TWI830730B - 具備研磨墊之表面性狀測定裝置之研磨裝置及研磨系統 - Google Patents
具備研磨墊之表面性狀測定裝置之研磨裝置及研磨系統 Download PDFInfo
- Publication number
- TWI830730B TWI830730B TW108114613A TW108114613A TWI830730B TW I830730 B TWI830730 B TW I830730B TW 108114613 A TW108114613 A TW 108114613A TW 108114613 A TW108114613 A TW 108114613A TW I830730 B TWI830730 B TW I830730B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- polishing pad
- surface texture
- measuring device
- aforementioned
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 565
- 238000012545 processing Methods 0.000 claims description 99
- 230000007246 mechanism Effects 0.000 claims description 86
- 238000009966 trimming Methods 0.000 claims description 39
- 238000006073 displacement reaction Methods 0.000 claims description 22
- 238000012549 training Methods 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 16
- 230000008859 change Effects 0.000 claims description 15
- 230000003750 conditioning effect Effects 0.000 claims description 12
- 238000005259 measurement Methods 0.000 abstract description 61
- 239000000758 substrate Substances 0.000 abstract description 33
- 239000004065 semiconductor Substances 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 44
- 239000012530 fluid Substances 0.000 description 36
- 239000007789 gas Substances 0.000 description 36
- 238000003384 imaging method Methods 0.000 description 29
- 230000005856 abnormality Effects 0.000 description 21
- 239000007788 liquid Substances 0.000 description 20
- 238000009826 distribution Methods 0.000 description 18
- 230000006870 function Effects 0.000 description 15
- 238000013473 artificial intelligence Methods 0.000 description 14
- 238000004364 calculation method Methods 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 8
- 238000003745 diagnosis Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000013135 deep learning Methods 0.000 description 6
- 238000010801 machine learning Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 238000013528 artificial neural network Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 208000036829 Device dislocation Diseases 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018085143 | 2018-04-26 | ||
| JP2018-085143 | 2018-04-26 | ||
| JP2019071994A JP7269074B2 (ja) | 2018-04-26 | 2019-04-04 | 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム |
| JP2019-071994 | 2019-04-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201946143A TW201946143A (zh) | 2019-12-01 |
| TWI830730B true TWI830730B (zh) | 2024-02-01 |
Family
ID=68469500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108114613A TWI830730B (zh) | 2018-04-26 | 2019-04-26 | 具備研磨墊之表面性狀測定裝置之研磨裝置及研磨系統 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11958161B2 (enExample) |
| JP (1) | JP7269074B2 (enExample) |
| KR (1) | KR102699351B1 (enExample) |
| CN (1) | CN112004640B (enExample) |
| SG (1) | SG11202010259SA (enExample) |
| TW (1) | TWI830730B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7570004B2 (ja) * | 2019-02-19 | 2024-10-21 | パナソニックＩｐマネジメント株式会社 | 研磨加工システム、学習装置、学習装置の学習方法 |
| TWI820308B (zh) * | 2019-03-21 | 2023-11-01 | 美商應用材料股份有限公司 | 監視化學機械拋光中的拋光墊紋理 |
| TWI765192B (zh) | 2019-11-19 | 2022-05-21 | 大量科技股份有限公司 | 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置 |
| JP7390945B2 (ja) | 2020-03-19 | 2023-12-04 | 株式会社荏原製作所 | 研磨装置、情報処理システム及びプログラム |
| JP2022112194A (ja) * | 2021-01-21 | 2022-08-02 | 株式会社荏原製作所 | 研磨パッドの表面性状測定装置、研磨パッドの表面性状測定方法、および研磨パッドの表面性状判定方法 |
| JP7726611B2 (ja) * | 2021-03-04 | 2025-08-20 | 東京エレクトロン株式会社 | 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法 |
| JP7345867B2 (ja) * | 2021-04-08 | 2023-09-19 | 株式会社ナガセインテグレックス | 砥面判定装置、学習器、判定プログラム、および砥面判定方法 |
| KR20230151901A (ko) * | 2022-04-26 | 2023-11-02 | 가부시키가이샤 에바라 세이사꾸쇼 | 표면 성상 측정 시스템, 표면 성상 측정 방법, 연마 장치 및 연마 방법 |
| KR102851780B1 (ko) * | 2022-09-20 | 2025-08-29 | 에프엔에스테크 주식회사 | Cmp 패드 검사 자동화 장치 |
| KR102612601B1 (ko) * | 2022-10-17 | 2023-12-12 | 주식회사 서연테크 | 반도체 공정용 정밀 석정반의 제작 시스템 |
| TWI877961B (zh) * | 2023-12-20 | 2025-03-21 | 聯策科技股份有限公司 | 研磨墊檢測裝置、系統及方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05312526A (ja) * | 1992-05-12 | 1993-11-22 | Speedfam Co Ltd | レーザー計測器 |
| JPH10197219A (ja) * | 1997-01-16 | 1998-07-31 | Mitsubishi Heavy Ind Ltd | 管形状測定装置 |
| JPH10296615A (ja) * | 1997-04-25 | 1998-11-10 | Okamoto Kosaku Kikai Seisakusho:Kk | 研磨布特性検出装置およびシステム |
| JPH10315131A (ja) * | 1997-05-23 | 1998-12-02 | Hitachi Ltd | 半導体ウエハの研磨方法およびその装置 |
| JP2001198794A (ja) * | 2000-01-21 | 2001-07-24 | Ebara Corp | 研磨装置 |
| JP2006263876A (ja) * | 2005-03-24 | 2006-10-05 | Renesas Technology Corp | 研磨装置、研磨方法および半導体装置の製造方法 |
| JP2016209951A (ja) * | 2015-05-08 | 2016-12-15 | 株式会社ディスコ | 乾式研磨装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3006321B2 (ja) * | 1992-11-17 | 2000-02-07 | 日産自動車株式会社 | ウェット鮮映性測定装置 |
| JP3106849B2 (ja) * | 1994-05-19 | 2000-11-06 | 日産自動車株式会社 | 塗装面性状測定装置 |
| JPH08281550A (ja) * | 1995-04-14 | 1996-10-29 | Sony Corp | 研磨装置及びその補正方法 |
| WO2001058644A1 (en) | 2000-02-10 | 2001-08-16 | Applied Materials, Inc. | Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus |
| KR200337279Y1 (ko) * | 2003-08-26 | 2004-01-07 | 테이코쿠 덴소 가부시키가이샤 | 경질원반의 연마장치 |
| JP2007019434A (ja) | 2005-07-11 | 2007-01-25 | Disco Abrasive Syst Ltd | 研磨パッド形状修正装置および研磨装置 |
| CN201610885U (zh) | 2010-03-02 | 2010-10-20 | 叶春煌 | 一种定位销机构 |
| US20140273752A1 (en) | 2013-03-13 | 2014-09-18 | Applied Materials, Inc. | Pad conditioning process control using laser conditioning |
| CN104325283B (zh) * | 2014-10-27 | 2017-01-18 | 北京金风科创风电设备有限公司 | 螺栓紧固装置 |
| JP6465345B2 (ja) * | 2014-12-26 | 2019-02-06 | 株式会社荏原製作所 | 研磨パッドの表面性状測定方法および装置 |
| WO2016111335A1 (ja) | 2015-01-07 | 2016-07-14 | 株式会社 荏原製作所 | 研磨パッドの表面性状測定装置を備えたｃｍｐ装置 |
| JP6444785B2 (ja) * | 2015-03-19 | 2018-12-26 | 株式会社荏原製作所 | 研磨装置およびその制御方法ならびにドレッシング条件出力方法 |
| KR101657993B1 (ko) * | 2015-07-14 | 2016-09-20 | 지앤피테크놀로지 주식회사 | 인쇄회로기판 등 판상가공물 연마용 화학기계적 연마장치 |
| JP2017121672A (ja) * | 2016-01-05 | 2017-07-13 | 不二越機械工業株式会社 | ワーク研磨方法および研磨パッドのドレッシング方法 |
-
2019
- 2019-04-04 JP JP2019071994A patent/JP7269074B2/ja active Active
- 2019-04-25 SG SG11202010259SA patent/SG11202010259SA/en unknown
- 2019-04-25 KR KR1020207033357A patent/KR102699351B1/ko active Active
- 2019-04-25 US US17/048,674 patent/US11958161B2/en active Active
- 2019-04-25 CN CN201980026985.6A patent/CN112004640B/zh active Active
- 2019-04-26 TW TW108114613A patent/TWI830730B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05312526A (ja) * | 1992-05-12 | 1993-11-22 | Speedfam Co Ltd | レーザー計測器 |
| JPH10197219A (ja) * | 1997-01-16 | 1998-07-31 | Mitsubishi Heavy Ind Ltd | 管形状測定装置 |
| JPH10296615A (ja) * | 1997-04-25 | 1998-11-10 | Okamoto Kosaku Kikai Seisakusho:Kk | 研磨布特性検出装置およびシステム |
| JPH10315131A (ja) * | 1997-05-23 | 1998-12-02 | Hitachi Ltd | 半導体ウエハの研磨方法およびその装置 |
| JP2001198794A (ja) * | 2000-01-21 | 2001-07-24 | Ebara Corp | 研磨装置 |
| JP2006263876A (ja) * | 2005-03-24 | 2006-10-05 | Renesas Technology Corp | 研磨装置、研磨方法および半導体装置の製造方法 |
| JP2016209951A (ja) * | 2015-05-08 | 2016-12-15 | 株式会社ディスコ | 乾式研磨装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20210370461A1 (en) | 2021-12-02 |
| US11958161B2 (en) | 2024-04-16 |
| CN112004640A (zh) | 2020-11-27 |
| KR20210002580A (ko) | 2021-01-08 |
| JP2019193970A (ja) | 2019-11-07 |
| SG11202010259SA (en) | 2020-11-27 |
| JP7269074B2 (ja) | 2023-05-08 |
| TW201946143A (zh) | 2019-12-01 |
| KR102699351B1 (ko) | 2024-08-30 |
| CN112004640B (zh) | 2023-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI830730B (zh) | 具備研磨墊之表面性狀測定裝置之研磨裝置及研磨系統 | |
| TWI700474B (zh) | 研磨墊之表面性狀測定方法及裝置 | |
| US8932883B2 (en) | Method of measuring surface properties of polishing pad | |
| US10903101B2 (en) | Substrate processing apparatus and method for detecting abnormality of substrate | |
| US8679979B2 (en) | Using optical metrology for within wafer feed forward process control | |
| US10401285B2 (en) | Apparatus for measuring surface properties of polishing pad | |
| CN116872088A (zh) | 化学机械研磨机中的耗材部件监控 | |
| JP2019169608A (ja) | 研削装置 | |
| US20180015590A1 (en) | Cmp apparatus having polishing pad surface property measuring device | |
| US20240075579A1 (en) | Surface property measuring apparatus for polishing pad, surface property measuring method for polishing pad, and surface property judging method for polishing pad | |
| WO2019208712A1 (ja) | 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム | |
| US20240338812A1 (en) | Pad surface determining method and pad surface determining system | |
| US20240075580A1 (en) | Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method | |
| CN222779358U (zh) | 化学机械研磨设备中的钻石修整器的监控装置 | |
| JPH11204472A (ja) | 基板研磨装置用光学測定装置 | |
| WO2025234436A1 (ja) | パッド表面判定方法およびパッド表面判定システム | |
| CN116945032A (zh) | 表面性状测定系统、表面性状测定方法、研磨装置以及研磨方法 |