TW407795U - Improvement of ball grid array packaging structure - Google Patents

Improvement of ball grid array packaging structure

Info

Publication number
TW407795U
TW407795U TW88207554U TW88207554U TW407795U TW 407795 U TW407795 U TW 407795U TW 88207554 U TW88207554 U TW 88207554U TW 88207554 U TW88207554 U TW 88207554U TW 407795 U TW407795 U TW 407795U
Authority
TW
Taiwan
Prior art keywords
improvement
grid array
packaging structure
ball grid
array packaging
Prior art date
Application number
TW88207554U
Other languages
Chinese (zh)
Inventor
Ming-Jen Lu
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88207554U priority Critical patent/TW407795U/en
Publication of TW407795U publication Critical patent/TW407795U/en

Links

TW88207554U 1999-05-12 1999-05-12 Improvement of ball grid array packaging structure TW407795U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88207554U TW407795U (en) 1999-05-12 1999-05-12 Improvement of ball grid array packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88207554U TW407795U (en) 1999-05-12 1999-05-12 Improvement of ball grid array packaging structure

Publications (1)

Publication Number Publication Date
TW407795U true TW407795U (en) 2000-10-01

Family

ID=21648000

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88207554U TW407795U (en) 1999-05-12 1999-05-12 Improvement of ball grid array packaging structure

Country Status (1)

Country Link
TW (1) TW407795U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees