SG139708A1 - Chemical-liquid mixing method and chemical-liquid mixing apparatus - Google Patents

Chemical-liquid mixing method and chemical-liquid mixing apparatus

Info

Publication number
SG139708A1
SG139708A1 SG200705612-0A SG2007056120A SG139708A1 SG 139708 A1 SG139708 A1 SG 139708A1 SG 2007056120 A SG2007056120 A SG 2007056120A SG 139708 A1 SG139708 A1 SG 139708A1
Authority
SG
Singapore
Prior art keywords
chemical
liquid mixing
hydrogen peroxide
peroxide solution
sulfuric acid
Prior art date
Application number
SG200705612-0A
Other languages
English (en)
Inventor
Hiroshi Tanaka
Koukichi Hiroshiro
Fumihiro Kamimura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG139708A1 publication Critical patent/SG139708A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B01F23/49—Mixing systems, i.e. flow charts or diagrams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B01F23/45—Mixing liquids with liquids; Emulsifying using flow mixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B01F23/45—Mixing liquids with liquids; Emulsifying using flow mixing
    • B01F23/451—Mixing liquids with liquids; Emulsifying using flow mixing by injecting one liquid into another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20—Measuring; Control or regulation
    • B01F35/22—Control or regulation
    • B01F35/2201—Control or regulation characterised by the type of control technique used
    • B01F35/2209—Controlling the mixing process as a whole, i.e. involving a complete monitoring and controlling of the mixing process during the whole mixing cycle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20—Measuring; Control or regulation
    • B01F35/22—Control or regulation
    • B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20—Measuring; Control or regulation
    • B01F35/22—Control or regulation
    • B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
    • B01F35/2215—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/717—Feed mechanisms characterised by the means for feeding the components to the mixer
    • B01F35/7176—Feed mechanisms characterised by the means for feeding the components to the mixer using pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • B01F35/834—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices the flow of substances to be mixed circulating in a closed circuit, e.g. from a container through valve, driving means, metering means or dispensing means, e.g. 3-way valve, and back to the container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/90—Heating or cooling systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/24—Stationary reactors without moving elements inside
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/90—Heating or cooling systems
    • B01F2035/99—Heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
    • B01F2101/2204—Mixing chemical components in generals in order to improve chemical treatment or reactions, independently from the specific application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00049—Controlling or regulating processes
    • B01J2219/00051—Controlling the temperature
    • B01J2219/00074—Controlling the temperature by indirect heating or cooling employing heat exchange fluids
    • B01J2219/00087—Controlling the temperature by indirect heating or cooling employing heat exchange fluids with heat exchange elements outside the reactor
    • B01J2219/00103—Controlling the temperature by indirect heating or cooling employing heat exchange fluids with heat exchange elements outside the reactor in a heat exchanger separate from the reactor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24—Stationary reactors without moving elements inside
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Weting (AREA)
SG200705612-0A 2006-08-03 2007-08-01 Chemical-liquid mixing method and chemical-liquid mixing apparatus SG139708A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006211732A JP4762822B2 (ja) 2006-08-03 2006-08-03 薬液混合方法および薬液混合装置

Publications (1)

Publication Number Publication Date
SG139708A1 true SG139708A1 (en) 2008-02-29

Family

ID=38561789

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705612-0A SG139708A1 (en) 2006-08-03 2007-08-01 Chemical-liquid mixing method and chemical-liquid mixing apparatus

Country Status (7)

Country Link
US (3) US9099502B2 (ko)
EP (1) EP1884280B1 (ko)
JP (1) JP4762822B2 (ko)
KR (1) KR101061949B1 (ko)
CN (1) CN101143713B (ko)
SG (1) SG139708A1 (ko)
TW (1) TWI402901B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5274383B2 (ja) * 2009-06-08 2013-08-28 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを格納した記憶媒体
JP5832397B2 (ja) * 2012-06-22 2015-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
USD786803S1 (en) 2015-01-29 2017-05-16 Samsung Electronics Co., Ltd. Remote control for air conditioner
USD801288S1 (en) 2015-01-29 2017-10-31 Samsung Electronics Co., Ltd. Remote control for air conditioner
TW201713751A (zh) * 2015-10-06 2017-04-16 聯華電子股份有限公司 酸槽補酸系統與方法
CN111214972B (zh) * 2020-01-16 2022-06-14 北京北方华创微电子装备有限公司 药液配比方法及药液配比装置
CN111790288B (zh) * 2020-07-21 2022-08-09 金华职业技术学院 一种磁性纳米复合材料的制备方法及其设备
CN112530790B (zh) * 2020-11-03 2022-01-11 长江存储科技有限责任公司 晶圆清洗装置和晶圆清洗方法
CN114210672B (zh) * 2021-12-17 2023-08-25 湖北兴福电子材料股份有限公司 电子级硫酸槽罐车清洗装置及清洗方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3870783A (en) * 1972-09-13 1975-03-11 Fmc Corp Process of preparing sodium carbonate peroxide
JPH02146428U (ko) * 1989-05-15 1990-12-12
US5069235A (en) * 1990-08-02 1991-12-03 Bold Plastics, Inc. Apparatus for cleaning and rinsing wafers
JP2787788B2 (ja) 1990-09-26 1998-08-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 残留物除去方法
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
JP3120520B2 (ja) * 1991-12-11 2000-12-25 ソニー株式会社 洗浄装置
KR0163362B1 (ko) * 1992-03-05 1999-02-01 이노우에 아키라 세정장치용 처리조
JP3074366B2 (ja) * 1993-02-22 2000-08-07 東京エレクトロン株式会社 処理装置
KR0124484B1 (ko) 1993-03-23 1997-12-10 모리시다 요이치 반도체 장치의 세정방법 및 그 장치
JP3080834B2 (ja) * 1994-03-30 2000-08-28 株式会社東芝 半導体基板洗浄処理装置
US5505785A (en) * 1994-07-18 1996-04-09 Ferrell; Gary W. Method and apparatus for cleaning integrated circuit wafers
US5593505A (en) * 1995-04-19 1997-01-14 Memc Electronic Materials, Inc. Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface
US5740053A (en) * 1995-07-31 1998-04-14 Tokyo Electron Limited Method of controlling monitor used in cleaning machine and object processing machine and monitor apparatus
JP3462325B2 (ja) * 1995-12-21 2003-11-05 大日本スクリーン製造株式会社 基板処理装置
US5904157A (en) * 1996-04-05 1999-05-18 Phelps Dodge Industries, Inc. Copper surface pickling system
DE19618974A1 (de) * 1996-05-10 1997-11-13 Wacker Chemie Gmbh Verfahren zur Behandlung von Halbleitermaterial
US5804516A (en) * 1996-06-14 1998-09-08 Taiwan Semiconductor Manufacturing Co. Ltd. Wet processing tank equipped with rapid drain and rinse system
TW310078U (en) * 1996-07-10 1997-07-01 Vanguard Int Semiconduct Corp Replacement structure of hand tools
US6391067B2 (en) * 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
TW504041U (en) * 1997-02-21 2002-09-21 Canon Kk Wafer processing apparatus
JP3087680B2 (ja) * 1997-04-04 2000-09-11 日本電気株式会社 半導体製造装置
US5780363A (en) * 1997-04-04 1998-07-14 International Business Machines Coporation Etching composition and use thereof
US5816274A (en) * 1997-04-10 1998-10-06 Memc Electronic Materials, Inc. Apparartus for cleaning semiconductor wafers
JP3920429B2 (ja) * 1997-12-02 2007-05-30 株式会社ルネサステクノロジ 位相シフトフォトマスクの洗浄方法および洗浄装置
JPH11226387A (ja) * 1998-02-13 1999-08-24 Karasawa Fine:Kk 流体による処理方法および装置
US6241827B1 (en) * 1998-02-17 2001-06-05 Tokyo Electron Limited Method for cleaning a workpiece
JP2000164550A (ja) * 1998-11-27 2000-06-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US6399517B2 (en) * 1999-03-30 2002-06-04 Tokyo Electron Limited Etching method and etching apparatus
JP2000319689A (ja) 1999-05-06 2000-11-21 Kurita Water Ind Ltd 電子材料用洗浄水
US6539963B1 (en) * 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser
JP3376985B2 (ja) * 2000-02-25 2003-02-17 日本電気株式会社 ウェット処理装置
JP4602540B2 (ja) * 2000-12-12 2010-12-22 オメガセミコン電子株式会社 基板処理装置
US6584989B2 (en) * 2001-04-17 2003-07-01 International Business Machines Corporation Apparatus and method for wet cleaning
US20030209069A1 (en) * 2002-05-13 2003-11-13 Silicon Integrated Systems Corp. Chemical bath having liquid level indications in outer trough
KR100481309B1 (ko) * 2002-06-27 2005-04-07 삼성전자주식회사 반도체 기판의 건조장비
KR100481176B1 (ko) * 2002-08-20 2005-04-07 삼성전자주식회사 기포검출장치가 장착된 웨트 크리닝 설비
JP2006173378A (ja) * 2004-12-16 2006-06-29 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
KR100665849B1 (ko) * 2005-04-20 2007-01-09 삼성전자주식회사 히터 과열방지장치
JP4695494B2 (ja) * 2005-11-01 2011-06-08 株式会社東芝 基板洗浄装置及び基板洗浄方法
JP4863897B2 (ja) * 2007-01-31 2012-01-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム

Also Published As

Publication number Publication date
KR101061949B1 (ko) 2011-09-05
EP1884280B1 (en) 2011-10-12
US9415356B1 (en) 2016-08-16
CN101143713A (zh) 2008-03-19
US20080031083A1 (en) 2008-02-07
EP1884280A1 (en) 2008-02-06
US9339775B2 (en) 2016-05-17
TW200814169A (en) 2008-03-16
JP4762822B2 (ja) 2011-08-31
US20150290599A1 (en) 2015-10-15
US20160228832A1 (en) 2016-08-11
CN101143713B (zh) 2010-12-08
KR20080012780A (ko) 2008-02-12
JP2008041794A (ja) 2008-02-21
US9099502B2 (en) 2015-08-04
TWI402901B (zh) 2013-07-21

Similar Documents

Publication Publication Date Title
SG139708A1 (en) Chemical-liquid mixing method and chemical-liquid mixing apparatus
US7641798B2 (en) Waste water treatment method and waste water treatment apparatus
EP1900693A4 (en) BALLAST WATER TREATMENT DEVICE
JP5950790B2 (ja) 廃水処理方法およびシステム
WO2006083598A3 (en) Method and apparatus for pumping liquids using directional growth and elimination of bubbles
CN102007579B (zh) 电子材料用清洗水、电子材料的清洗方法及溶气水的供给系统
TW200633769A (en) Method for liquid mixing supply
TW200744526A (en) Method for generating a microbial deactivation fluid in an apparatus for deactivating instruments and devices
JP2009248048A (ja) 気液混合水生成装置
CN102992471A (zh) 液体处理装置
CN106345326B (zh) 一种间歇式制备高浓度臭氧水的方法及装置
TW200802575A (en) Substrate cleaning method and substrate cleaning apparatus
MY159774A (en) Method for treatment of liquid waste of coating agent
WO2008139417A3 (en) Systems and methods for mixing fluids
CN206318755U (zh) 一种智能臭氧投放循环消毒系统
ATE541816T1 (de) Behälter sowie vorrichtung und verfahren zur herstellung einer desinfektionslösung
CN204981319U (zh) 一种曝气池射流吸气消泡装置
EP1864788A3 (en) Apparatus and method for manufacturing a glove containing electro-magnetically detectable particles
TWI576149B (zh) 氫水機
CN201844155U (zh) 一种管道加药装置
EP2223740A3 (en) Chemical apparatus
KR101099752B1 (ko) 포화액 생성기 및 이를 이용한 포화액 제조장치
JP5878300B2 (ja) 水素水供給装置
CN204607598U (zh) 一种药品均匀器
KR20140044337A (ko) 액 중의 수생생물 멸살방법, 밸러스트수 중의 수생생물 멸살방법 및 장치