SG11201903365SA - Elastic wave device with sub-wavelength thick piezoelectric layer - Google Patents
Elastic wave device with sub-wavelength thick piezoelectric layerInfo
- Publication number
- SG11201903365SA SG11201903365SA SG11201903365SA SG11201903365SA SG11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA
- Authority
- SG
- Singapore
- Prior art keywords
- elastic wave
- international
- layer
- osaka
- sub
- Prior art date
Links
- VQKFNUFAXTZWDK-UHFFFAOYSA-N alpha-methylfuran Natural products CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 abstract 3
- 230000008520 organization Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6489—Compensation of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662410804P | 2016-10-20 | 2016-10-20 | |
| US201662423705P | 2016-11-17 | 2016-11-17 | |
| PCT/US2017/057256 WO2018075682A1 (en) | 2016-10-20 | 2017-10-18 | Elastic wave device with sub-wavelength thick piezoelectric layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201903365SA true SG11201903365SA (en) | 2019-05-30 |
Family
ID=62019519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201903365SA SG11201903365SA (en) | 2016-10-20 | 2017-10-18 | Elastic wave device with sub-wavelength thick piezoelectric layer |
Country Status (9)
| Country | Link |
|---|---|
| US (4) | US10778181B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2018074575A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20190058680A (cg-RX-API-DMAC7.html) |
| CN (1) | CN109891612A (cg-RX-API-DMAC7.html) |
| DE (1) | DE112017005316B4 (cg-RX-API-DMAC7.html) |
| GB (2) | GB2569082A (cg-RX-API-DMAC7.html) |
| SG (1) | SG11201903365SA (cg-RX-API-DMAC7.html) |
| TW (1) | TWI752102B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2018075682A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2015137089A1 (ja) * | 2014-03-14 | 2017-04-06 | 株式会社村田製作所 | 弾性波装置 |
| WO2016158094A1 (ja) * | 2015-04-01 | 2016-10-06 | 株式会社村田製作所 | デュプレクサ |
| SG11201903365SA (en) | 2016-10-20 | 2019-05-30 | Skyworks Solutions Inc | Elastic wave device with sub-wavelength thick piezoelectric layer |
| WO2018116602A1 (ja) * | 2016-12-20 | 2018-06-28 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
| US10594292B2 (en) * | 2017-01-30 | 2020-03-17 | Huawei Technologies Co., Ltd. | Surface acoustic wave device |
| JP7042796B2 (ja) * | 2017-03-09 | 2022-03-28 | 株式会社村田製作所 | 弾性波装置、弾性波装置パッケージ及びマルチプレクサ |
| WO2018198952A1 (ja) * | 2017-04-24 | 2018-11-01 | 株式会社村田製作所 | フィルタ装置およびその製造方法 |
| US11070193B2 (en) * | 2017-11-24 | 2021-07-20 | Murata Manufacturing Co., Ltd. | Elastic wave device, radio-frequency front-end circuit, and communication device |
| JP7068835B2 (ja) | 2018-01-26 | 2022-05-17 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
| WO2019172032A1 (ja) * | 2018-03-08 | 2019-09-12 | 株式会社村田製作所 | マルチプレクサ、高周波フロントエンド回路および通信装置 |
| CN108418566A (zh) * | 2018-03-16 | 2018-08-17 | 无锡市好达电子有限公司 | 一种声表面波滤波器 |
| SG10201902753RA (en) | 2018-04-12 | 2019-11-28 | Skyworks Solutions Inc | Filter Including Two Types Of Acoustic Wave Resonators |
| US11595019B2 (en) | 2018-04-20 | 2023-02-28 | Taiyo Yuden Co., Ltd. | Acoustic wave resonator, filter, and multiplexer |
| JP2019201345A (ja) * | 2018-05-17 | 2019-11-21 | 太陽誘電株式会社 | 弾性波共振器、フィルタおよびマルチプレクサ |
| SG10201905013VA (en) * | 2018-06-11 | 2020-01-30 | Skyworks Solutions Inc | Acoustic wave device with spinel layer |
| KR20210068131A (ko) * | 2018-10-16 | 2021-06-08 | 도호쿠 다이가쿠 | 음향파 디바이스들 |
| WO2020105589A1 (ja) * | 2018-11-20 | 2020-05-28 | 株式会社村田製作所 | エクストラクタ |
| DE102018132862A1 (de) | 2018-12-19 | 2020-06-25 | RF360 Europe GmbH | Akustischer Oberflächenwellenresonator und Multiplexer, der diesen umfasst |
| CN110113025B (zh) * | 2019-04-28 | 2021-05-18 | 清华大学 | 一种便于射频前端集成的温度补偿声表面波器件及其制备方法与应用 |
| US11664780B2 (en) | 2019-05-14 | 2023-05-30 | Skyworks Solutions, Inc. | Rayleigh mode surface acoustic wave resonator |
| TWI748497B (zh) * | 2019-06-12 | 2021-12-01 | 美商特拉華公司 | 電極界定未懸掛之聲波共振器 |
| CN110138356B (zh) | 2019-06-28 | 2020-11-06 | 中国科学院上海微系统与信息技术研究所 | 一种高频声表面波谐振器及其制备方法 |
| DE102019119239B4 (de) | 2019-07-16 | 2025-12-24 | Rf360 Singapore Pte. Ltd. | Multiplexer |
| WO2021060523A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社村田製作所 | 弾性波装置及びフィルタ装置 |
| WO2021060522A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社村田製作所 | 弾性波装置 |
| JPWO2021060521A1 (cg-RX-API-DMAC7.html) | 2019-09-27 | 2021-04-01 | ||
| US20210111688A1 (en) | 2019-10-10 | 2021-04-15 | Skyworks Solutions, Inc. | Surface acoustic wave device with multi-layer piezoelectric substrate |
| CN110708035B (zh) * | 2019-10-21 | 2022-04-01 | 中国电子科技集团公司第二十六研究所 | 温度补偿型声表面波器件的温补层上表层表面波抑制方法 |
| JP7433873B2 (ja) | 2019-12-06 | 2024-02-20 | 太陽誘電株式会社 | 弾性波共振器、フィルタ、及びマルチプレクサ |
| CN122268310A (zh) * | 2020-03-30 | 2026-06-23 | 株式会社村田制作所 | 弹性波装置 |
| CN112054777B (zh) * | 2020-05-09 | 2024-11-15 | 诺思(天津)微系统有限责任公司 | 体声波谐振器组件及制造方法、滤波器及电子设备 |
| WO2022019170A1 (ja) * | 2020-07-22 | 2022-01-27 | 株式会社村田製作所 | 弾性波装置 |
| GB2598165B (en) * | 2020-08-18 | 2022-08-24 | River Eletec Corp | Acoustic wave device |
| US11522516B2 (en) * | 2020-08-27 | 2022-12-06 | RF360 Europe GmbH | Thin-film surface-acoustic-wave filter using lithium niobate |
| CN111988013B (zh) * | 2020-08-31 | 2021-06-01 | 诺思(天津)微系统有限责任公司 | 温补滤波器优化方法和温补滤波器、多工器、通信设备 |
| CN112217490B (zh) * | 2020-10-22 | 2021-09-14 | 展讯通信（上海）有限公司 | 层状温补型声表面波谐振器与封装方法 |
| CN112287584A (zh) * | 2020-10-30 | 2021-01-29 | 西北工业大学 | 一种超薄平板波导设备及其设计方法 |
| CN112600529A (zh) * | 2020-12-18 | 2021-04-02 | 广东广纳芯科技有限公司 | 一种具有poi结构的兰姆波谐振器 |
| CN117083800A (zh) * | 2021-03-31 | 2023-11-17 | 株式会社村田制作所 | 弹性波装置 |
| US12255633B2 (en) | 2021-04-16 | 2025-03-18 | Murata Manufacturing Co., Ltd. | Filter using transversely-excited film bulk acoustic resonators |
| CN113114159B (zh) * | 2021-05-27 | 2021-12-10 | 北京超材信息科技有限公司 | 声表面波装置 |
| US12341487B2 (en) | 2021-06-15 | 2025-06-24 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate for acoustic wave device |
| US12640703B2 (en) | 2021-07-30 | 2026-05-26 | Skyworks Solutions, Inc. | Acoustic wave device with dielectric layer for reduced transverse leakage |
| US20230099440A1 (en) | 2021-09-28 | 2023-03-30 | Skyworks Global Pte. Ltd. | Piezoelectric mems device with thermal compensation from different material properties |
| US12652023B2 (en) * | 2021-10-14 | 2026-06-09 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate device with negative temperature coefficient of frequency dielectric film for temperature stability |
| US12506464B2 (en) | 2021-12-06 | 2025-12-23 | Skyworks Solutions, Inc. | Multi-band surface acoustic wave filters |
| US12658879B2 (en) * | 2021-12-28 | 2026-06-16 | Skyworks Solutions, Inc. | Acoustic wave device with tilted interdigital transducer electrode |
| CN114531129A (zh) * | 2022-02-22 | 2022-05-24 | 重庆邮电大学 | 一种双模声耦合表面波滤波器 |
| CN114665006B (zh) * | 2022-03-21 | 2025-04-18 | 中北大学 | 一种d15模式铁电单晶薄膜压电振动传感器及其制备方法 |
| US12648470B2 (en) | 2022-03-30 | 2026-06-02 | Skyworks Solutions, Inc. | Package with integrated device die at least disposed within carrier |
| WO2023248636A1 (ja) * | 2022-06-24 | 2023-12-28 | 株式会社村田製作所 | 弾性波装置 |
| JP2024067557A (ja) * | 2022-11-05 | 2024-05-17 | 国立大学法人山梨大学 | 弾性波デバイス |
| CN116094481B (zh) * | 2023-04-12 | 2023-07-28 | 常州承芯半导体有限公司 | 弹性波装置、滤波装置和多工装置 |
| CN116633307B (zh) * | 2023-05-23 | 2024-09-10 | 无锡市好达电子股份有限公司 | 弹性波装置 |
| CN117013984B (zh) * | 2023-08-21 | 2024-05-28 | 天通瑞宏科技有限公司 | 一种键合晶圆及薄膜声表面波器件 |
| US20250202453A1 (en) * | 2023-12-18 | 2025-06-19 | Rf360 Singapore Pte. Ltd. | Surface acoustic wave devices with decoupled interdigital capacitors |
| US12706591B2 (en) | 2024-01-11 | 2026-08-11 | Skyworks Solutions, Inc. | Surface acoustic wave device with shared reflector and temperature compensation layer |
| WO2025211191A1 (ja) * | 2024-04-05 | 2025-10-09 | 株式会社村田製作所 | 弾性波装置および弾性波フィルタ |
| CN119298870B (zh) * | 2024-12-09 | 2025-05-06 | 中国科学技术大学 | 一种声波谐振器及滤波器 |
Family Cites Families (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4480209A (en) * | 1981-10-09 | 1984-10-30 | Clarion Co., Ltd. | Surface acoustic wave device having a specified crystalline orientation |
| JP3880150B2 (ja) * | 1997-06-02 | 2007-02-14 | 松下電器産業株式会社 | 弾性表面波素子 |
| JP3945363B2 (ja) * | 2001-10-12 | 2007-07-18 | 株式会社村田製作所 | 弾性表面波装置 |
| US6661313B2 (en) | 2001-10-25 | 2003-12-09 | Sawtek, Inc. | Surface acoustic wave devices using optimized cuts of lithium niobate (LiNbO3) |
| US7105980B2 (en) | 2002-07-03 | 2006-09-12 | Sawtek, Inc. | Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics |
| JP4345329B2 (ja) * | 2003-03-13 | 2009-10-14 | セイコーエプソン株式会社 | 弾性表面波デバイス |
| EP1724920A4 (en) * | 2004-03-12 | 2009-03-04 | Murata Manufacturing Co | ACOUSTIC SURFACE WAVE DEVICE |
| JP2006279609A (ja) | 2005-03-29 | 2006-10-12 | Fujitsu Media Device Kk | 弾性境界波素子、共振子およびラダー型フィルタ |
| US7446453B1 (en) | 2006-07-05 | 2008-11-04 | Triquint, Inc. | Surface acoustic wave devices using surface acoustic waves with strong piezoelectric coupling |
| WO2008056697A1 (en) * | 2006-11-08 | 2008-05-15 | Panasonic Corporation | Surface acoustic wave resonator |
| US7965155B2 (en) * | 2006-12-27 | 2011-06-21 | Panasonic Corporation | Surface acoustic wave resonator, and surface acoustic wave filter and antenna duplexer in which the surface acoustic wave resonator is used |
| JP5154285B2 (ja) * | 2007-05-28 | 2013-02-27 | 和彦 山之内 | 弾性境界波機能素子 |
| WO2009081651A1 (ja) | 2007-12-25 | 2009-07-02 | Murata Manufacturing Co., Ltd. | 複合圧電基板の製造方法 |
| CN102089970A (zh) * | 2008-07-11 | 2011-06-08 | 松下电器产业株式会社 | 板波元件和使用该板波元件的电子设备 |
| US8035464B1 (en) | 2009-03-05 | 2011-10-11 | Triquint Semiconductor, Inc. | Bonded wafer SAW filters and methods |
| KR20110020741A (ko) | 2009-08-24 | 2011-03-03 | 엔지케이 인슐레이터 엘티디 | 복합 기판의 제조 방법 |
| WO2011046117A1 (ja) | 2009-10-13 | 2011-04-21 | 株式会社村田製作所 | 弾性表面波装置 |
| WO2011052218A1 (ja) | 2009-11-02 | 2011-05-05 | パナソニック株式会社 | 弾性波素子と、これを用いたデュプレクサおよび電子機器 |
| US9419584B2 (en) | 2010-02-22 | 2016-08-16 | Skyworks Panasonic Filter Solutions Japan Co., Ltd. | Antenna sharing device |
| DE102010034121A1 (de) | 2010-08-12 | 2012-02-16 | Epcos Ag | Mit akustischen Wellen arbeitendes Bauelement mit reduziertem Temperaturgang der Frequenzlage und Verfahren zur Herstellung |
| WO2012073871A1 (ja) | 2010-11-30 | 2012-06-07 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
| CN106209007B (zh) * | 2010-12-24 | 2019-07-05 | 株式会社村田制作所 | 弹性波装置 |
| US9391589B2 (en) * | 2011-01-24 | 2016-07-12 | Epcos Ag | Surface acoustic wave filter on a lithium niobate substrate |
| US8610518B1 (en) * | 2011-05-18 | 2013-12-17 | Triquint Semiconductor, Inc. | Elastic guided wave coupling resonator filter and associated manufacturing |
| CN104702239B (zh) * | 2011-06-23 | 2017-09-22 | 天工滤波方案日本有限公司 | 梯型弹性波滤波器及使用该弹性波滤波器的天线双工器 |
| KR101636901B1 (ko) | 2011-09-30 | 2016-07-06 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
| JP5720797B2 (ja) * | 2011-10-24 | 2015-05-20 | 株式会社村田製作所 | 弾性表面波装置 |
| JP5850137B2 (ja) | 2012-03-23 | 2016-02-03 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
| DE112013003118B4 (de) | 2012-06-22 | 2017-12-07 | Murata Manufacturing Co., Ltd. | Bauelement für elastische Wellen |
| US9246533B2 (en) | 2012-10-18 | 2016-01-26 | Skyworks Panasonic Filter Solutions Japan Co., Ltd. | Electronic device including filter |
| FR2998420B1 (fr) | 2012-11-22 | 2017-06-09 | Centre Nat De La Rech Scient (C N R S) | Transducteur a ondes elastiques de surface se propageant sur un substrat en niobate de lithium ou en tantalate de lithium. |
| JP6103906B2 (ja) | 2012-12-06 | 2017-03-29 | スカイワークスフィルターソリューションズジャパン株式会社 | 弾性波装置と封止体 |
| JP6134550B2 (ja) | 2013-03-22 | 2017-05-24 | スカイワークスフィルターソリューションズジャパン株式会社 | 弾性波装置およびそれを用いたアンテナ共用器 |
| US9219517B2 (en) | 2013-10-02 | 2015-12-22 | Triquint Semiconductor, Inc. | Temperature compensated bulk acoustic wave devices using over-moded acoustic reflector layers |
| JP2015073207A (ja) | 2013-10-03 | 2015-04-16 | スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 | 弾性波共振器 |
| DE112014005424T5 (de) * | 2013-11-29 | 2016-08-18 | Murata Manufacturing Co., Ltd. | Splitter |
| WO2015098678A1 (ja) * | 2013-12-27 | 2015-07-02 | 株式会社村田製作所 | 弾性波装置 |
| WO2016084526A1 (ja) | 2014-11-28 | 2016-06-02 | 株式会社村田製作所 | 弾性波装置 |
| US10355668B2 (en) * | 2015-01-20 | 2019-07-16 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
| US10128814B2 (en) * | 2016-01-28 | 2018-11-13 | Qorvo Us, Inc. | Guided surface acoustic wave device providing spurious mode rejection |
| US10938367B2 (en) * | 2016-03-31 | 2021-03-02 | Qorvo Us, Inc. | Solidly mounted layer thin film device with grounding layer |
| SG11201903365SA (en) | 2016-10-20 | 2019-05-30 | Skyworks Solutions Inc | Elastic wave device with sub-wavelength thick piezoelectric layer |
| WO2018092511A1 (ja) * | 2016-11-18 | 2018-05-24 | 株式会社村田製作所 | 弾性表面波フィルタおよびマルチプレクサ |
| JP2019036963A (ja) * | 2017-08-18 | 2019-03-07 | スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. | キャリアアグリゲーションシステム用の弾性表面波デバイスを備えたフィルタ |
| KR102358899B1 (ko) * | 2017-12-08 | 2022-02-08 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
| JP7264229B2 (ja) * | 2019-03-11 | 2023-04-25 | 株式会社村田製作所 | 弾性波装置 |
| KR102722445B1 (ko) * | 2019-04-08 | 2024-10-25 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 및 멀티플렉서 |
| US11870421B2 (en) * | 2019-10-23 | 2024-01-09 | Skyworks Solutions, Inc. | Surface acoustic wave resonator with suppressed transverse modes using second bus bar |
| US11811392B2 (en) * | 2019-10-23 | 2023-11-07 | Skyworks Solutions, Inc. | Surface acoustic wave resonator with suppressed transverse modes using selective dielectric removal |
| US20230028925A1 (en) * | 2021-07-23 | 2023-01-26 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate device with reduced piezoelectric material cut angle |
-
2017
- 2017-10-18 SG SG11201903365SA patent/SG11201903365SA/en unknown
- 2017-10-18 GB GB1905101.0A patent/GB2569082A/en not_active Withdrawn
- 2017-10-18 DE DE112017005316.1T patent/DE112017005316B4/de active Active
- 2017-10-18 US US15/787,596 patent/US10778181B2/en active Active
- 2017-10-18 WO PCT/US2017/057256 patent/WO2018075682A1/en not_active Ceased
- 2017-10-18 US US15/787,568 patent/US20180159494A1/en not_active Abandoned
- 2017-10-18 CN CN201780064907.6A patent/CN109891612A/zh active Pending
- 2017-10-18 KR KR1020197014259A patent/KR20190058680A/ko not_active Withdrawn
- 2017-10-18 GB GB2118878.4A patent/GB2600838A/en not_active Withdrawn
- 2017-10-19 JP JP2017202561A patent/JP2018074575A/ja active Pending
- 2017-10-20 TW TW106136258A patent/TWI752102B/zh active
-
2020
- 2020-08-03 US US16/983,472 patent/US11996821B2/en active Active
-
2024
- 2024-04-22 US US18/642,300 patent/US20240356518A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB2569082A (en) | 2019-06-05 |
| US20240356518A1 (en) | 2024-10-24 |
| US20180159507A1 (en) | 2018-06-07 |
| DE112017005316T5 (de) | 2019-07-18 |
| US11996821B2 (en) | 2024-05-28 |
| US10778181B2 (en) | 2020-09-15 |
| GB2600838A (en) | 2022-05-11 |
| US20180159494A1 (en) | 2018-06-07 |
| CN109891612A (zh) | 2019-06-14 |
| GB202118878D0 (en) | 2022-02-09 |
| DE112017005316B4 (de) | 2021-08-05 |
| TW201830740A (zh) | 2018-08-16 |
| WO2018075682A1 (en) | 2018-04-26 |
| JP2018074575A (ja) | 2018-05-10 |
| GB201905101D0 (en) | 2019-05-22 |
| US20210050840A1 (en) | 2021-02-18 |
| KR20190058680A (ko) | 2019-05-29 |
| TWI752102B (zh) | 2022-01-11 |
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