JP2006145610A - 光学部品収納用パッケージ - Google Patents
光学部品収納用パッケージ Download PDFInfo
- Publication number
- JP2006145610A JP2006145610A JP2004331855A JP2004331855A JP2006145610A JP 2006145610 A JP2006145610 A JP 2006145610A JP 2004331855 A JP2004331855 A JP 2004331855A JP 2004331855 A JP2004331855 A JP 2004331855A JP 2006145610 A JP2006145610 A JP 2006145610A
- Authority
- JP
- Japan
- Prior art keywords
- optical component
- metal cap
- package
- metal
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0051—Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0145—Hermetically sealing an opening in the lid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】 上面に光学部品(12)が搭載される部品搭載部を有する基板(10)と、部品搭載部の周囲にて基板上面に固定した金属枠(30)と、中央部にガラス窓(24)を気密に保持し、周囲に前記金属枠に熱圧着によって接合されるフランジ部(44)を有し、内部に前記光学部品を気密に収容する金属キャップ(40)とを具備して成る光学部品収納用パッケージにおいて、金属キャップ(40)のフランジ部(44)は金属枠(30)との接合部の内側に応力吸収部(46)を有する。
【選択図】 図3
Description
12 光学部品
14 部品搭載部
24 ガラス窓
28 開口部
30 金属枠
40 金属キャップ
42 金属キャップ本体
44 フランジ部
46 応力吸収部
Claims (3)
- 上面に光学部品が搭載される部品搭載部を有する基板と、前記部品搭載部の周囲にて前記基板上面に固定した金属枠と、中央部にガラス窓を気密に保持し、周囲に前記金属枠に熱圧着によって接合されるフランジ部を有し、内部に前記光学部品を気密に収容する金属キャップとを具備して成る光学部品収納用パッケージにおいて、
前記金属キャップのフランジ部は前記金属枠との接合部の内側に応力吸収部を有することを特徴とする光学部品収納用パッケージ。 - 前記金属キャップの本体部は、中央部に前記ガラス窓を保持する開口部を有する枠状の肉厚部分からなり、前記フランジ部は該本体部の外側周囲に一体的に薄肉部分として構成され、前記応力吸収部は断面が湾曲部として構成されていることを特徴とする請求項1に記載の光学部品収納用パッケージ。
- 前記金属キャップ及び金属枠はコバールからなり、表面にニッケルめっき及び金めっきが施されていることを特徴とする請求項1又は2に記載の光学部品収納用パッケージ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004331855A JP2006145610A (ja) | 2004-11-16 | 2004-11-16 | 光学部品収納用パッケージ |
US11/280,073 US20060102923A1 (en) | 2004-11-16 | 2005-11-15 | Optical element housing package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004331855A JP2006145610A (ja) | 2004-11-16 | 2004-11-16 | 光学部品収納用パッケージ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006145610A true JP2006145610A (ja) | 2006-06-08 |
Family
ID=36385334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004331855A Pending JP2006145610A (ja) | 2004-11-16 | 2004-11-16 | 光学部品収納用パッケージ |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060102923A1 (ja) |
JP (1) | JP2006145610A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147243A (ja) * | 2006-12-06 | 2008-06-26 | Olympus Corp | 気密封止装置 |
JP2008159869A (ja) * | 2006-12-25 | 2008-07-10 | Shinko Electric Ind Co Ltd | 半導体パッケージ |
JP2009176764A (ja) * | 2008-01-21 | 2009-08-06 | Sharp Corp | キャップ部材およびそれを用いた半導体装置 |
JP2010175341A (ja) * | 2009-01-28 | 2010-08-12 | Panasonic Electric Works Co Ltd | 赤外線センサ素子のパッケージ |
JP2013021220A (ja) * | 2011-07-13 | 2013-01-31 | Sumitomo Electric Ind Ltd | 光モジュール |
JP2016115771A (ja) * | 2014-12-12 | 2016-06-23 | 株式会社リコー | 光源モジュール及び光源モジュールの製造方法 |
WO2019159858A1 (ja) | 2018-02-13 | 2019-08-22 | 田中貴金属工業株式会社 | 透光性材料からなる封止用のリッド |
WO2023090002A1 (ja) * | 2021-11-18 | 2023-05-25 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、電子機器および半導体装置の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5130680B2 (ja) * | 2006-03-02 | 2013-01-30 | 日亜化学工業株式会社 | 半導体装置およびその形成方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55166939A (en) * | 1979-06-13 | 1980-12-26 | Nec Corp | Semiconductor device |
JPS6180840A (ja) * | 1984-09-28 | 1986-04-24 | Hitachi Ltd | 光電子装置 |
JP2000277648A (ja) * | 1999-03-29 | 2000-10-06 | Hamamatsu Photonics Kk | 半導体装置 |
JP2002171152A (ja) * | 2000-12-04 | 2002-06-14 | Seiko Epson Corp | 圧電デバイス及びその製造方法 |
JP2002289958A (ja) * | 2001-03-26 | 2002-10-04 | Kyocera Corp | 光半導体装置 |
US20030210452A1 (en) * | 2002-05-10 | 2003-11-13 | Texas Instruments, Inc. | Stress relieved flat frame for DMD window |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4622434A (en) * | 1984-11-19 | 1986-11-11 | Motorola Inc. | Semiconductor device package and method thereof |
US5455456A (en) * | 1993-09-15 | 1995-10-03 | Lsi Logic Corporation | Integrated circuit package lid |
JP3462979B2 (ja) * | 1997-12-01 | 2003-11-05 | 株式会社東芝 | 半導体装置 |
JPH11330283A (ja) * | 1998-05-15 | 1999-11-30 | Toshiba Corp | 半導体モジュール及び大型半導体モジュール |
-
2004
- 2004-11-16 JP JP2004331855A patent/JP2006145610A/ja active Pending
-
2005
- 2005-11-15 US US11/280,073 patent/US20060102923A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55166939A (en) * | 1979-06-13 | 1980-12-26 | Nec Corp | Semiconductor device |
JPS6180840A (ja) * | 1984-09-28 | 1986-04-24 | Hitachi Ltd | 光電子装置 |
JP2000277648A (ja) * | 1999-03-29 | 2000-10-06 | Hamamatsu Photonics Kk | 半導体装置 |
JP2002171152A (ja) * | 2000-12-04 | 2002-06-14 | Seiko Epson Corp | 圧電デバイス及びその製造方法 |
JP2002289958A (ja) * | 2001-03-26 | 2002-10-04 | Kyocera Corp | 光半導体装置 |
US20030210452A1 (en) * | 2002-05-10 | 2003-11-13 | Texas Instruments, Inc. | Stress relieved flat frame for DMD window |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147243A (ja) * | 2006-12-06 | 2008-06-26 | Olympus Corp | 気密封止装置 |
JP2008159869A (ja) * | 2006-12-25 | 2008-07-10 | Shinko Electric Ind Co Ltd | 半導体パッケージ |
JP2009176764A (ja) * | 2008-01-21 | 2009-08-06 | Sharp Corp | キャップ部材およびそれを用いた半導体装置 |
JP2010175341A (ja) * | 2009-01-28 | 2010-08-12 | Panasonic Electric Works Co Ltd | 赤外線センサ素子のパッケージ |
JP2013021220A (ja) * | 2011-07-13 | 2013-01-31 | Sumitomo Electric Ind Ltd | 光モジュール |
JP2016115771A (ja) * | 2014-12-12 | 2016-06-23 | 株式会社リコー | 光源モジュール及び光源モジュールの製造方法 |
WO2019159858A1 (ja) | 2018-02-13 | 2019-08-22 | 田中貴金属工業株式会社 | 透光性材料からなる封止用のリッド |
KR20200116485A (ko) | 2018-02-13 | 2020-10-12 | 다나카 기킨조쿠 고교 가부시키가이샤 | 투광성 재료를 포함하는 밀봉용 리드 |
US12002723B2 (en) | 2018-02-13 | 2024-06-04 | Tanaka Kikinzoku Kogyo K.K. | Sealing lid formed from translucent material |
WO2023090002A1 (ja) * | 2021-11-18 | 2023-05-25 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、電子機器および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060102923A1 (en) | 2006-05-18 |
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