SG118156A1 - Photosensitive resin composition and printed wiring board - Google Patents

Photosensitive resin composition and printed wiring board

Info

Publication number
SG118156A1
SG118156A1 SG200205511A SG200205511A SG118156A1 SG 118156 A1 SG118156 A1 SG 118156A1 SG 200205511 A SG200205511 A SG 200205511A SG 200205511 A SG200205511 A SG 200205511A SG 118156 A1 SG118156 A1 SG 118156A1
Authority
SG
Singapore
Prior art keywords
resin composition
wiring board
printed wiring
photosensitive resin
photosensitive
Prior art date
Application number
SG200205511A
Other languages
English (en)
Inventor
Ono Takao
Miura Ichiro
Hasegawa Yasuyuki
Original Assignee
Tamura Kaken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Kaken Corp filed Critical Tamura Kaken Corp
Publication of SG118156A1 publication Critical patent/SG118156A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
SG200205511A 2001-09-21 2002-09-13 Photosensitive resin composition and printed wiring board SG118156A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001288838A JP3673967B2 (ja) 2001-09-21 2001-09-21 感光性樹脂組成物及びプリント配線板

Publications (1)

Publication Number Publication Date
SG118156A1 true SG118156A1 (en) 2006-01-27

Family

ID=19111414

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200205511A SG118156A1 (en) 2001-09-21 2002-09-13 Photosensitive resin composition and printed wiring board

Country Status (7)

Country Link
US (1) US20030064304A1 (ko)
EP (1) EP1296189A3 (ko)
JP (1) JP3673967B2 (ko)
KR (1) KR20030025884A (ko)
CN (1) CN1237401C (ko)
SG (1) SG118156A1 (ko)
TW (1) TW584783B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554170B2 (ja) * 2003-06-03 2010-09-29 株式会社タムラ製作所 紫外線硬化型アルカリ可溶性樹脂、ソルダーレジスト膜用紫外性硬化型樹脂およびプリント配線板
KR101295491B1 (ko) * 2006-08-25 2013-08-09 주식회사 엘지화학 알칼리 가용성 수지 및 이를 포함하는 감광성 수지 조성물
TWI316381B (en) * 2007-01-24 2009-10-21 Phoenix Prec Technology Corp Circuit board and fabrication method thereof
KR100942369B1 (ko) * 2007-04-12 2010-02-12 주식회사 엘지화학 경화성 수지 제조용 조성물, 이에 의해 제조된 경화성수지, 및 이를 포함하는 잉크 조성물
CN102138104B (zh) * 2008-09-04 2013-01-23 日立化成工业株式会社 半导体封装用印刷电路板的保护膜用感光性树脂组合物
KR101361753B1 (ko) * 2010-03-22 2014-02-12 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
CN102093809B (zh) * 2010-12-09 2013-11-13 浙江荣泰科技企业有限公司 一种光敏浸渍树脂
TWI554567B (zh) 2014-11-18 2016-10-21 Chi Mei Corp Alkali soluble resin and its photosensitive resin composition and its application
JP7213675B2 (ja) * 2018-12-21 2023-01-27 東京応化工業株式会社 ネガ型感光性樹脂組成物、感光性レジストフィルム、パターン形成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009982A (en) * 1985-04-19 1991-04-23 Taiyo Ink Manufacturing Co., Ltd. Resist ink composition
JPH09160239A (ja) * 1995-12-05 1997-06-20 Asahi Chem Res Lab Ltd ソルダーレジスト樹脂組成物
JPH1124254A (ja) * 1997-07-01 1999-01-29 Tamura Kaken Kk 感光性樹脂組成物
EP1037111A1 (en) * 1999-03-17 2000-09-20 Goo Chemical Co., Ltd. Ultraviolet curable resin composition and photo solder resist ink using the same
JP2000267275A (ja) * 1999-03-15 2000-09-29 Tamura Kaken Co Ltd 感光性樹脂組成物及びプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025348A (en) * 1974-05-10 1977-05-24 Hitachi Chemical Company, Ltd. Photosensitive resin compositions
JP4060962B2 (ja) * 1998-02-25 2008-03-12 互応化学工業株式会社 アルカリ現像型フォトソルダーレジストインク

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009982A (en) * 1985-04-19 1991-04-23 Taiyo Ink Manufacturing Co., Ltd. Resist ink composition
US5009982B1 (en) * 1985-04-19 1994-03-15 Taiyo Ink Manufacturing Co.,Ltd. Resist ink composition
JPH09160239A (ja) * 1995-12-05 1997-06-20 Asahi Chem Res Lab Ltd ソルダーレジスト樹脂組成物
JPH1124254A (ja) * 1997-07-01 1999-01-29 Tamura Kaken Kk 感光性樹脂組成物
JP2000267275A (ja) * 1999-03-15 2000-09-29 Tamura Kaken Co Ltd 感光性樹脂組成物及びプリント配線板
EP1037111A1 (en) * 1999-03-17 2000-09-20 Goo Chemical Co., Ltd. Ultraviolet curable resin composition and photo solder resist ink using the same

Also Published As

Publication number Publication date
EP1296189A3 (en) 2004-10-27
EP1296189A2 (en) 2003-03-26
JP2003098666A (ja) 2003-04-04
US20030064304A1 (en) 2003-04-03
CN1409172A (zh) 2003-04-09
CN1237401C (zh) 2006-01-18
KR20030025884A (ko) 2003-03-29
JP3673967B2 (ja) 2005-07-20
TW584783B (en) 2004-04-21

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