TW200802575A - Substrate cleaning method and substrate cleaning apparatus - Google Patents

Substrate cleaning method and substrate cleaning apparatus

Info

Publication number
TW200802575A
TW200802575A TW096109476A TW96109476A TW200802575A TW 200802575 A TW200802575 A TW 200802575A TW 096109476 A TW096109476 A TW 096109476A TW 96109476 A TW96109476 A TW 96109476A TW 200802575 A TW200802575 A TW 200802575A
Authority
TW
Taiwan
Prior art keywords
substrate cleaning
ozone
substrate
ozone water
cleaning
Prior art date
Application number
TW096109476A
Other languages
Chinese (zh)
Inventor
Eiji Matsumura
Nobuko Hagiwara
Original Assignee
Eiji Matsumura
Nobuko Hagiwara
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eiji Matsumura, Nobuko Hagiwara filed Critical Eiji Matsumura
Publication of TW200802575A publication Critical patent/TW200802575A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/72—Treatment of water, waste water, or sewage by oxidation
    • C02F1/78—Treatment of water, waste water, or sewage by oxidation with ozone
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)

Abstract

To provide a substrate cleaning method wherein substrate is not adversely affected. A substrate cleaning method is provided for cleaning a substrate by using ozone water produced by a gas-liquid mixing method without using additives. The method is characterized in that the diameter R of ozone bubbles contained in the ozone water is 0 < R ≤ 50nm. Since the diameter of the ozone bubble is within such range, buoyancy is not easily given from the ozone water. As a result, the ozone bubbles are prevented from moving up, and the ozone water is not easily degassed. Thus, sufficient cleaning effects are obtained by having the ozone water not easily degassed.
TW096109476A 2006-03-20 2007-03-20 Substrate cleaning method and substrate cleaning apparatus TW200802575A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006077184 2006-03-20
JP2006316253 2006-11-22

Publications (1)

Publication Number Publication Date
TW200802575A true TW200802575A (en) 2008-01-01

Family

ID=38522509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109476A TW200802575A (en) 2006-03-20 2007-03-20 Substrate cleaning method and substrate cleaning apparatus

Country Status (3)

Country Link
JP (2) JP2008153605A (en)
TW (1) TW200802575A (en)
WO (1) WO2007108481A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580485B (en) * 2013-11-13 2017-05-01 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning system and memory media
CN108452593A (en) * 2018-03-05 2018-08-28 武汉科技大学 A kind of high-efficiency low-resistance fluidisation demister arrangements and its defogging method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8403305B2 (en) 2006-08-21 2013-03-26 Eiji Matsumura Gas/liquid mixing device
WO2009099138A1 (en) * 2008-02-07 2009-08-13 National Institute Of Advanced Industrial Science And Technology Method for cleaning semiconductor wafer and device for cleaning semiconductor wafer
JP2010153475A (en) * 2008-12-24 2010-07-08 Sokudo Co Ltd Substrate treatment apparatus and substrate treatment method
JP6168271B2 (en) 2012-08-08 2017-07-26 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP6062712B2 (en) * 2012-10-30 2017-01-18 三菱電機株式会社 Solar cell manufacturing method and solar cell manufacturing apparatus used therefor
US20170072408A1 (en) * 2014-03-14 2017-03-16 Pcs Co., Ltd. Ultrafine bubble cleaning method using ultrafine bubble-containing liquid, apparatus therefor, and dissolved air floatation apparatus
JP5936743B1 (en) * 2015-05-13 2016-06-22 株式会社日立製作所 Organic substance decomposition apparatus and organic substance decomposition method
JP7441620B2 (en) 2019-08-29 2024-03-01 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method
JP2022011581A (en) * 2020-06-30 2022-01-17 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing device and substrate processing method
CN112435938A (en) * 2020-11-11 2021-03-02 深圳市华星光电半导体显示技术有限公司 Substrate cleaning apparatus and substrate cleaning method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523682A (en) * 1990-12-27 1993-02-02 Shinji Kashiwabara Device for reforming water quality using ozone aqueous solution
JP3485215B2 (en) * 1995-05-29 2004-01-13 徹 工藤 Cleaning equipment
JP2000012500A (en) * 1998-04-20 2000-01-14 Dainippon Screen Mfg Co Ltd Method and system for processing substrate
JP2000000579A (en) * 1998-06-16 2000-01-07 Ishimori Seisakusho:Kk Ozone water making apparatus
JP2001269631A (en) * 2000-03-27 2001-10-02 Dainippon Screen Mfg Co Ltd Substrate cleaning device
JP2001351893A (en) * 2000-06-05 2001-12-21 Sumitomo Precision Prod Co Ltd Method for treating substrate
JP4560966B2 (en) * 2001-01-31 2010-10-13 栗田工業株式会社 Cleaning method for electronic materials
JP2003086560A (en) * 2001-09-12 2003-03-20 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus
JP2003142445A (en) * 2001-11-08 2003-05-16 Mitsubishi Electric Corp Washing apparatus and method therefor
JP2004121962A (en) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology Method and apparatus for using nanometer-bubble
JP2004241726A (en) * 2003-02-07 2004-08-26 Sharp Corp Method and device for treating resist
JP4194522B2 (en) * 2004-04-19 2008-12-10 協和工業株式会社 Gas-liquid mixed bubble generator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580485B (en) * 2013-11-13 2017-05-01 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning system and memory media
US10043652B2 (en) 2013-11-13 2018-08-07 Tokyo Electron Limited Substrate cleaning method, substrate cleaning system, and memory medium
CN108452593A (en) * 2018-03-05 2018-08-28 武汉科技大学 A kind of high-efficiency low-resistance fluidisation demister arrangements and its defogging method
CN108452593B (en) * 2018-03-05 2023-11-17 国网浙江省电力有限公司台州供电公司 Low-resistance high-efficiency fluidization demister device and demisting method thereof

Also Published As

Publication number Publication date
WO2007108481A1 (en) 2007-09-27
JP2011066389A (en) 2011-03-31
JP2008153605A (en) 2008-07-03

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