SG11201804654WA - Apparatus for holding substrate - Google Patents

Apparatus for holding substrate

Info

Publication number
SG11201804654WA
SG11201804654WA SG11201804654WA SG11201804654WA SG11201804654WA SG 11201804654W A SG11201804654W A SG 11201804654WA SG 11201804654W A SG11201804654W A SG 11201804654WA SG 11201804654W A SG11201804654W A SG 11201804654WA SG 11201804654W A SG11201804654W A SG 11201804654WA
Authority
SG
Singapore
Prior art keywords
shanghai
international
bld
road
cailun
Prior art date
Application number
SG11201804654WA
Inventor
Hui Wang
Zhaowei Jia
Hongchao Yang
Jun Wu
Jian Wang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201804654WA publication Critical patent/SG11201804654WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
  • Paints Or Removers (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -' Organization International Bureau res., 00) (43) International Publication Date .... ..sr.) 8 June 2017 (08.06.2017) W I P0 1 PCT ID Hit (10) 11111111 WO Ill International 11111 III IIIII II 2017/092029 10 111111111 Publication III III III IIII Al Number RIO IIII IIIIIIII (51) International Patent Classification: Road, Zhangjiang High-tech Park, Shanghai 201203 (CN). C25D 17/06 (2006.01) WANG, Jian; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-tech Park, Shanghai 201203 (CN). (21) International Application Number: PCT/CN2015/096402 (74) Agent: SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (22) International Filing Date: (CN). 4 December 2015 (04.12.2015) (25) Filing Language: English (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, (26) Publication Language: English AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, (71) Applicant: ACM RESEARCH (SHANGHAI) INC. DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang HN, HR, flU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, High-tech Park, Shanghai 201203 (CN). KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, Zhangjiang High-tech Park, Shanghai 201203 (CN). JIA, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, Zhaowei; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- SD, tech Park, Shanghai 201203 (CN). YANG, Hongchao; TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. Bld. 4, No. 1690 Cailun Road, Zhangjiang High-tech Park, (84) Designated States (unless otherwise indicated, for every Shanghai 201203 (CN). WU, Jun; Bld. 4, No. 1690 Cailun kind of regional protection available): ARIPO (BW, GH, [Continued on next page] (54) Title: APPARATUS FOR HOLDING SUBSTRATE : An for holding (57) apparatus a substrate (113) 103 has a chuck cup (101), a seal shell (111), a chuck plate (102) and a vertical driving device (103). The seal shell 100 (111) has a bottom wall (1111), an outer wall (1112) and an inner wall (1114). The inner wall (1114) foiins a lip seal portion (1115). The bottom wall (1111) and the outer wall (1112) of the seal shell (111) respectively wrap the bottom ' • 4 the the base surface and outer surface of portion (1011) of 4., 104 the chuck cup (101). The lip seal portion (1115) wraps the (1014) the (101) for supporting portion of chuck cup seal- ing the edge of the front side of the substrate (113). The ap- paratus protects the edge of the front side of the substrate, the back side of the substrate and the chuck cup from con- , tatting with the electrolyte solution. 0 , 'At - ars Ni ti p. 101 Il .4t 102 C\ N 0 N CT\ o it -- ,-, 0 N FIG 1 1012 O WO 2017/092029 Al IMEDIMOMMIONMEHMEMONIMMUMNIE GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, TJ, TM), European (AL, AT, BE, BG, CH, CY, KZ, CZ, RU, DE, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, Published: LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, — with international search report (Art. 21(3))
SG11201804654WA 2015-12-04 2015-12-04 Apparatus for holding substrate SG11201804654WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/096402 WO2017092029A1 (en) 2015-12-04 2015-12-04 Apparatus for holding substrate

Publications (1)

Publication Number Publication Date
SG11201804654WA true SG11201804654WA (en) 2018-06-28

Family

ID=58796086

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201804654WA SG11201804654WA (en) 2015-12-04 2015-12-04 Apparatus for holding substrate

Country Status (7)

Country Link
US (1) US11008669B2 (en)
JP (1) JP6633756B2 (en)
KR (1) KR102381604B1 (en)
CN (1) CN108291325B (en)
SG (1) SG11201804654WA (en)
TW (1) TWI691619B (en)
WO (1) WO2017092029A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019047086A1 (en) 2017-09-07 2019-03-14 Acm Research (Shanghai) Inc. Plating chuck
JP6963524B2 (en) * 2018-03-20 2021-11-10 キオクシア株式会社 Electroplating equipment
TWI666344B (en) * 2018-08-22 2019-07-21 台灣創智成功科技有限公司 Conductive ring, power supply device based on same, and electroplating fixture based on power supply device
TWI791785B (en) * 2019-03-06 2023-02-11 大陸商盛美半導體設備（上海）股份有限公司 Plating chuck
KR20210157413A (en) * 2019-05-17 2021-12-28 램 리써치 코포레이션 Substrate adhesion and damage mitigation
CN114645311A (en) * 2020-12-18 2022-06-21 盛美半导体设备(上海)股份有限公司 Cup-shaped chuck of substrate holding device and substrate holding device
CN115142104B (en) * 2022-07-28 2024-04-26 福州一策仪器有限公司 Electroplating device, multichannel electroplating device group and electroplating reaction system

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US6423636B1 (en) * 1999-11-19 2002-07-23 Applied Materials, Inc. Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
US20030019741A1 (en) * 2001-07-24 2003-01-30 Applied Materials, Inc. Method and apparatus for sealing a substrate surface during an electrochemical deposition process
US6579430B2 (en) 2001-11-02 2003-06-17 Innovative Technology Licensing, Llc Semiconductor wafer plating cathode assembly
TWI274393B (en) * 2002-04-08 2007-02-21 Acm Res Inc Electropolishing and/or electroplating apparatus and methods
JP2003313697A (en) * 2002-04-24 2003-11-06 Tokyo Electron Ltd Liquid treatment apparatus and liquid treatment method
JP3940648B2 (en) * 2002-08-07 2007-07-04 日本エレクトロプレイテイング・エンジニヤース株式会社 Wafer plating equipment
US7025862B2 (en) 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
JP2005248277A (en) * 2004-03-05 2005-09-15 Ebara Corp Electrode structure of plating equipment
US7938942B2 (en) * 2004-03-12 2011-05-10 Applied Materials, Inc. Single side workpiece processing
JP2006348373A (en) * 2005-06-20 2006-12-28 Yamamoto Mekki Shikenki:Kk Holder for electroplating
US20090095634A1 (en) * 2007-10-15 2009-04-16 Natsuki Makino Plating method
US7985325B2 (en) * 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US7935231B2 (en) * 2007-10-31 2011-05-03 Novellus Systems, Inc. Rapidly cleanable electroplating cup assembly
JP5237924B2 (en) 2008-12-10 2013-07-17 ノベルス・システムズ・インコーポレーテッド Base plate and electroplating apparatus
US9988734B2 (en) * 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
SG11201406133WA (en) * 2012-03-28 2014-10-30 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
US20130306465A1 (en) * 2012-05-17 2013-11-21 Applied Materials, Inc. Seal rings in electrochemical processors
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Also Published As

Publication number Publication date
TW201730382A (en) 2017-09-01
KR20180087379A (en) 2018-08-01
KR102381604B1 (en) 2022-04-01
WO2017092029A1 (en) 2017-06-08
JP2018537590A (en) 2018-12-20
CN108291325B (en) 2019-12-20
US11008669B2 (en) 2021-05-18
JP6633756B2 (en) 2020-01-22
TWI691619B (en) 2020-04-21
CN108291325A (en) 2018-07-17
US20180320285A1 (en) 2018-11-08

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