SG11202010259SA - Polishing apparatus having surface-property measuring device of polishing pad and polishing system - Google Patents

Polishing apparatus having surface-property measuring device of polishing pad and polishing system

Info

Publication number
SG11202010259SA
SG11202010259SA SG11202010259SA SG11202010259SA SG11202010259SA SG 11202010259S A SG11202010259S A SG 11202010259SA SG 11202010259S A SG11202010259S A SG 11202010259SA SG 11202010259S A SG11202010259S A SG 11202010259SA SG 11202010259S A SG11202010259S A SG 11202010259SA
Authority
SG
Singapore
Prior art keywords
polishing
measuring device
property measuring
pad
polishing pad
Prior art date
Application number
SG11202010259SA
Other languages
English (en)
Inventor
Keisuke Kamiki
Toru Maruyama
Yasuyuki Motoshima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority claimed from PCT/JP2019/017691 external-priority patent/WO2019208712A1/ja
Publication of SG11202010259SA publication Critical patent/SG11202010259SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11202010259SA 2018-04-26 2019-04-25 Polishing apparatus having surface-property measuring device of polishing pad and polishing system SG11202010259SA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018085143 2018-04-26
JP2019071994A JP7269074B2 (ja) 2018-04-26 2019-04-04 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム
PCT/JP2019/017691 WO2019208712A1 (ja) 2018-04-26 2019-04-25 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム

Publications (1)

Publication Number Publication Date
SG11202010259SA true SG11202010259SA (en) 2020-11-27

Family

ID=68469500

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010259SA SG11202010259SA (en) 2018-04-26 2019-04-25 Polishing apparatus having surface-property measuring device of polishing pad and polishing system

Country Status (6)

Country Link
US (1) US11958161B2 (enExample)
JP (1) JP7269074B2 (enExample)
KR (1) KR102699351B1 (enExample)
CN (1) CN112004640B (enExample)
SG (1) SG11202010259SA (enExample)
TW (1) TWI830730B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TWI856837B (zh) * 2019-03-21 2024-09-21 美商應用材料股份有限公司 監視化學機械拋光中的拋光墊紋理
TWI765192B (zh) 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7390945B2 (ja) * 2020-03-19 2023-12-04 株式会社荏原製作所 研磨装置、情報処理システム及びプログラム
JP2022112194A (ja) * 2021-01-21 2022-08-02 株式会社荏原製作所 研磨パッドの表面性状測定装置、研磨パッドの表面性状測定方法、および研磨パッドの表面性状判定方法
JP7726611B2 (ja) * 2021-03-04 2025-08-20 東京エレクトロン株式会社 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法
JP7345867B2 (ja) * 2021-04-08 2023-09-19 株式会社ナガセインテグレックス 砥面判定装置、学習器、判定プログラム、および砥面判定方法
US20240075580A1 (en) * 2022-04-26 2024-03-07 Ebara Corporation Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method
KR102851780B1 (ko) * 2022-09-20 2025-08-29 에프엔에스테크 주식회사 Cmp 패드 검사 자동화 장치
KR102612601B1 (ko) * 2022-10-17 2023-12-12 주식회사 서연테크 반도체 공정용 정밀 석정반의 제작 시스템
TWI877961B (zh) * 2023-12-20 2025-03-21 聯策科技股份有限公司 研磨墊檢測裝置、系統及方法

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JPH05312526A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd レーザー計測器
JP3006321B2 (ja) * 1992-11-17 2000-02-07 日産自動車株式会社 ウェット鮮映性測定装置
JP3106849B2 (ja) * 1994-05-19 2000-11-06 日産自動車株式会社 塗装面性状測定装置
JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
JP3600392B2 (ja) * 1997-01-16 2004-12-15 三菱重工業株式会社 管形状測定装置
JPH10296615A (ja) * 1997-04-25 1998-11-10 Okamoto Kosaku Kikai Seisakusho:Kk 研磨布特性検出装置およびシステム
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JP2001198794A (ja) 2000-01-21 2001-07-24 Ebara Corp 研磨装置
WO2001058644A1 (en) 2000-02-10 2001-08-16 Applied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
KR200337279Y1 (ko) 2003-08-26 2004-01-07 테이코쿠 덴소 가부시키가이샤 경질원반의 연마장치
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JP6465345B2 (ja) * 2014-12-26 2019-02-06 株式会社荏原製作所 研磨パッドの表面性状測定方法および装置
SG11201704877YA (en) 2015-01-07 2017-07-28 Ebara Corp Cmp apparatus having polishing pad surface property measuring device
JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
JP6487767B2 (ja) 2015-05-08 2019-03-20 株式会社ディスコ 乾式研磨装置
KR101657993B1 (ko) 2015-07-14 2016-09-20 지앤피테크놀로지 주식회사 인쇄회로기판 등 판상가공물 연마용 화학기계적 연마장치
JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法

Also Published As

Publication number Publication date
CN112004640B (zh) 2023-01-31
CN112004640A (zh) 2020-11-27
KR102699351B1 (ko) 2024-08-30
TW201946143A (zh) 2019-12-01
KR20210002580A (ko) 2021-01-08
JP7269074B2 (ja) 2023-05-08
US11958161B2 (en) 2024-04-16
US20210370461A1 (en) 2021-12-02
JP2019193970A (ja) 2019-11-07
TWI830730B (zh) 2024-02-01

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