JPWO2023032714A1 - - Google Patents
Info
- Publication number
- JPWO2023032714A1 JPWO2023032714A1 JP2023545450A JP2023545450A JPWO2023032714A1 JP WO2023032714 A1 JPWO2023032714 A1 JP WO2023032714A1 JP 2023545450 A JP2023545450 A JP 2023545450A JP 2023545450 A JP2023545450 A JP 2023545450A JP WO2023032714 A1 JPWO2023032714 A1 JP WO2023032714A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021142155 | 2021-09-01 | ||
PCT/JP2022/031389 WO2023032714A1 (ja) | 2021-09-01 | 2022-08-19 | 研磨用組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023032714A1 true JPWO2023032714A1 (de) | 2023-03-09 |
JPWO2023032714A5 JPWO2023032714A5 (de) | 2024-05-23 |
Family
ID=85412264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023545450A Pending JPWO2023032714A1 (de) | 2021-09-01 | 2022-08-19 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023032714A1 (de) |
TW (1) | TW202328393A (de) |
WO (1) | WO2023032714A1 (de) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3440419B2 (ja) * | 2001-02-02 | 2003-08-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
JPWO2005090511A1 (ja) * | 2004-03-19 | 2008-01-31 | ▲吉▼田 和昭 | 研磨用組成物および研磨方法 |
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2022
- 2022-08-19 WO PCT/JP2022/031389 patent/WO2023032714A1/ja active Application Filing
- 2022-08-19 JP JP2023545450A patent/JPWO2023032714A1/ja active Pending
- 2022-08-30 TW TW111132713A patent/TW202328393A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202328393A (zh) | 2023-07-16 |
WO2023032714A1 (ja) | 2023-03-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240227 |