 A GB0213162 A GB 0213162A GB 2373924 B GB2373924 B GB 2373924B
- Authority
- GB
- United Kingdom
- Prior art keywords
- grid array
- ball grid
- array package
- package
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H01L2224/45001—Core members of the connector
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019970019145A KR19980083734A (en) | 1997-05-17 | 1997-05-17 | Thin Film Ball Grid Array Package with Improved Thermal Dissipation |
KR1019970019144A KR100220249B1 (en) | 1997-05-17 | 1997-05-17 | Thermally enhanced thin ball grid array package |
GB9806078A GB2325340B (en) | 1997-05-17 | 1998-03-20 | Ball grid array package |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0213162D0 GB0213162D0 (en) | 2002-07-17 |
GB2373924A GB2373924A (en) | 2002-10-02 |
GB2373924B true GB2373924B (en) | 2002-11-13 |
Family
ID=27269252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0213162A Expired - Fee Related GB2373924B (en) | 1997-05-17 | 1998-03-20 | Ball grid array package |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2373924B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6847102B2 (en) * | 2002-11-08 | 2005-01-25 | Freescale Semiconductor, Inc. | Low profile semiconductor device having improved heat dissipation |
CN102347292A (en) * | 2011-09-30 | 2012-02-08 | 常熟市广大电器有限公司 | Novel chip packaging structure |
CN103632991B (en) * | 2013-12-12 | 2016-05-18 | 宁波芯健半导体有限公司 | A kind of wafer scale copper bump method for packing of laminated chips |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
US5105259A (en) * | 1990-09-28 | 1992-04-14 | Motorola, Inc. | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation |
US5147821A (en) * | 1990-09-28 | 1992-09-15 | Motorola, Inc. | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
US5708567A (en) * | 1995-11-15 | 1998-01-13 | Anam Industrial Co., Ltd. | Ball grid array semiconductor package with ring-type heat sink |
-
1998
- 1998-03-20 GB GB0213162A patent/GB2373924B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
US5105259A (en) * | 1990-09-28 | 1992-04-14 | Motorola, Inc. | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation |
US5147821A (en) * | 1990-09-28 | 1992-09-15 | Motorola, Inc. | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
US5708567A (en) * | 1995-11-15 | 1998-01-13 | Anam Industrial Co., Ltd. | Ball grid array semiconductor package with ring-type heat sink |
Also Published As
Publication number | Publication date |
---|---|
GB2373924A (en) | 2002-10-02 |
GB0213162D0 (en) | 2002-07-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20120628 AND 20120704 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20160320 |