SG115323A1 - Enhanced reliability ball grid array package - Google Patents
Enhanced reliability ball grid array packageInfo
- Publication number
- SG115323A1 SG115323A1 SG9900009A SG1999000009A SG115323A1 SG 115323 A1 SG115323 A1 SG 115323A1 SG 9900009 A SG9900009 A SG 9900009A SG 1999000009 A SG1999000009 A SG 1999000009A SG 115323 A1 SG115323 A1 SG 115323A1
- Authority
- SG
- Singapore
- Prior art keywords
- grid array
- ball grid
- array package
- enhanced reliability
- reliability ball
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9900009A SG115323A1 (en) | 1999-01-12 | 1999-01-12 | Enhanced reliability ball grid array package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9900009A SG115323A1 (en) | 1999-01-12 | 1999-01-12 | Enhanced reliability ball grid array package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG115323A1 true SG115323A1 (en) | 2005-10-28 |
Family
ID=35453582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9900009A SG115323A1 (en) | 1999-01-12 | 1999-01-12 | Enhanced reliability ball grid array package |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG115323A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4791472A (en) * | 1985-09-23 | 1988-12-13 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
US5729050A (en) * | 1996-03-11 | 1998-03-17 | Lg Semicon Co., Ltd. | Semiconductor package substrate and ball grid array (BGA) semiconductor package using same |
-
1999
- 1999-01-12 SG SG9900009A patent/SG115323A1/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4791472A (en) * | 1985-09-23 | 1988-12-13 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
US5729050A (en) * | 1996-03-11 | 1998-03-17 | Lg Semicon Co., Ltd. | Semiconductor package substrate and ball grid array (BGA) semiconductor package using same |
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