SG159384A1 - Electropolishing and/or electroplating apparatus and methods - Google Patents
Electropolishing and/or electroplating apparatus and methodsInfo
- Publication number
- SG159384A1 SG159384A1 SG200606992-6A SG2006069926A SG159384A1 SG 159384 A1 SG159384 A1 SG 159384A1 SG 2006069926 A SG2006069926 A SG 2006069926A SG 159384 A1 SG159384 A1 SG 159384A1
- Authority
- SG
- Singapore
- Prior art keywords
- modules
- end effector
- vacuum
- electropolishing
- processing
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000012636 effector Substances 0.000 abstract 4
- 235000012431 wafers Nutrition 0.000 abstract 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/30—Polishing of semiconducting materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Robotics (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37091902P | 2002-04-08 | 2002-04-08 | |
US37095502P | 2002-04-08 | 2002-04-08 | |
US37092902P | 2002-04-08 | 2002-04-08 | |
US37095602P | 2002-04-08 | 2002-04-08 | |
US37254202P | 2002-04-14 | 2002-04-14 | |
US37256702P | 2002-04-14 | 2002-04-14 | |
US37256602P | 2002-04-14 | 2002-04-14 | |
US39046002P | 2002-06-21 | 2002-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG159384A1 true SG159384A1 (en) | 2010-03-30 |
Family
ID=29255769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200606992-6A SG159384A1 (en) | 2002-04-08 | 2003-04-08 | Electropolishing and/or electroplating apparatus and methods |
Country Status (10)
Country | Link |
---|---|
US (1) | US20050218003A1 (de) |
EP (1) | EP1492907A4 (de) |
JP (5) | JP2005522585A (de) |
KR (1) | KR20040099407A (de) |
CN (2) | CN100430526C (de) |
AU (1) | AU2003226319A1 (de) |
CA (1) | CA2479794A1 (de) |
SG (1) | SG159384A1 (de) |
TW (1) | TWI274393B (de) |
WO (1) | WO2003087436A1 (de) |
Families Citing this family (64)
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CN100419121C (zh) * | 2004-05-12 | 2008-09-17 | 鸿富锦精密工业(深圳)有限公司 | 湿蚀刻设备 |
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EP2360722B1 (de) * | 2006-08-04 | 2012-12-05 | E. I. du Pont de Nemours and Company | Anordnung zum Abscheiden luftempfindlichen Materials |
US8474468B2 (en) * | 2006-09-30 | 2013-07-02 | Tokyo Electron Limited | Apparatus and method for thermally processing a substrate with a heated liquid |
US20080107509A1 (en) * | 2006-11-07 | 2008-05-08 | Whitcomb Preston X | Vacuum end effector for handling highly shaped substrates |
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CN1319130C (zh) * | 1999-12-24 | 2007-05-30 | 株式会社荏原制作所 | 半导体基片处理装置及处理方法 |
-
2003
- 2003-04-07 TW TW092107906A patent/TWI274393B/zh not_active IP Right Cessation
- 2003-04-08 WO PCT/US2003/010725 patent/WO2003087436A1/en active Application Filing
- 2003-04-08 CN CNB038102064A patent/CN100430526C/zh not_active Expired - Fee Related
- 2003-04-08 SG SG200606992-6A patent/SG159384A1/en unknown
- 2003-04-08 CA CA002479794A patent/CA2479794A1/en not_active Abandoned
- 2003-04-08 EP EP03746651A patent/EP1492907A4/de not_active Withdrawn
- 2003-04-08 KR KR10-2004-7015977A patent/KR20040099407A/ko not_active Application Discontinuation
- 2003-04-08 CN CN2008102128377A patent/CN101353810B/zh not_active Expired - Fee Related
- 2003-04-08 JP JP2003584368A patent/JP2005522585A/ja active Pending
- 2003-04-08 US US10/510,522 patent/US20050218003A1/en not_active Abandoned
- 2003-04-08 AU AU2003226319A patent/AU2003226319A1/en not_active Abandoned
-
2006
- 2006-06-08 JP JP2006159680A patent/JP2006319348A/ja active Pending
- 2006-07-10 JP JP2006189857A patent/JP2006328543A/ja active Pending
- 2006-08-24 JP JP2006227700A patent/JP2007077501A/ja active Pending
- 2006-10-17 JP JP2006282453A patent/JP2007051377A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US3517958A (en) * | 1968-06-17 | 1970-06-30 | Ibm | Vacuum pick-up with air shield |
US4600229A (en) * | 1984-08-03 | 1986-07-15 | Oten Peter D | Vacuum cup |
US5374829A (en) * | 1990-05-07 | 1994-12-20 | Canon Kabushiki Kaisha | Vacuum chuck |
JPH07136885A (ja) * | 1993-06-30 | 1995-05-30 | Toshiba Corp | 真空チャック |
US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
US5937993A (en) * | 1997-01-14 | 1999-08-17 | Tamarac Scientific Co., Inc. | Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure |
US6279976B1 (en) * | 1999-05-13 | 2001-08-28 | Micron Technology, Inc. | Wafer handling device having conforming perimeter seal |
Also Published As
Publication number | Publication date |
---|---|
KR20040099407A (ko) | 2004-11-26 |
EP1492907A4 (de) | 2008-01-09 |
CN101353810A (zh) | 2009-01-28 |
EP1492907A1 (de) | 2005-01-05 |
TW200402821A (en) | 2004-02-16 |
CA2479794A1 (en) | 2003-10-23 |
CN1653211A (zh) | 2005-08-10 |
AU2003226319A1 (en) | 2003-10-27 |
WO2003087436A1 (en) | 2003-10-23 |
US20050218003A1 (en) | 2005-10-06 |
CN101353810B (zh) | 2012-02-15 |
JP2007051377A (ja) | 2007-03-01 |
TWI274393B (en) | 2007-02-21 |
JP2005522585A (ja) | 2005-07-28 |
JP2006319348A (ja) | 2006-11-24 |
JP2007077501A (ja) | 2007-03-29 |
JP2006328543A (ja) | 2006-12-07 |
CN100430526C (zh) | 2008-11-05 |
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