SG114523A1 - Polishing composition and polishing method employing it - Google Patents

Polishing composition and polishing method employing it

Info

Publication number
SG114523A1
SG114523A1 SG200200485A SG200200485A SG114523A1 SG 114523 A1 SG114523 A1 SG 114523A1 SG 200200485 A SG200200485 A SG 200200485A SG 200200485 A SG200200485 A SG 200200485A SG 114523 A1 SG114523 A1 SG 114523A1
Authority
SG
Singapore
Prior art keywords
polishing
method employing
composition
polishing composition
polishing method
Prior art date
Application number
SG200200485A
Other languages
English (en)
Inventor
Kawase Akihiro
Okamura Masao
Inoue Yutaka
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18891966&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG114523(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG114523A1 publication Critical patent/SG114523A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
SG200200485A 2001-02-02 2002-01-24 Polishing composition and polishing method employing it SG114523A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001027276A JP3440419B2 (ja) 2001-02-02 2001-02-02 研磨用組成物およびそれを用いた研磨方法

Publications (1)

Publication Number Publication Date
SG114523A1 true SG114523A1 (en) 2005-09-28

Family

ID=18891966

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200485A SG114523A1 (en) 2001-02-02 2002-01-24 Polishing composition and polishing method employing it

Country Status (8)

Country Link
US (1) US6852009B2 (de)
EP (1) EP1229094B1 (de)
JP (1) JP3440419B2 (de)
CN (1) CN1266243C (de)
DE (1) DE60225956T2 (de)
MY (1) MY129070A (de)
SG (1) SG114523A1 (de)
TW (1) TWI245335B (de)

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JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
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JP2005347737A (ja) * 2004-05-07 2005-12-15 Nissan Chem Ind Ltd シリコンウェハー用研磨組成物
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JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US8350466B2 (en) 2004-09-17 2013-01-08 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
US7753751B2 (en) 2004-09-29 2010-07-13 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating the display device
US8772783B2 (en) * 2004-10-14 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Display device
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JP4808394B2 (ja) * 2004-10-29 2011-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP4487753B2 (ja) * 2004-12-10 2010-06-23 株式会社Ｓｕｍｃｏ シリコンウェーハ用のアルカリエッチング液及び該エッチング液を用いたエッチング方法
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US7351662B2 (en) * 2005-01-07 2008-04-01 Dupont Air Products Nanomaterials Llc Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
KR100662546B1 (ko) * 2005-03-07 2006-12-28 제일모직주식회사 실리콘 웨이퍼의 표면 품질을 개선하는 연마용 슬러리 조성물 및 이를 이용한 연마방법
US7452481B2 (en) 2005-05-16 2008-11-18 Kabushiki Kaisha Kobe Seiko Sho Polishing slurry and method of reclaiming wafers
US20090127501A1 (en) * 2005-05-27 2009-05-21 Nissan Chemical Industries, Ltd. Polishing Composition for Silicon Wafer
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
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JP2007214205A (ja) * 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
JP4582798B2 (ja) * 2006-02-09 2010-11-17 ニチコン株式会社 電解コンデンサの駆動用電解液及びこれを用いた電解コンデンサ
JP4582797B2 (ja) * 2006-02-09 2010-11-17 ニチコン株式会社 電解コンデンサの駆動用電解液及びこれを用いた電解コンデンサ
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JP5335183B2 (ja) * 2006-08-24 2013-11-06 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
KR100839355B1 (ko) * 2006-11-28 2008-06-19 삼성전자주식회사 기판의 재생 방법
JP5148948B2 (ja) * 2007-08-23 2013-02-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨用スラリーのリサイクル方法
US8017524B2 (en) * 2008-05-23 2011-09-13 Cabot Microelectronics Corporation Stable, high rate silicon slurry
JP5474400B2 (ja) * 2008-07-03 2014-04-16 株式会社フジミインコーポレーテッド 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
JP5533664B2 (ja) * 2008-11-10 2014-06-25 旭硝子株式会社 研磨用組成物および半導体集積回路装置の製造方法
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
JP5551042B2 (ja) * 2010-09-30 2014-07-16 株式会社クラレ 化学的機械的研磨法およびそれに用いられるスラリー
US10407594B2 (en) 2011-03-22 2019-09-10 Basf Se Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine
JP2011181948A (ja) * 2011-04-25 2011-09-15 Fujimi Inc 研磨用組成物及びそれを用いた研磨パッドの目詰まり低減方法
WO2014058570A1 (en) 2012-09-17 2014-04-17 Alltech Associates, Inc. Chromatography media and devices
PL2811983T3 (pl) 2012-09-17 2019-10-31 Grace W R & Co Funkcjonalizowany, złożony z cząstek materiał nośnikowy i sposoby jego wytwarzania i zastosowania
ES2887110T3 (es) 2014-01-16 2021-12-21 Grace W R & Co Medios para cromatografía de afinidad y dispositivos para cromatografía
CN107847907A (zh) 2014-05-02 2018-03-27 格雷斯公司 官能化载体材料以及制备和使用官能化载体材料的方法
WO2016132676A1 (ja) * 2015-02-19 2016-08-25 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物および研磨方法
EP3302784B1 (de) 2015-06-05 2021-10-06 W.R. Grace & Co.-Conn. Adsorbierende klärmittel für bioprozesstechnik und verfahren zur herstellung und verwendung davon
US10683439B2 (en) 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
EP3894496A1 (de) 2018-12-12 2021-10-20 Basf Se Chemisch-mechanisches polieren von kupfer- und rutheniumhaltigen substraten
CN113195656A (zh) 2018-12-12 2021-07-30 巴斯夫欧洲公司 含有铜和钌的基材的化学机械抛光
KR20210102947A (ko) 2018-12-12 2021-08-20 바스프 에스이 구리 및 루테늄을 함유하는 기판의 화학적 기계적 폴리싱
JPWO2023032714A1 (de) * 2021-09-01 2023-03-09

Citations (7)

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Publication number Priority date Publication date Assignee Title
EP0401147B1 (de) * 1989-03-07 1995-12-20 International Business Machines Corporation Verfahren zum chemisch-mechanischen Polieren eines Halbleitersubstrats einer elektronischen Komponente und Polierzusammensetzung für dieses Verfahren
US5916819A (en) * 1996-07-17 1999-06-29 Micron Technology, Inc. Planarization fluid composition chelating agents and planarization method using same
WO1999032570A1 (en) * 1997-12-23 1999-07-01 Akzo Nobel N.V. A composition for chemical mechanical polishing
GB2341190A (en) * 1998-09-01 2000-03-08 Fujimi Inc A polishing composition for polishing a memory hard disk
WO2000024842A1 (en) * 1998-10-23 2000-05-04 Arch Specialty Chemicals, Inc. A chemical mechanical polishing slurry system having an activator solution
EP1006166A1 (de) * 1998-12-01 2000-06-07 Fujimi Incorporated Schleifmittelzusammensetzung und dieses gebrauchendes Polierverfahren
GB2354526A (en) * 1999-09-27 2001-03-28 Fujimi America Inc Polishing compositions for magnetic disks

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Publication number Priority date Publication date Assignee Title
EP0401147B1 (de) * 1989-03-07 1995-12-20 International Business Machines Corporation Verfahren zum chemisch-mechanischen Polieren eines Halbleitersubstrats einer elektronischen Komponente und Polierzusammensetzung für dieses Verfahren
US5916819A (en) * 1996-07-17 1999-06-29 Micron Technology, Inc. Planarization fluid composition chelating agents and planarization method using same
WO1999032570A1 (en) * 1997-12-23 1999-07-01 Akzo Nobel N.V. A composition for chemical mechanical polishing
GB2341190A (en) * 1998-09-01 2000-03-08 Fujimi Inc A polishing composition for polishing a memory hard disk
WO2000024842A1 (en) * 1998-10-23 2000-05-04 Arch Specialty Chemicals, Inc. A chemical mechanical polishing slurry system having an activator solution
EP1006166A1 (de) * 1998-12-01 2000-06-07 Fujimi Incorporated Schleifmittelzusammensetzung und dieses gebrauchendes Polierverfahren
GB2354526A (en) * 1999-09-27 2001-03-28 Fujimi America Inc Polishing compositions for magnetic disks

Also Published As

Publication number Publication date
EP1229094A2 (de) 2002-08-07
JP2002226836A (ja) 2002-08-14
US6852009B2 (en) 2005-02-08
TWI245335B (en) 2005-12-11
DE60225956D1 (de) 2008-05-21
CN1266243C (zh) 2006-07-26
JP3440419B2 (ja) 2003-08-25
DE60225956T2 (de) 2009-05-20
MY129070A (en) 2007-03-30
US20020151252A1 (en) 2002-10-17
EP1229094B1 (de) 2008-04-09
EP1229094A3 (de) 2003-10-22
CN1369534A (zh) 2002-09-18

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