SG83706A1 - Die-pad for ball grid array package - Google Patents

Die-pad for ball grid array package

Info

Publication number
SG83706A1
SG83706A1 SG9901333A SG1999001333A SG83706A1 SG 83706 A1 SG83706 A1 SG 83706A1 SG 9901333 A SG9901333 A SG 9901333A SG 1999001333 A SG1999001333 A SG 1999001333A SG 83706 A1 SG83706 A1 SG 83706A1
Authority
SG
Singapore
Prior art keywords
die
pad
grid array
ball grid
array package
Prior art date
Application number
SG9901333A
Inventor
Thiam Beng Lim
Yong Chua Teo
Original Assignee
Inst Of Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Of Microelectronics filed Critical Inst Of Microelectronics
Priority to SG9901333A priority Critical patent/SG83706A1/en
Publication of SG83706A1 publication Critical patent/SG83706A1/en

Links

SG9901333A 1999-04-01 1999-04-01 Die-pad for ball grid array package SG83706A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9901333A SG83706A1 (en) 1999-04-01 1999-04-01 Die-pad for ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9901333A SG83706A1 (en) 1999-04-01 1999-04-01 Die-pad for ball grid array package

Publications (1)

Publication Number Publication Date
SG83706A1 true SG83706A1 (en) 2001-10-16

Family

ID=20430317

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9901333A SG83706A1 (en) 1999-04-01 1999-04-01 Die-pad for ball grid array package

Country Status (1)

Country Link
SG (1) SG83706A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153565A (en) * 1995-11-25 1997-06-10 Samsung Electron Co Ltd Ball grid array package with heat sink
US5721450A (en) * 1995-06-12 1998-02-24 Motorola, Inc. Moisture relief for chip carriers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5721450A (en) * 1995-06-12 1998-02-24 Motorola, Inc. Moisture relief for chip carriers
JPH09153565A (en) * 1995-11-25 1997-06-10 Samsung Electron Co Ltd Ball grid array package with heat sink

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