KR102699351B1 - 연마 패드의 표면 성상 측정 장치를 구비한 연마 장치 및 연마 시스템 - Google Patents

연마 패드의 표면 성상 측정 장치를 구비한 연마 장치 및 연마 시스템 Download PDF

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KR102699351B1
KR102699351B1 KR1020207033357A KR20207033357A KR102699351B1 KR 102699351 B1 KR102699351 B1 KR 102699351B1 KR 1020207033357 A KR1020207033357 A KR 1020207033357A KR 20207033357 A KR20207033357 A KR 20207033357A KR 102699351 B1 KR102699351 B1 KR 102699351B1
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South Korea
Prior art keywords
polishing
polishing pad
dressing
pad
measuring device
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Korean (ko)
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KR20210002580A (ko
Inventor
게이스케 가미키
도루 마루야마
야스유키 모토시마
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가부시키가이샤 에바라 세이사꾸쇼
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Priority claimed from PCT/JP2019/017691 external-priority patent/WO2019208712A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020207033357A 2018-04-26 2019-04-25 연마 패드의 표면 성상 측정 장치를 구비한 연마 장치 및 연마 시스템 Active KR102699351B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018085143 2018-04-26
JPJP-P-2018-085143 2018-04-26
JP2019071994A JP7269074B2 (ja) 2018-04-26 2019-04-04 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム
JPJP-P-2019-071994 2019-04-04
PCT/JP2019/017691 WO2019208712A1 (ja) 2018-04-26 2019-04-25 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム

Publications (2)

Publication Number Publication Date
KR20210002580A KR20210002580A (ko) 2021-01-08
KR102699351B1 true KR102699351B1 (ko) 2024-08-30

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KR1020207033357A Active KR102699351B1 (ko) 2018-04-26 2019-04-25 연마 패드의 표면 성상 측정 장치를 구비한 연마 장치 및 연마 시스템

Country Status (6)

Country Link
US (1) US11958161B2 (enExample)
JP (1) JP7269074B2 (enExample)
KR (1) KR102699351B1 (enExample)
CN (1) CN112004640B (enExample)
SG (1) SG11202010259SA (enExample)
TW (1) TWI830730B (enExample)

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* Cited by examiner, † Cited by third party
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JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TWI820308B (zh) * 2019-03-21 2023-11-01 美商應用材料股份有限公司 監視化學機械拋光中的拋光墊紋理
TWI765192B (zh) 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7390945B2 (ja) 2020-03-19 2023-12-04 株式会社荏原製作所 研磨装置、情報処理システム及びプログラム
JP2022112194A (ja) * 2021-01-21 2022-08-02 株式会社荏原製作所 研磨パッドの表面性状測定装置、研磨パッドの表面性状測定方法、および研磨パッドの表面性状判定方法
JP7726611B2 (ja) * 2021-03-04 2025-08-20 東京エレクトロン株式会社 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法
JP7345867B2 (ja) * 2021-04-08 2023-09-19 株式会社ナガセインテグレックス 砥面判定装置、学習器、判定プログラム、および砥面判定方法
KR20230151901A (ko) * 2022-04-26 2023-11-02 가부시키가이샤 에바라 세이사꾸쇼 표면 성상 측정 시스템, 표면 성상 측정 방법, 연마 장치 및 연마 방법
KR102851780B1 (ko) * 2022-09-20 2025-08-29 에프엔에스테크 주식회사 Cmp 패드 검사 자동화 장치
KR102612601B1 (ko) * 2022-10-17 2023-12-12 주식회사 서연테크 반도체 공정용 정밀 석정반의 제작 시스템
TWI877961B (zh) * 2023-12-20 2025-03-21 聯策科技股份有限公司 研磨墊檢測裝置、系統及方法

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JP2001198794A (ja) * 2000-01-21 2001-07-24 Ebara Corp 研磨装置
KR200337279Y1 (ko) 2003-08-26 2004-01-07 테이코쿠 덴소 가부시키가이샤 경질원반의 연마장치
US20160184960A1 (en) 2014-12-26 2016-06-30 Ebara Corporation Method and apparatus for measuring surface properties of polishing pad
KR101657993B1 (ko) 2015-07-14 2016-09-20 지앤피테크놀로지 주식회사 인쇄회로기판 등 판상가공물 연마용 화학기계적 연마장치

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WO2016111335A1 (ja) 2015-01-07 2016-07-14 株式会社 荏原製作所 研磨パッドの表面性状測定装置を備えたｃｍｐ装置
JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
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JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法

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JP2001198794A (ja) * 2000-01-21 2001-07-24 Ebara Corp 研磨装置
US20010012749A1 (en) 2000-01-21 2001-08-09 Shozo Oguri Polishing apparatus
KR200337279Y1 (ko) 2003-08-26 2004-01-07 테이코쿠 덴소 가부시키가이샤 경질원반의 연마장치
US20160184960A1 (en) 2014-12-26 2016-06-30 Ebara Corporation Method and apparatus for measuring surface properties of polishing pad
KR101657993B1 (ko) 2015-07-14 2016-09-20 지앤피테크놀로지 주식회사 인쇄회로기판 등 판상가공물 연마용 화학기계적 연마장치

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US20210370461A1 (en) 2021-12-02
TWI830730B (zh) 2024-02-01
US11958161B2 (en) 2024-04-16
CN112004640A (zh) 2020-11-27
KR20210002580A (ko) 2021-01-08
JP2019193970A (ja) 2019-11-07
SG11202010259SA (en) 2020-11-27
JP7269074B2 (ja) 2023-05-08
TW201946143A (zh) 2019-12-01
CN112004640B (zh) 2023-01-31

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