JP7269074B2 - 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム - Google Patents

研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム Download PDF

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Publication number
JP7269074B2
JP7269074B2 JP2019071994A JP2019071994A JP7269074B2 JP 7269074 B2 JP7269074 B2 JP 7269074B2 JP 2019071994 A JP2019071994 A JP 2019071994A JP 2019071994 A JP2019071994 A JP 2019071994A JP 7269074 B2 JP7269074 B2 JP 7269074B2
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Japan
Prior art keywords
surface texture
polishing
polishing pad
measuring device
dressing
Prior art date
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JP2019071994A
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English (en)
Japanese (ja)
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JP2019193970A5 (enExample
JP2019193970A (ja
Inventor
啓佑 神木
徹 丸山
靖之 本島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to PCT/JP2019/017691 priority Critical patent/WO2019208712A1/ja
Priority to CN201980026985.6A priority patent/CN112004640B/zh
Priority to US17/048,674 priority patent/US11958161B2/en
Priority to SG11202010259SA priority patent/SG11202010259SA/en
Priority to KR1020207033357A priority patent/KR102699351B1/ko
Priority to TW108114613A priority patent/TWI830730B/zh
Publication of JP2019193970A publication Critical patent/JP2019193970A/ja
Publication of JP2019193970A5 publication Critical patent/JP2019193970A5/ja
Application granted granted Critical
Publication of JP7269074B2 publication Critical patent/JP7269074B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2019071994A 2018-04-26 2019-04-04 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム Active JP7269074B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201980026985.6A CN112004640B (zh) 2018-04-26 2019-04-25 具备研磨垫的表面性状测定装置的研磨装置及研磨系统
US17/048,674 US11958161B2 (en) 2018-04-26 2019-04-25 Polishing apparatus having surface-property measuring device of polishing pad and polishing system
SG11202010259SA SG11202010259SA (en) 2018-04-26 2019-04-25 Polishing apparatus having surface-property measuring device of polishing pad and polishing system
KR1020207033357A KR102699351B1 (ko) 2018-04-26 2019-04-25 연마 패드의 표면 성상 측정 장치를 구비한 연마 장치 및 연마 시스템
PCT/JP2019/017691 WO2019208712A1 (ja) 2018-04-26 2019-04-25 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム
TW108114613A TWI830730B (zh) 2018-04-26 2019-04-26 具備研磨墊之表面性狀測定裝置之研磨裝置及研磨系統

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018085143 2018-04-26
JP2018085143 2018-04-26

Publications (3)

Publication Number Publication Date
JP2019193970A JP2019193970A (ja) 2019-11-07
JP2019193970A5 JP2019193970A5 (enExample) 2021-12-02
JP7269074B2 true JP7269074B2 (ja) 2023-05-08

Family

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JP2019071994A Active JP7269074B2 (ja) 2018-04-26 2019-04-04 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム

Country Status (6)

Country Link
US (1) US11958161B2 (enExample)
JP (1) JP7269074B2 (enExample)
KR (1) KR102699351B1 (enExample)
CN (1) CN112004640B (enExample)
SG (1) SG11202010259SA (enExample)
TW (1) TWI830730B (enExample)

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JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TWI820308B (zh) * 2019-03-21 2023-11-01 美商應用材料股份有限公司 監視化學機械拋光中的拋光墊紋理
TWI765192B (zh) 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7390945B2 (ja) 2020-03-19 2023-12-04 株式会社荏原製作所 研磨装置、情報処理システム及びプログラム
JP2022112194A (ja) * 2021-01-21 2022-08-02 株式会社荏原製作所 研磨パッドの表面性状測定装置、研磨パッドの表面性状測定方法、および研磨パッドの表面性状判定方法
JP7726611B2 (ja) * 2021-03-04 2025-08-20 東京エレクトロン株式会社 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法
JP7345867B2 (ja) * 2021-04-08 2023-09-19 株式会社ナガセインテグレックス 砥面判定装置、学習器、判定プログラム、および砥面判定方法
KR20230151901A (ko) * 2022-04-26 2023-11-02 가부시키가이샤 에바라 세이사꾸쇼 표면 성상 측정 시스템, 표면 성상 측정 방법, 연마 장치 및 연마 방법
KR102851780B1 (ko) * 2022-09-20 2025-08-29 에프엔에스테크 주식회사 Cmp 패드 검사 자동화 장치
KR102612601B1 (ko) * 2022-10-17 2023-12-12 주식회사 서연테크 반도체 공정용 정밀 석정반의 제작 시스템
TWI877961B (zh) * 2023-12-20 2025-03-21 聯策科技股份有限公司 研磨墊檢測裝置、系統及方法

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JP2001198794A (ja) 2000-01-21 2001-07-24 Ebara Corp 研磨装置
JP2006263876A (ja) 2005-03-24 2006-10-05 Renesas Technology Corp 研磨装置、研磨方法および半導体装置の製造方法
JP2016209951A (ja) 2015-05-08 2016-12-15 株式会社ディスコ 乾式研磨装置

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JP3106849B2 (ja) * 1994-05-19 2000-11-06 日産自動車株式会社 塗装面性状測定装置
JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
JP3600392B2 (ja) * 1997-01-16 2004-12-15 三菱重工業株式会社 管形状測定装置
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JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
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JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法

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JP2001198794A (ja) 2000-01-21 2001-07-24 Ebara Corp 研磨装置
JP2006263876A (ja) 2005-03-24 2006-10-05 Renesas Technology Corp 研磨装置、研磨方法および半導体装置の製造方法
JP2016209951A (ja) 2015-05-08 2016-12-15 株式会社ディスコ 乾式研磨装置

Also Published As

Publication number Publication date
US20210370461A1 (en) 2021-12-02
TWI830730B (zh) 2024-02-01
US11958161B2 (en) 2024-04-16
CN112004640A (zh) 2020-11-27
KR20210002580A (ko) 2021-01-08
JP2019193970A (ja) 2019-11-07
SG11202010259SA (en) 2020-11-27
TW201946143A (zh) 2019-12-01
KR102699351B1 (ko) 2024-08-30
CN112004640B (zh) 2023-01-31

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