HK1041154B - 印刷布線板 - Google Patents

印刷布線板

Info

Publication number
HK1041154B
HK1041154B HK02102759.5A HK02102759A HK1041154B HK 1041154 B HK1041154 B HK 1041154B HK 02102759 A HK02102759 A HK 02102759A HK 1041154 B HK1041154 B HK 1041154B
Authority
HK
Hong Kong
Prior art keywords
wiring board
printed wiring
printed
board
wiring
Prior art date
Application number
HK02102759.5A
Other languages
English (en)
Other versions
HK1041154A1 (en
Inventor
Mori Shigeru
Original Assignee
日本電氣株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電氣株式會社 filed Critical 日本電氣株式會社
Publication of HK1041154A1 publication Critical patent/HK1041154A1/xx
Publication of HK1041154B publication Critical patent/HK1041154B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK02102759.5A 2000-03-23 2002-04-11 印刷布線板 HK1041154B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000083006A JP2001274556A (ja) 2000-03-23 2000-03-23 プリント配線板

Publications (2)

Publication Number Publication Date
HK1041154A1 HK1041154A1 (en) 2002-06-28
HK1041154B true HK1041154B (zh) 2005-08-05

Family

ID=18599731

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102759.5A HK1041154B (zh) 2000-03-23 2002-04-11 印刷布線板

Country Status (5)

Country Link
US (1) US6703564B2 (zh)
JP (1) JP2001274556A (zh)
CN (1) CN1180665C (zh)
GB (1) GB2363257B (zh)
HK (1) HK1041154B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040175582A1 (en) * 2002-12-05 2004-09-09 Olin Corporation, A Corporation Of The Commonwealth Of Virginia Laser ablation resistant copper foil
US20040129453A1 (en) * 2003-01-07 2004-07-08 Boggs David W. Electronic substrate with direct inner layer component interconnection
TWI284967B (en) * 2003-03-20 2007-08-01 Endicott Interconnect Tech Inc Electronic package with strengthened conductive pad
JP2004356569A (ja) 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
US20050016762A1 (en) * 2003-07-22 2005-01-27 Unitech Printed Circuit Board Corp. Method of forming a multi-layer printed circuit board and the product thereof
US7064963B2 (en) * 2004-04-01 2006-06-20 Delphi Technologies, Inc. Multi-substrate circuit assembly
JP2005340270A (ja) * 2004-05-24 2005-12-08 Matsushita Electric Works Ltd 積層板用プリプレグ、積層板並びにそれを用いたフレキシブルプリント配線板及びフレックスリジッドプリント配線板
JP2005340687A (ja) * 2004-05-31 2005-12-08 Fujitsu Ltd 積層基板及びその製造方法、かかる積層基板を有する電子機器
JP2006019636A (ja) * 2004-07-05 2006-01-19 Renesas Technology Corp 半導体装置
JP4534062B2 (ja) 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
JP4072176B2 (ja) * 2005-08-29 2008-04-09 新光電気工業株式会社 多層配線基板の製造方法
KR100834442B1 (ko) * 2007-01-16 2008-06-04 삼성전자주식회사 증가된 결합 신뢰성을 갖는 반도체 모듈들
US8440916B2 (en) * 2007-06-28 2013-05-14 Intel Corporation Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
JP2009016818A (ja) * 2007-07-04 2009-01-22 Samsung Electro-Mechanics Co Ltd 多層印刷回路基板及びその製造方法
US9049808B2 (en) 2010-08-21 2015-06-02 Ibiden Co., Ltd. Printed wiring board and a method of manufacturing a printed wiring board
JP2012079765A (ja) * 2010-09-30 2012-04-19 Fdk Corp 電子部品実装基板
JP6478309B2 (ja) * 2012-12-31 2019-03-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． 多層基板及び多層基板の製造方法
JP2015023251A (ja) * 2013-07-23 2015-02-02 ソニー株式会社 多層配線基板およびその製造方法、並びに半導体製品
US20150101846A1 (en) * 2013-10-14 2015-04-16 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US10849222B2 (en) * 2016-11-14 2020-11-24 Pioneer Circuits, Inc. High temperature resistant fabric and its use in flexible circuits
US10790241B2 (en) 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3335184A1 (de) 1983-09-28 1985-04-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbausteinen
EP0221531A3 (en) 1985-11-06 1992-02-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha High heat conductive insulated substrate and method of manufacturing the same
DE3889728T2 (de) 1988-03-21 1994-11-17 Hughes Aircraft Co Eine die thermische ausdehnungsungleichheit reduzierende gedruckte schaltungsplatte für einen keramischen drahtlosen chipträger.
JP2551249B2 (ja) 1991-03-20 1996-11-06 新神戸電機株式会社 コンポジット積層板
JP2956370B2 (ja) 1992-08-17 1999-10-04 日立化成工業株式会社 銅張積層板及びその製造方法
JPH0781002A (ja) 1993-09-20 1995-03-28 Hitachi Chem Co Ltd 積層板
JP2616565B2 (ja) * 1994-09-12 1997-06-04 日本電気株式会社 電子部品組立体
JP3695844B2 (ja) 1996-05-30 2005-09-14 松下電器産業株式会社 多層プリント配線基板の製造方法
JPH11330649A (ja) 1998-05-13 1999-11-30 Matsushita Electric Ind Co Ltd 回路形成用基板
US6299053B1 (en) 1998-08-19 2001-10-09 Kulicke & Soffa Holdings, Inc. Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
US6317331B1 (en) 1998-08-19 2001-11-13 Kulicke & Soffa Holdings, Inc. Wiring substrate with thermal insert

Also Published As

Publication number Publication date
GB0107253D0 (en) 2001-05-16
CN1180665C (zh) 2004-12-15
CN1317925A (zh) 2001-10-17
HK1041154A1 (en) 2002-06-28
GB2363257B (en) 2002-05-22
GB2363257A (en) 2001-12-12
JP2001274556A (ja) 2001-10-05
US6703564B2 (en) 2004-03-09
US20010023780A1 (en) 2001-09-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110323