SG11202011801TA - Ultrasonic joining apparatus - Google Patents

Ultrasonic joining apparatus

Info

Publication number
SG11202011801TA
SG11202011801TA SG11202011801TA SG11202011801TA SG11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA
Authority
SG
Singapore
Prior art keywords
joining apparatus
ultrasonic joining
ultrasonic
joining
Prior art date
Application number
SG11202011801TA
Other languages
English (en)
Inventor
Jun MITSUYUKI
Original Assignee
Link Us Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Link Us Co Ltd filed Critical Link Us Co Ltd
Publication of SG11202011801TA publication Critical patent/SG11202011801TA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106Features related to sonotrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
SG11202011801TA 2018-11-20 2019-11-06 Ultrasonic joining apparatus SG11202011801TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018217546 2018-11-20
PCT/JP2019/043483 WO2020105434A1 (fr) 2018-11-20 2019-11-06 Appareil d'assemblage par ultrasons

Publications (1)

Publication Number Publication Date
SG11202011801TA true SG11202011801TA (en) 2020-12-30

Family

ID=70773303

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202011801TA SG11202011801TA (en) 2018-11-20 2019-11-06 Ultrasonic joining apparatus

Country Status (5)

Country Link
US (1) US11440131B2 (fr)
JP (1) JP7082434B2 (fr)
CN (1) CN112203794B (fr)
SG (1) SG11202011801TA (fr)
WO (1) WO2020105434A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411257B1 (ko) * 2019-03-18 2022-06-22 가부시키가이샤 신가와 캐필러리 안내 장치 및 와이어 본딩 장치
KR102462374B1 (ko) * 2020-11-25 2022-11-01 한국항공우주연구원 초음파 기기용 혼 및 이를 이용한 공진주파수 보정 방법
US20240116126A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies
CN115464288A (zh) * 2022-10-13 2022-12-13 长沙学院 一种基于异质金属的电阻热辅助复合焊接系统

Family Cites Families (38)

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JPH02192138A (ja) * 1989-01-19 1990-07-27 Mitsubishi Electric Corp 半導体装置の製造装置
JPH05235116A (ja) * 1992-02-26 1993-09-10 Hitachi Ltd ワイヤボンダの超音波ホーン
JP3151691B2 (ja) * 1992-11-24 2001-04-03 株式会社新川 超音波ホーンのキヤピラリ保持構造
US5277355A (en) * 1992-11-25 1994-01-11 Kulicke And Soffa Investments, Inc. Self-aligning fine wire clamp
JP3172901B2 (ja) * 1993-11-30 2001-06-04 株式会社新川 ボンデイング装置
JPH08294673A (ja) 1995-04-27 1996-11-12 Jiromaru Tsujino 複合振動変換用超音波ホーン
JP3455344B2 (ja) 1995-10-20 2003-10-14 株式会社オートネットワーク技術研究所 超音波溶接装置
JP3099942B2 (ja) * 1996-08-08 2000-10-16 株式会社アルテクス 超音波振動接合用共振器
JPH10323620A (ja) * 1997-05-26 1998-12-08 Mitsubishi Electric Corp 超音波振動装置
JP3400323B2 (ja) * 1997-10-13 2003-04-28 株式会社新川 超音波ホーンのキャピラリ保持構造
US6073827A (en) * 1998-08-27 2000-06-13 Kulicke & Soffa Investments, Inc. Wire bonding capillary with a conical surface
JP3802284B2 (ja) * 1999-07-05 2006-07-26 株式会社新川 ワイヤボンディング装置
US6766936B2 (en) * 2001-09-07 2004-07-27 Kabushiki Kaisha Shinkawa Transducer and a bonding apparatus using the same
US20030062395A1 (en) * 2001-10-01 2003-04-03 Li Hing Leung Ultrasonic transducer
JP3788351B2 (ja) * 2002-01-21 2006-06-21 松下電器産業株式会社 電子部品のボンディング装置および電子部品のボンディングツール
EP1375048B1 (fr) * 2002-06-18 2008-05-21 F&K Delvotec Bondtechnik GmbH Appareil de microcablage par ultrason
JP3966217B2 (ja) * 2003-04-23 2007-08-29 松下電器産業株式会社 ボンディング装置およびボンディングツール
US7322507B2 (en) * 2005-01-17 2008-01-29 Amkor Technology, Inc. Transducer assembly, capillary and wire bonding method using the same
JP4792945B2 (ja) * 2005-01-28 2011-10-12 日産自動車株式会社 超音波接合装置および接合構造体
JP4657964B2 (ja) * 2005-10-07 2011-03-23 株式会社新川 超音波ホーン
JP2007319876A (ja) * 2006-05-30 2007-12-13 Toshiba Corp 超音波接合装置及び半導体装置の製造方法
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
US7997470B2 (en) * 2006-11-24 2011-08-16 Asm Technology Singapore Pte Ltd Flanged transducer having improved rigidity
JP4336732B1 (ja) * 2008-04-11 2009-09-30 Tdk株式会社 超音波実装装置
US8011559B2 (en) * 2009-11-09 2011-09-06 GM Global Technology Operations LLC Active material-augmented vibration welding system and method of use
CN101804575B (zh) * 2010-03-05 2013-05-01 清华大学 一种轨迹可调整的椭圆超声振动辅助切削装置
JP2012039032A (ja) 2010-08-11 2012-02-23 Fujitsu Ltd ワイヤボンディング装置用キャピラリ及び超音波トランスデューサ
JP5583179B2 (ja) * 2012-08-03 2014-09-03 株式会社カイジョー ボンディング装置
JP5930419B2 (ja) * 2014-03-14 2016-06-08 株式会社カイジョー ボンディング装置
JP5930423B2 (ja) * 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
JP6615094B2 (ja) * 2014-06-12 2019-12-04 株式会社エンビジョンAescジャパン 接合状態検査方法
JP5916814B2 (ja) * 2014-08-06 2016-05-11 株式会社カイジョー ボンディング方法及びボンディング装置
KR101935180B1 (ko) * 2014-08-25 2019-01-03 닛산 지도우샤 가부시키가이샤 초음파 접합 장치
CN204321507U (zh) * 2014-12-09 2015-05-13 苏州科技学院 一种单电信号激励超声椭圆振动挤压加工装置
DE102015214408C5 (de) * 2015-07-29 2020-01-09 Telsonic Holding Ag Sonotrode, Vorrichtung sowie Verfahren zur Herstellung einer Schweißverbindung
JP6397807B2 (ja) 2015-09-28 2018-09-26 辻野 次郎丸 超音波複合振動溶接方法
CN206934145U (zh) * 2016-10-25 2018-01-30 厚凯(天津)医疗科技有限公司 一种扭振式超声手术刀系统
DE112018006322T5 (de) * 2017-12-11 2020-08-27 Branson Ultrasonics Corporation Intelligenter Ultraschallstapel und Verfahren zum Steuern eines Ultraschallsystems, das einen intelligenten Ultraschallstapel aufweist

Also Published As

Publication number Publication date
CN112203794A (zh) 2021-01-08
US20210197308A1 (en) 2021-07-01
JPWO2020105434A1 (ja) 2021-09-30
US11440131B2 (en) 2022-09-13
WO2020105434A1 (fr) 2020-05-28
CN112203794B (zh) 2022-08-09
JP7082434B2 (ja) 2022-06-08

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