TW450425U - Substrate structure of ball grid array package body - Google Patents

Substrate structure of ball grid array package body

Info

Publication number
TW450425U
TW450425U TW88206700U TW88206700U TW450425U TW 450425 U TW450425 U TW 450425U TW 88206700 U TW88206700 U TW 88206700U TW 88206700 U TW88206700 U TW 88206700U TW 450425 U TW450425 U TW 450425U
Authority
TW
Taiwan
Prior art keywords
package body
grid array
ball grid
substrate structure
array package
Prior art date
Application number
TW88206700U
Other languages
Chinese (zh)
Inventor
Su Tao
Chih-Ming Chung
Jian-Cheng Chen
Chun-Chi Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW88206700U priority Critical patent/TW450425U/en
Publication of TW450425U publication Critical patent/TW450425U/en

Links

TW88206700U 1999-04-27 1999-04-27 Substrate structure of ball grid array package body TW450425U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88206700U TW450425U (en) 1999-04-27 1999-04-27 Substrate structure of ball grid array package body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88206700U TW450425U (en) 1999-04-27 1999-04-27 Substrate structure of ball grid array package body

Publications (1)

Publication Number Publication Date
TW450425U true TW450425U (en) 2001-08-11

Family

ID=21647461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88206700U TW450425U (en) 1999-04-27 1999-04-27 Substrate structure of ball grid array package body

Country Status (1)

Country Link
TW (1) TW450425U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633975B2 (en) 2013-02-04 2017-04-25 Invensas Corporation Multi-die wirebond packages with elongated windows

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633975B2 (en) 2013-02-04 2017-04-25 Invensas Corporation Multi-die wirebond packages with elongated windows

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model