TW440065U - Bare die-type ball grid array package device with an enhanced structure - Google Patents
Bare die-type ball grid array package device with an enhanced structureInfo
- Publication number
- TW440065U TW440065U TW88209648U TW88209648U TW440065U TW 440065 U TW440065 U TW 440065U TW 88209648 U TW88209648 U TW 88209648U TW 88209648 U TW88209648 U TW 88209648U TW 440065 U TW440065 U TW 440065U
- Authority
- TW
- Taiwan
- Prior art keywords
- grid array
- ball grid
- type ball
- package device
- bare die
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88209648U TW440065U (en) | 1999-06-11 | 1999-06-11 | Bare die-type ball grid array package device with an enhanced structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88209648U TW440065U (en) | 1999-06-11 | 1999-06-11 | Bare die-type ball grid array package device with an enhanced structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW440065U true TW440065U (en) | 2001-06-07 |
Family
ID=21649417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88209648U TW440065U (en) | 1999-06-11 | 1999-06-11 | Bare die-type ball grid array package device with an enhanced structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW440065U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9633975B2 (en) | 2013-02-04 | 2017-04-25 | Invensas Corporation | Multi-die wirebond packages with elongated windows |
CN111048534A (en) * | 2018-10-11 | 2020-04-21 | 胜丽国际股份有限公司 | Sensor package structure |
CN113380645A (en) * | 2021-07-06 | 2021-09-10 | 深圳市德明新微电子有限公司 | Packaging product and preparation method thereof |
-
1999
- 1999-06-11 TW TW88209648U patent/TW440065U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9633975B2 (en) | 2013-02-04 | 2017-04-25 | Invensas Corporation | Multi-die wirebond packages with elongated windows |
CN111048534A (en) * | 2018-10-11 | 2020-04-21 | 胜丽国际股份有限公司 | Sensor package structure |
CN113380645A (en) * | 2021-07-06 | 2021-09-10 | 深圳市德明新微电子有限公司 | Packaging product and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |