TW440065U - Bare die-type ball grid array package device with an enhanced structure - Google Patents

Bare die-type ball grid array package device with an enhanced structure

Info

Publication number
TW440065U
TW440065U TW88209648U TW88209648U TW440065U TW 440065 U TW440065 U TW 440065U TW 88209648 U TW88209648 U TW 88209648U TW 88209648 U TW88209648 U TW 88209648U TW 440065 U TW440065 U TW 440065U
Authority
TW
Taiwan
Prior art keywords
grid array
ball grid
type ball
package device
bare die
Prior art date
Application number
TW88209648U
Other languages
Chinese (zh)
Inventor
Shu Tau
Yu-Ching Tsai
Meng-Huei Lin
Jr-Ming Jung
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW88209648U priority Critical patent/TW440065U/en
Publication of TW440065U publication Critical patent/TW440065U/en

Links

TW88209648U 1999-06-11 1999-06-11 Bare die-type ball grid array package device with an enhanced structure TW440065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88209648U TW440065U (en) 1999-06-11 1999-06-11 Bare die-type ball grid array package device with an enhanced structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88209648U TW440065U (en) 1999-06-11 1999-06-11 Bare die-type ball grid array package device with an enhanced structure

Publications (1)

Publication Number Publication Date
TW440065U true TW440065U (en) 2001-06-07

Family

ID=21649417

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88209648U TW440065U (en) 1999-06-11 1999-06-11 Bare die-type ball grid array package device with an enhanced structure

Country Status (1)

Country Link
TW (1) TW440065U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633975B2 (en) 2013-02-04 2017-04-25 Invensas Corporation Multi-die wirebond packages with elongated windows
CN111048534A (en) * 2018-10-11 2020-04-21 胜丽国际股份有限公司 Sensor package structure
CN113380645A (en) * 2021-07-06 2021-09-10 深圳市德明新微电子有限公司 Packaging product and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633975B2 (en) 2013-02-04 2017-04-25 Invensas Corporation Multi-die wirebond packages with elongated windows
CN111048534A (en) * 2018-10-11 2020-04-21 胜丽国际股份有限公司 Sensor package structure
CN113380645A (en) * 2021-07-06 2021-09-10 深圳市德明新微电子有限公司 Packaging product and preparation method thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model