SG150557A1 - System and method pertaining to semiconductor dies - Google Patents

System and method pertaining to semiconductor dies

Info

Publication number
SG150557A1
SG150557A1 SG200901436-6A SG2009014366A SG150557A1 SG 150557 A1 SG150557 A1 SG 150557A1 SG 2009014366 A SG2009014366 A SG 2009014366A SG 150557 A1 SG150557 A1 SG 150557A1
Authority
SG
Singapore
Prior art keywords
semiconductor die
semiconductor dies
method pertaining
signal
hole
Prior art date
Application number
SG200901436-6A
Other languages
English (en)
Inventor
Brian S Schieck
Howard Lee Marks
Original Assignee
Nvidia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nvidia Corp filed Critical Nvidia Corp
Publication of SG150557A1 publication Critical patent/SG150557A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/94—Laser ablative material removal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
SG200901436-6A 2004-02-27 2005-02-23 System and method pertaining to semiconductor dies SG150557A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/789,637 US7842948B2 (en) 2004-02-27 2004-02-27 Flip chip semiconductor die internal signal access system and method

Publications (1)

Publication Number Publication Date
SG150557A1 true SG150557A1 (en) 2009-03-30

Family

ID=34887325

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200901436-6A SG150557A1 (en) 2004-02-27 2005-02-23 System and method pertaining to semiconductor dies

Country Status (5)

Country Link
US (3) US7842948B2 (zh)
CN (1) CN100490142C (zh)
SG (1) SG150557A1 (zh)
TW (1) TWI363183B (zh)
WO (1) WO2005088715A1 (zh)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7842948B2 (en) 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
US7279887B1 (en) * 2004-08-06 2007-10-09 Nvidia Corporation In-process system level test before surface mount
TWI251861B (en) * 2005-06-16 2006-03-21 Etron Technology Inc Re-entrant Routing method and circuit structure
US7485968B2 (en) 2005-08-11 2009-02-03 Ziptronix, Inc. 3D IC method and device
US7589548B2 (en) * 2007-02-22 2009-09-15 Teradyne, Inc. Design-for-test micro probe
US8877565B2 (en) * 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
US8271252B2 (en) * 2007-11-08 2012-09-18 Nvidia Corporation Automatic verification of device models
US8510616B2 (en) * 2008-02-14 2013-08-13 Nvidia Corporation Scalable scan-based test architecture with reduced test time and test power
US8745200B2 (en) * 2008-05-06 2014-06-03 Nvidia Corporation Testing operation of processors setup to operate in different modes
US8943457B2 (en) * 2008-11-24 2015-01-27 Nvidia Corporation Simulating scan tests with reduced resources
US8110926B2 (en) * 2009-01-30 2012-02-07 Broadcom Corporation Redistribution layer power grid
US9704766B2 (en) * 2011-04-28 2017-07-11 Taiwan Semiconductor Manufacturing Company, Ltd. Interposers of 3-dimensional integrated circuit package systems and methods of designing the same
US9082764B2 (en) * 2012-03-05 2015-07-14 Corning Incorporated Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
US9658281B2 (en) * 2013-10-25 2017-05-23 Taiwan Semiconductor Manufacturing Company Limited Alignment testing for tiered semiconductor structure
US20150262902A1 (en) 2014-03-12 2015-09-17 Invensas Corporation Integrated circuits protected by substrates with cavities, and methods of manufacture
KR101697603B1 (ko) * 2014-12-08 2017-01-19 삼성전자주식회사 반도체 패키지
US20160343685A1 (en) * 2015-05-21 2016-11-24 Mediatek Inc. Semiconductor package assembly and method for forming the same
US10032756B2 (en) * 2015-05-21 2018-07-24 Mediatek Inc. Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
US9852988B2 (en) 2015-12-18 2017-12-26 Invensas Bonding Technologies, Inc. Increased contact alignment tolerance for direct bonding
US10446487B2 (en) 2016-09-30 2019-10-15 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10002844B1 (en) 2016-12-21 2018-06-19 Invensas Bonding Technologies, Inc. Bonded structures
KR20190092584A (ko) 2016-12-29 2019-08-07 인벤사스 본딩 테크놀로지스 인코포레이티드 집적된 수동 컴포넌트를 구비한 접합된 구조체
US10276909B2 (en) 2016-12-30 2019-04-30 Invensas Bonding Technologies, Inc. Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
JP7030825B2 (ja) 2017-02-09 2022-03-07 インヴェンサス ボンディング テクノロジーズ インコーポレイテッド 接合構造物
WO2018169968A1 (en) 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
US10508030B2 (en) 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
US10784191B2 (en) 2017-03-31 2020-09-22 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10840205B2 (en) 2017-09-24 2020-11-17 Invensas Bonding Technologies, Inc. Chemical mechanical polishing for hybrid bonding
US11380597B2 (en) 2017-12-22 2022-07-05 Invensas Bonding Technologies, Inc. Bonded structures
US10923408B2 (en) 2017-12-22 2021-02-16 Invensas Bonding Technologies, Inc. Cavity packages
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US11056348B2 (en) 2018-04-05 2021-07-06 Invensas Bonding Technologies, Inc. Bonding surfaces for microelectronics
US11004757B2 (en) 2018-05-14 2021-05-11 Invensas Bonding Technologies, Inc. Bonded structures
EP3807927A4 (en) 2018-06-13 2022-02-23 Invensas Bonding Technologies, Inc. TSV AS A HIDEPAD
US11393779B2 (en) 2018-06-13 2022-07-19 Invensas Bonding Technologies, Inc. Large metal pads over TSV
US11515291B2 (en) 2018-08-28 2022-11-29 Adeia Semiconductor Inc. Integrated voltage regulator and passive components
US11011494B2 (en) 2018-08-31 2021-05-18 Invensas Bonding Technologies, Inc. Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
US11158573B2 (en) 2018-10-22 2021-10-26 Invensas Bonding Technologies, Inc. Interconnect structures
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
US11264357B1 (en) 2020-10-20 2022-03-01 Invensas Corporation Mixed exposure for large die
CN112904180B (zh) * 2021-01-22 2022-04-19 长鑫存储技术有限公司 芯片测试板及芯片测试方法
TWI754586B (zh) * 2021-05-04 2022-02-01 矽品精密工業股份有限公司 電子封裝件及其製法

Family Cites Families (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2795755A (en) * 1956-05-31 1957-06-11 Test M Mfg Co Inc U Electronic tube testers
US3870953A (en) * 1972-08-01 1975-03-11 Roger Boatman & Associates Inc In circuit electronic component tester
US4517729A (en) * 1981-07-27 1985-05-21 American Microsystems, Incorporated Method for fabricating MOS device with self-aligned contacts
US5247689A (en) * 1985-02-25 1993-09-21 Ewert Alfred P Parallel digital processor including lateral transfer buses with interrupt switches to form bus interconnection segments
US4700293A (en) * 1985-05-14 1987-10-13 The United States Of America As Represented By The Secretary Of The Air Force Maintenance port system incorporating software development package
US6753253B1 (en) * 1986-06-18 2004-06-22 Hitachi, Ltd. Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP2774881B2 (ja) * 1991-07-26 1998-07-09 シャープ株式会社 ガンマ補正回路
US5262719A (en) * 1991-09-19 1993-11-16 International Business Machines Corporation Test structure for multi-layer, thin-film modules
US5257223A (en) * 1991-11-13 1993-10-26 Hewlett-Packard Company Flip-flop circuit with controllable copying between slave and scan latches
US5409568A (en) * 1992-08-04 1995-04-25 Vasche; Gregory S. Method of fabricating a microelectronic vacuum triode structure
DE4305442C2 (de) * 1993-02-23 1999-08-05 Hewlett Packard Gmbh Verfahren und Vorrichtung zum Erzeugen eines Testvektors
US5428622A (en) * 1993-03-05 1995-06-27 Cyrix Corporation Testing architecture with independent scan paths
US5784112A (en) * 1993-07-02 1998-07-21 Canon Kabushiki Kaisha Encoding apparatus
US5880592A (en) * 1993-07-15 1999-03-09 Micron Technology, Inc. Modular design for an IC testing burn-in oven
US5579510A (en) * 1993-07-21 1996-11-26 Synopsys, Inc. Method and structure for use in static timing verification of synchronous circuits
US5753529A (en) 1994-05-05 1998-05-19 Siliconix Incorporated Surface mount and flip chip technology for total integrated circuit isolation
US5767578A (en) 1994-10-12 1998-06-16 Siliconix Incorporated Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation
US5629240A (en) * 1994-12-09 1997-05-13 Sun Microsystems, Inc. Method for direct attachment of an on-chip bypass capacitor in an integrated circuit
DE69635397T2 (de) * 1995-03-24 2006-05-24 Shinko Electric Industries Co., Ltd. Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren
US5996099A (en) * 1995-04-11 1999-11-30 Schlumberger Industries Method and apparatus for automatically testing electronic components in parallel utilizing different timing signals for each electronic component
FR2733323B1 (fr) * 1995-04-19 1997-05-30 Schlumberger Ind Sa Procede et equipement de test automatique en parallele de composants electroniques
US6133744A (en) * 1995-04-28 2000-10-17 Nec Corporation Apparatus for testing semiconductor wafer
DE19515591C2 (de) 1995-04-28 1997-05-22 Schroeder Hans Ulrich Dipl Ing Anordnung zur Formierung von vertikalen Kontakten zwischen zwei Leitbahnen in mikroelektronischen Schaltungen mit mehr als zwei Metallisierungslagen
US5635718A (en) * 1996-01-16 1997-06-03 Minnesota Mining And Manufacturing Company Multi-module radiation detecting device and fabrication method
US5966021A (en) * 1996-04-03 1999-10-12 Pycon, Inc. Apparatus for testing an integrated circuit in an oven during burn-in
US5907562A (en) * 1996-07-31 1999-05-25 Nokia Mobile Phones Limited Testable integrated circuit with reduced power dissipation
US5913034A (en) * 1996-08-27 1999-06-15 Compaq Computer Corp. Administrator station for a computer system
US6085346A (en) * 1996-09-03 2000-07-04 Credence Systems Corporation Method and apparatus for built-in self test of integrated circuits
US5818252A (en) * 1996-09-19 1998-10-06 Vivid Semiconductor, Inc. Reduced output test configuration for tape automated bonding
US6011748A (en) * 1996-10-03 2000-01-04 Credence Systems Corporation Method and apparatus for built-in self test of integrated circuits providing for separate row and column addresses
US6056784A (en) * 1996-10-04 2000-05-02 Synopsys, Inc. Circuit synthesis verification method and apparatus
US6057698A (en) * 1996-11-12 2000-05-02 Samsung Electronics Co., Ltd. Test system for variable selection of IC devices for testing
US6307162B1 (en) * 1996-12-09 2001-10-23 International Business Machines Corporation Integrated circuit wiring
US6245587B1 (en) * 1997-02-25 2001-06-12 International Business Machines Corporation Method for making semiconductor devices having backside probing capability
US5821549A (en) * 1997-03-03 1998-10-13 Schlumberger Technologies, Inc. Through-the-substrate investigation of flip-chip IC's
US5807763A (en) * 1997-05-05 1998-09-15 International Business Machines Corporation Electric field test of integrated circuit component
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
US6097087A (en) * 1997-10-31 2000-08-01 Micron Technology, Inc. Semiconductor package including flex circuit, interconnects and dense array external contacts
US6581189B1 (en) 1998-01-14 2003-06-17 Advanced Micro Devices, Inc. Computer implemented method and program for automating flip-chip bump layout in integrated circuit package design
US6075427A (en) * 1998-01-23 2000-06-13 Lucent Technologies Inc. MCM with high Q overlapping resonator
US5988485A (en) 1998-03-17 1999-11-23 Advanced Micro Devices, Inc. Flux cleaning for flip chip technology using environmentally friendly solvents
US6103549A (en) 1998-03-17 2000-08-15 Advanced Micro Devices, Inc. No clean flux for flip chip assembly
US6247165B1 (en) * 1998-03-31 2001-06-12 Synopsys, Inc. System and process of extracting gate-level descriptions from simulation tables for formal verification
US6519729B1 (en) * 1998-06-27 2003-02-11 Texas Instruments Incorporated Reduced power testing with equally divided scan paths
US6128727A (en) * 1998-08-21 2000-10-03 Advanced Micro Devices, Inc. Self modifying code to test all possible addressing modes
US6114892A (en) * 1998-08-31 2000-09-05 Adaptec, Inc. Low power scan test cell and method for making the same
US6081429A (en) * 1999-01-20 2000-06-27 Micron Technology, Inc. Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods
US6297654B1 (en) * 1999-07-14 2001-10-02 Cerprobe Corporation Test socket and method for testing an IC device in a dead bug orientation
US6246252B1 (en) * 1999-07-30 2001-06-12 Sun Microsystems, Inc. Efficient debug package design
JP4428489B2 (ja) * 1999-08-23 2010-03-10 パナソニック株式会社 集積回路装置及びそのテスト方法
GB9920077D0 (en) * 1999-08-24 1999-10-27 Sgs Thomson Microelectronics Scan latch circuit
US6511901B1 (en) * 1999-11-05 2003-01-28 Atmel Corporation Metal redistribution layer having solderable pads and wire bondable pads
US6380555B1 (en) * 1999-12-24 2002-04-30 Micron Technology, Inc. Bumped semiconductor component having test pads, and method and system for testing bumped semiconductor components
US7404127B2 (en) * 2000-01-10 2008-07-22 Texas Instruments Incorporated Circuitry with multiplexed dedicated and shared scan path cells
DE60108993T2 (de) * 2000-03-09 2005-07-21 Texas Instruments Inc., Dallas Anpassung von "Scan-BIST"-Architekturen für einen Betrieb mit niedrigem Verbrauch
US6769080B2 (en) * 2000-03-09 2004-07-27 Texas Instruments Incorporated Scan circuit low power adapter with counter
US6429532B1 (en) * 2000-05-09 2002-08-06 United Microelectronics Corp. Pad design
US6838773B2 (en) * 2000-06-21 2005-01-04 Hitachi Maxell, Ltd. Semiconductor chip and semiconductor device using the semiconductor chip
US6392432B1 (en) * 2000-06-26 2002-05-21 Advanced Micro Devices, Inc. Automated protection of IC devices from EOS (electro over stress) damage due to an undesired DC transient
US6420888B1 (en) * 2000-09-29 2002-07-16 Schlumberger Technologies, Inc. Test system and associated interface module
JP2002148309A (ja) * 2000-11-13 2002-05-22 Hitachi Ltd 半導体集積回路
US6472895B2 (en) * 2000-12-06 2002-10-29 Advanced Micro Devices, Inc. Method and system for adapting burn-in boards to multiple burn-in systems
US6621112B2 (en) * 2000-12-06 2003-09-16 Infineon Technologies Ag DRAM with vertical transistor and trench capacitor memory cells and methods of fabrication
US7765443B1 (en) * 2001-03-19 2010-07-27 Credence Systems Corporation Test systems and methods for integrated circuit devices
US6534853B2 (en) * 2001-06-05 2003-03-18 Chipmos Technologies Inc. Semiconductor wafer designed to avoid probed marks while testing
US6961937B2 (en) * 2001-07-11 2005-11-01 Sun Microsystems, Inc. Registry service for use in a distributed processing framework system and methods for implementing the same
US6874107B2 (en) * 2001-07-24 2005-03-29 Xilinx, Inc. Integrated testing of serializer/deserializer in FPGA
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7020699B2 (en) * 2001-09-11 2006-03-28 Sun Microsystems, Inc. Test result analyzer in a distributed processing framework system and methods for implementing the same
US6961885B2 (en) * 2001-11-26 2005-11-01 Ati Technologies, Inc. System and method for testing video devices using a test fixture
US6844218B2 (en) * 2001-12-27 2005-01-18 Texas Instruments Incorporated Semiconductor wafer with grouped integrated circuit die having inter-die connections for group testing
JP3885587B2 (ja) * 2002-01-16 2007-02-21 ヤマハ株式会社 演奏制御装置及び演奏制御用プログラム、並びに記録媒体
TW548414B (en) * 2002-01-29 2003-08-21 Via Tech Inc Automatic integrated circuit overall machine testing system, apparatus and its method
US6590294B1 (en) * 2002-02-13 2003-07-08 Industrial Technology Research Institute Device for bump probing and method of fabrication
US6720195B2 (en) * 2002-05-15 2004-04-13 Micron Technology, Inc. Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture
US20040015762A1 (en) * 2002-07-22 2004-01-22 Finisar Corporation Scalable system testing tools
TW567329B (en) * 2002-07-30 2003-12-21 Via Tech Inc Auto system-level test apparatus and method
US6747342B1 (en) 2002-08-09 2004-06-08 Lovoltech, Inc. Flip-chip packaging
US6686615B1 (en) * 2002-08-20 2004-02-03 Chipmos Technologies (Bermuda) Ltd. Flip-chip type semiconductor device for reducing signal skew
JP4131651B2 (ja) * 2002-08-21 2008-08-13 富士通株式会社 スキャン機能を有する集積回路のレイアウト方法
US6750646B1 (en) * 2002-10-04 2004-06-15 Nvidia Corporation Apparatus for environmental testing of a device in situ, and method thereof
US6744067B1 (en) * 2003-01-17 2004-06-01 Micron Technology, Inc. Wafer-level testing apparatus and method
JP4141857B2 (ja) * 2003-02-18 2008-08-27 日立マクセル株式会社 半導体装置
US6876215B1 (en) * 2003-02-27 2005-04-05 Credence Systems Corporation Apparatus for testing semiconductor integrated circuit devices in wafer form
US7512851B2 (en) * 2003-08-01 2009-03-31 Syntest Technologies, Inc. Method and apparatus for shifting at-speed scan patterns in a scan-based integrated circuit
US7444559B2 (en) * 2004-01-28 2008-10-28 Micron Technology, Inc. Generation of memory test patterns for DLL calibration
KR100568733B1 (ko) * 2004-02-10 2006-04-07 삼성전자주식회사 개선된 구조적 안정성을 갖는 캐패시터와 그 제조 방법 및이를 포함하는 반도체 장치와 그 제조 방법
US7842948B2 (en) * 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
JP2005300308A (ja) * 2004-04-09 2005-10-27 Oki Electric Ind Co Ltd 半導体集積回路
US7279887B1 (en) * 2004-08-06 2007-10-09 Nvidia Corporation In-process system level test before surface mount
US7216050B1 (en) * 2004-12-07 2007-05-08 Nvidia Corporation System and method for testing a printed circuit board assembly
US20070016834A1 (en) * 2005-07-13 2007-01-18 Texas Instruments Incorporated Reducing Power Dissipation During Sequential Scan Tests
TWI270953B (en) * 2005-08-17 2007-01-11 Advanced Semiconductor Eng Substrate and testing method thereof
US7544621B2 (en) * 2005-11-01 2009-06-09 United Microelectronics Corp. Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method
US7761751B1 (en) * 2006-05-12 2010-07-20 Credence Systems Corporation Test and diagnosis of semiconductors
US20080122463A1 (en) * 2006-06-30 2008-05-29 Sanjay Dabral Testing microelectronic devices using electro-optic modulator probes
US7495466B1 (en) 2006-06-30 2009-02-24 Transmeta Corporation Triple latch flip flop system and method
US8442795B2 (en) * 2006-07-10 2013-05-14 Bin1 Ate, Llc System and method for performing processing in a testing system
JP2008122159A (ja) * 2006-11-09 2008-05-29 Toshiba Corp 半導体集積回路
US7846782B2 (en) 2007-09-28 2010-12-07 Sandisk 3D Llc Diode array and method of making thereof
JP4696227B2 (ja) 2007-12-28 2011-06-08 スパンション エルエルシー 半導体装置の製造方法
US8742796B2 (en) 2011-01-18 2014-06-03 Nvidia Corporation Low energy flip-flops

Also Published As

Publication number Publication date
US8357931B2 (en) 2013-01-22
CN100490142C (zh) 2009-05-20
US20050191770A1 (en) 2005-09-01
TW200535942A (en) 2005-11-01
US20080128695A1 (en) 2008-06-05
CN1914726A (zh) 2007-02-14
US8951814B2 (en) 2015-02-10
US20130221354A1 (en) 2013-08-29
US7842948B2 (en) 2010-11-30
TWI363183B (en) 2012-05-01
WO2005088715A1 (en) 2005-09-22

Similar Documents

Publication Publication Date Title
SG150557A1 (en) System and method pertaining to semiconductor dies
US20220077072A1 (en) Semiconductor structure and manufacturing method thereof
US10184956B2 (en) Probe card
WO2009140244A3 (en) Packaged electronic devices with face-up die having through substrate via connection to leads and die pad
WO2003046976A1 (fr) Appareil d'essai d'evaluation de la fiabilite, systeme d'essai d'evaluation de la fiabilite, contacteur et procede d'essai d'evaluation de la fiabilite
TW200729398A (en) 3D IC method and device
CN100477141C (zh) 半导体封装器件及其制造和测试方法
TWI267132B (en) Semiconductor device and manufacturing method of the same
TW200625570A (en) Die down ball grid array packages and method for making same
MY151533A (en) Substrate and process for semiconductor flip chip package
KR20090122283A (ko) 반도체 장치를 패키징하는 장치, 패지징된 반도체 구성 부품, 반도체 장치를 패키징하는 장치의 제조 방법 및 반도체 구성 부품을 제조하는 방법
WO2005034203A3 (en) Method and apparatus for a dual substrate package
US8618814B2 (en) High bandwidth passive switching current sensor
US7586182B2 (en) Packaged semiconductor die and manufacturing method thereof
WO2001036990A3 (en) Wafer level interposer
MY139752A (en) Encapsulated chip scale package having flip-chip on lead frame structure and method
CN104051370A (zh) 一种带有热电偶结构的封装系统
US20130330846A1 (en) Test vehicles for encapsulated semiconductor device packages
US6912915B2 (en) Apparatus for shear testing bonds on silicon substrate
US9568541B2 (en) Testing of semiconductor packages with integrated antennas
US20140184261A1 (en) Testing apparatus and testing method
TW200725832A (en) Method of making semiconductor package with reduced moisture sensitivity
CN109585403A (zh) 传感器封装件及其制作方法
US7414422B2 (en) System in-package test inspection apparatus and test inspection method
CN103367281A (zh) 具有穿硅通孔与测试电路的半导体结构与其制作方法