SG11201704877YA - Cmp apparatus having polishing pad surface property measuring device - Google Patents

Cmp apparatus having polishing pad surface property measuring device

Info

Publication number
SG11201704877YA
SG11201704877YA SG11201704877YA SG11201704877YA SG11201704877YA SG 11201704877Y A SG11201704877Y A SG 11201704877YA SG 11201704877Y A SG11201704877Y A SG 11201704877YA SG 11201704877Y A SG11201704877Y A SG 11201704877YA SG 11201704877Y A SG11201704877Y A SG 11201704877YA
Authority
SG
Singapore
Prior art keywords
measuring device
polishing pad
surface property
pad surface
cmp apparatus
Prior art date
Application number
SG11201704877YA
Inventor
Hisanori Matsuo
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201704877YA publication Critical patent/SG11201704877YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11201704877YA 2015-01-07 2016-01-07 Cmp apparatus having polishing pad surface property measuring device SG11201704877YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015001881 2015-01-07
PCT/JP2016/050377 WO2016111335A1 (en) 2015-01-07 2016-01-07 Cmp device provided with polishing pad surface property measuring device

Publications (1)

Publication Number Publication Date
SG11201704877YA true SG11201704877YA (en) 2017-07-28

Family

ID=56356020

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201704877YA SG11201704877YA (en) 2015-01-07 2016-01-07 Cmp apparatus having polishing pad surface property measuring device

Country Status (4)

Country Link
US (1) US10369675B2 (en)
JP (1) JP6622720B2 (en)
SG (1) SG11201704877YA (en)
WO (1) WO2016111335A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017121672A (en) * 2016-01-05 2017-07-13 不二越機械工業株式会社 Method for polishing workpiece and method for dressing polishing pad
JP2018065209A (en) * 2016-10-18 2018-04-26 株式会社荏原製作所 Surface-quality measuring device of polishing pad
JP6823541B2 (en) * 2017-05-30 2021-02-03 株式会社荏原製作所 Calibration method and calibration program
JP7269074B2 (en) 2018-04-26 2023-05-08 株式会社荏原製作所 Polishing device and polishing system equipped with polishing pad surface texture measuring device
TWI820308B (en) 2019-03-21 2023-11-01 美商應用材料股份有限公司 Monitoring of polishing pad texture in chemical mechanical polishing
CN111515864B (en) * 2020-04-30 2022-04-05 华虹半导体(无锡)有限公司 Monitoring method and system for diamond disk
CN113263436B (en) * 2020-05-29 2022-08-30 台湾积体电路制造股份有限公司 Chemical mechanical polishing system and method of use
JP2022112194A (en) 2021-01-21 2022-08-02 株式会社荏原製作所 Polishing pad surface property measurement apparatus, polishing pad surface property measurement method, and polishing pad surface property determination method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153821A (en) 1987-10-27 1988-06-27 Nikon Corp Alignment device
JPH06147838A (en) 1992-11-10 1994-05-27 Nikon Corp Film thickness measuring method
JP2001223190A (en) 2000-02-08 2001-08-17 Hitachi Ltd Method and device for evaluating surface state of polishing pad, and method and device for manufacturing thin-film device
US6896583B2 (en) 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US6910947B2 (en) * 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
JP2005244027A (en) * 2004-02-27 2005-09-08 Renesas Technology Corp Semiconductor wafer polishing state identifying apparatus, semiconductor wafer polishing apparatus, and semiconductor wafer polishing method
JP2012053073A (en) * 2006-03-14 2012-03-15 Hitachi High-Technologies Corp Optical defect inspection apparatus
JP5892591B2 (en) * 2010-12-09 2016-03-23 国立大学法人九州工業大学 Three-dimensional surface measuring apparatus and method
JP5712079B2 (en) * 2011-07-29 2015-05-07 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
US20130217306A1 (en) 2012-02-16 2013-08-22 Taiwan Semiconductor Manufacturing Co., Ltd. CMP Groove Depth and Conditioning Disk Monitoring
JP6066192B2 (en) 2013-03-12 2017-01-25 株式会社荏原製作所 Polishing pad surface texture measuring device
JP6025055B2 (en) 2013-03-12 2016-11-16 株式会社荏原製作所 Method for measuring surface properties of polishing pad
JP6372847B2 (en) * 2014-03-13 2018-08-15 株式会社荏原製作所 Polishing equipment
JP6465345B2 (en) * 2014-12-26 2019-02-06 株式会社荏原製作所 Method and apparatus for measuring surface properties of polishing pad

Also Published As

Publication number Publication date
JP6622720B2 (en) 2019-12-18
US10369675B2 (en) 2019-08-06
JPWO2016111335A1 (en) 2017-10-19
US20180015590A1 (en) 2018-01-18
WO2016111335A1 (en) 2016-07-14

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