SG55189A1 - Temporary semiconductor package having dense array external contacts - Google Patents
Temporary semiconductor package having dense array external contactsInfo
- Publication number
- SG55189A1 SG55189A1 SG1996009289A SG1996009289A SG55189A1 SG 55189 A1 SG55189 A1 SG 55189A1 SG 1996009289 A SG1996009289 A SG 1996009289A SG 1996009289 A SG1996009289 A SG 1996009289A SG 55189 A1 SG55189 A1 SG 55189A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor package
- external contacts
- dense array
- array external
- temporary semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58462896A | 1996-01-11 | 1996-01-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG55189A1 true SG55189A1 (en) | 1998-12-21 |
Family
ID=24338163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996009289A SG55189A1 (en) | 1996-01-11 | 1996-04-18 | Temporary semiconductor package having dense array external contacts |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2979289B2 (en) |
KR (1) | KR100227724B1 (en) |
SG (1) | SG55189A1 (en) |
TW (1) | TW303502B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100416658B1 (en) * | 2001-06-28 | 2004-01-31 | 동부전자 주식회사 | Flip chip type semiconductor package |
KR100439934B1 (en) * | 2001-12-28 | 2004-07-12 | 동부전자 주식회사 | spring ceramic pin grid array package |
US7960210B2 (en) | 2007-04-23 | 2011-06-14 | Cufer Asset Ltd. L.L.C. | Ultra-thin chip packaging |
-
1996
- 1996-04-01 TW TW085103800A patent/TW303502B/en not_active IP Right Cessation
- 1996-04-18 SG SG1996009289A patent/SG55189A1/en unknown
- 1996-05-07 KR KR1019960014780A patent/KR100227724B1/en not_active IP Right Cessation
- 1996-05-08 JP JP8113885A patent/JP2979289B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW303502B (en) | 1997-04-21 |
KR100227724B1 (en) | 1999-11-01 |
JPH09199621A (en) | 1997-07-31 |
JP2979289B2 (en) | 1999-11-15 |
KR970060473A (en) | 1997-08-12 |
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