DE3889728T2 - Eine die thermische ausdehnungsungleichheit reduzierende gedruckte schaltungsplatte für einen keramischen drahtlosen chipträger. - Google Patents

Eine die thermische ausdehnungsungleichheit reduzierende gedruckte schaltungsplatte für einen keramischen drahtlosen chipträger.

Info

Publication number
DE3889728T2
DE3889728T2 DE3889728T DE3889728T DE3889728T2 DE 3889728 T2 DE3889728 T2 DE 3889728T2 DE 3889728 T DE3889728 T DE 3889728T DE 3889728 T DE3889728 T DE 3889728T DE 3889728 T2 DE3889728 T2 DE 3889728T2
Authority
DE
Germany
Prior art keywords
printed circuit
thermal expansion
chip carrier
wireless chip
reducing thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3889728T
Other languages
English (en)
Other versions
DE3889728D1 (de
Inventor
Ching-Ping Lo
Kwang Yeh
Manual Valle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/171,047 external-priority patent/US4847136A/en
Priority claimed from US07/171,048 external-priority patent/US4847146A/en
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DE3889728D1 publication Critical patent/DE3889728D1/de
Publication of DE3889728T2 publication Critical patent/DE3889728T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
DE3889728T 1988-03-21 1988-12-16 Eine die thermische ausdehnungsungleichheit reduzierende gedruckte schaltungsplatte für einen keramischen drahtlosen chipträger. Expired - Fee Related DE3889728T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/171,047 US4847136A (en) 1988-03-21 1988-03-21 Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier
US07/171,048 US4847146A (en) 1988-03-21 1988-03-21 Process for fabricating compliant layer board with selectively isolated solder pads
PCT/US1988/004516 WO1989009534A1 (en) 1988-03-21 1988-12-16 Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier

Publications (2)

Publication Number Publication Date
DE3889728D1 DE3889728D1 (de) 1994-06-30
DE3889728T2 true DE3889728T2 (de) 1994-11-17

Family

ID=26866684

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3889728T Expired - Fee Related DE3889728T2 (de) 1988-03-21 1988-12-16 Eine die thermische ausdehnungsungleichheit reduzierende gedruckte schaltungsplatte für einen keramischen drahtlosen chipträger.

Country Status (7)

Country Link
EP (1) EP0364551B1 (de)
JP (1) JPH02504450A (de)
DE (1) DE3889728T2 (de)
DK (1) DK582089A (de)
ES (1) ES2010412A6 (de)
IL (1) IL88807A (de)
WO (1) WO1989009534A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4129514A1 (de) * 1991-09-05 1993-03-11 Telefunken Electronic Gmbh Gedruckte schaltung mit oberflaechenmontierter steckerleiste
DE59300824D1 (de) * 1992-12-23 1995-11-30 Rheinmetall Ind Gmbh Spannungsfeste Elektronik-Baugruppe.
ES2085231B1 (es) * 1993-12-27 1997-02-01 Arimany Jaime Serrat Util para la practica de un deporte de competicion.
US6299053B1 (en) * 1998-08-19 2001-10-09 Kulicke & Soffa Holdings, Inc. Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
JP2001274556A (ja) 2000-03-23 2001-10-05 Nec Corp プリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486755A1 (fr) * 1980-07-11 1982-01-15 Socapex Support de composants electroniques pour circuits hybrides de grandes dimensions
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte

Also Published As

Publication number Publication date
IL88807A (en) 1992-08-18
DK582089D0 (da) 1989-11-20
ES2010412A6 (es) 1989-11-01
IL88807A0 (en) 1989-07-31
EP0364551A1 (de) 1990-04-25
WO1989009534A1 (en) 1989-10-05
EP0364551B1 (de) 1994-05-25
DK582089A (da) 1990-01-09
JPH02504450A (ja) 1990-12-13
DE3889728D1 (de) 1994-06-30

Similar Documents

Publication Publication Date Title
DE68915072T2 (de) Integrierte Halbleiterschaltung für ein Radio.
DE68918156T2 (de) Flache Kühlungsstruktur für integrierte Schaltung.
DE58906492D1 (de) Halbleiterschaltung.
DE3676836D1 (de) Kuehlungsanordnung fuer integrierten schaltungschip.
DE68918442T2 (de) Flüssig gekühltes integriertes multichip-schaltungsmodul.
DE69013267T2 (de) Integrierte Halbleiterschaltungsanordnung.
DE69023565D1 (de) Integrierte Halbleiterschaltung.
DE68924811T2 (de) Taktversorgungsschaltung.
DE69012194D1 (de) Integrierter Halbleiterschaltkreis.
DE68921088T2 (de) Integrierte Halbleiterschaltung.
EP0631311A3 (de) Keramischer Chip-Träger mit Kontaktstiften.
DE69011038D1 (de) Integrierte Halbleiterschaltung.
DE68911774D1 (de) Keramik-Halbleiter.
GB2264827B (en) Oscillator circuit die on ceramic substrate
DE69009218D1 (de) Speiseschaltung.
DE68921620D1 (de) Monolithischer, elektronischer ballast.
DE3889728D1 (de) Eine die thermische ausdehnungsungleichheit reduzierende gedruckte schaltungsplatte für einen keramischen drahtlosen chipträger.
DE68912794T2 (de) Integrierte Halbleiterschaltung.
DE68910445D1 (de) Integrierter Halbleiterschaltkreis.
DE3668107D1 (de) Bei hoher frequenz arbeitende transistorbasissteuerschaltung.
FI915386A0 (fi) Baerbar, personlig mottagnings- och displayanordning foer information oeverfoerd via radio, kombinerad med en klocka.
DE68923580T2 (de) Integrierte Halbleiterschaltungsanordnung.
DE68923073T2 (de) Steuerschaltung für eine PLL Schaltung.
DE69014021D1 (de) Vorspannungsversorgungsschaltung.
DE68921148D1 (de) Gehäuse für integrierte Schaltung hoher Dichte.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee