GB0213162D0 - Ball grid array package - Google Patents

Ball grid array package

Info

Publication number
GB0213162D0
GB0213162D0 GBGB0213162.1A GB0213162A GB0213162D0 GB 0213162 D0 GB0213162 D0 GB 0213162D0 GB 0213162 A GB0213162 A GB 0213162A GB 0213162 D0 GB0213162 D0 GB 0213162D0
Authority
GB
United Kingdom
Prior art keywords
grid array
ball grid
array package
package
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0213162.1A
Other versions
GB2373924A (en
GB2373924B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019970019145A external-priority patent/KR19980083734A/en
Priority claimed from KR1019970019144A external-priority patent/KR100220249B1/en
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Priority claimed from GB9806078A external-priority patent/GB2325340B/en
Publication of GB0213162D0 publication Critical patent/GB0213162D0/en
Publication of GB2373924A publication Critical patent/GB2373924A/en
Application granted granted Critical
Publication of GB2373924B publication Critical patent/GB2373924B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/4805—Shape
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
GB0213162A 1997-05-17 1998-03-20 Ball grid array package Expired - Fee Related GB2373924B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1019970019145A KR19980083734A (en) 1997-05-17 1997-05-17 Thin Film Ball Grid Array Package with Improved Thermal Dissipation
KR1019970019144A KR100220249B1 (en) 1997-05-17 1997-05-17 Thermally enhanced thin ball grid array package
GB9806078A GB2325340B (en) 1997-05-17 1998-03-20 Ball grid array package

Publications (3)

Publication Number Publication Date
GB0213162D0 true GB0213162D0 (en) 2002-07-17
GB2373924A GB2373924A (en) 2002-10-02
GB2373924B GB2373924B (en) 2002-11-13

Family

ID=27269252

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0213162A Expired - Fee Related GB2373924B (en) 1997-05-17 1998-03-20 Ball grid array package

Country Status (1)

Country Link
GB (1) GB2373924B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847102B2 (en) 2002-11-08 2005-01-25 Freescale Semiconductor, Inc. Low profile semiconductor device having improved heat dissipation
CN102347292A (en) * 2011-09-30 2012-02-08 常熟市广大电器有限公司 Novel chip packaging structure
CN103632991B (en) * 2013-12-12 2016-05-18 宁波芯健半导体有限公司 A kind of wafer scale copper bump method for packing of laminated chips

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
US5105259A (en) * 1990-09-28 1992-04-14 Motorola, Inc. Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation
KR100201380B1 (en) * 1995-11-15 1999-06-15 김규현 Heat radiation structure of bga semiconductor package

Also Published As

Publication number Publication date
GB2373924A (en) 2002-10-02
GB2373924B (en) 2002-11-13

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20120628 AND 20120704

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160320