SG11201704360UA - Method for polishing silicon wafer - Google Patents
Method for polishing silicon waferInfo
- Publication number
- SG11201704360UA SG11201704360UA SG11201704360UA SG11201704360UA SG11201704360UA SG 11201704360U A SG11201704360U A SG 11201704360UA SG 11201704360U A SG11201704360U A SG 11201704360UA SG 11201704360U A SG11201704360U A SG 11201704360UA SG 11201704360U A SG11201704360U A SG 11201704360UA
- Authority
- SG
- Singapore
- Prior art keywords
- silicon wafer
- polishing silicon
- polishing
- wafer
- silicon
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014253069A JP6206388B2 (ja) | 2014-12-15 | 2014-12-15 | シリコンウェーハの研磨方法 |
PCT/JP2015/005847 WO2016098286A1 (ja) | 2014-12-15 | 2015-11-25 | シリコンウェーハの研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201704360UA true SG11201704360UA (en) | 2017-06-29 |
Family
ID=56126198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201704360UA SG11201704360UA (en) | 2014-12-15 | 2015-11-25 | Method for polishing silicon wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US10460947B2 (zh) |
JP (1) | JP6206388B2 (zh) |
KR (1) | KR102346305B1 (zh) |
CN (1) | CN107004594B (zh) |
DE (1) | DE112015005277B4 (zh) |
SG (1) | SG11201704360UA (zh) |
TW (1) | TWI632025B (zh) |
WO (1) | WO2016098286A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101900788B1 (ko) | 2017-01-03 | 2018-09-20 | 에스케이실트론 주식회사 | 웨이퍼 연마 시스템 |
WO2018186211A1 (ja) * | 2017-04-06 | 2018-10-11 | 東京エレクトロン株式会社 | 液供給装置および液供給方法 |
JP6384001B1 (ja) * | 2017-05-25 | 2018-09-05 | 株式会社三井E&Sマシナリー | 超音波加工装置における砥粒回収システム |
KR101971150B1 (ko) * | 2017-08-18 | 2019-04-22 | 에스케이실트론 주식회사 | 웨이퍼의 에지 연마부, 이를 포함하는 웨이퍼의 에지 연마 장치 및 방법 |
JP6946166B2 (ja) * | 2017-12-20 | 2021-10-06 | パナソニックIpマネジメント株式会社 | 研磨装置および研磨方法 |
CN108789163A (zh) * | 2018-05-30 | 2018-11-13 | 郑州合晶硅材料有限公司 | 一种硅片背面抛光用装置及抛光方法 |
TWI741635B (zh) * | 2019-06-28 | 2021-10-01 | 日商斯庫林集團股份有限公司 | 基板處理方法及基板處理裝置 |
CN110610872B (zh) * | 2019-09-29 | 2021-08-24 | 无锡尚德太阳能电力有限公司 | 硅片碱抛添加剂的质量检测方法 |
CN111390747B (zh) * | 2020-04-23 | 2022-07-19 | 福建晶安光电有限公司 | 一种半导体晶圆加工中浆料的定量抽换装置 |
JP2022136767A (ja) * | 2021-03-08 | 2022-09-21 | キオクシア株式会社 | 基板処理装置および基板処理方法 |
IT202100015230A1 (it) * | 2021-06-10 | 2022-12-10 | Euroelettra S R L | Metodo e sistema di recupero per recuperare un materiale ceramico di scarto da un ciclo di fabbricazione di prodotti ceramici |
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JPS63272460A (ja) | 1987-04-28 | 1988-11-09 | Mitsubishi Monsanto Chem Co | ウエハ−用研磨剤組成物 |
JP2789531B2 (ja) | 1990-05-14 | 1998-08-20 | 日本プラスト株式会社 | ベンチレータのルーバ組付方法 |
JPH1110540A (ja) * | 1997-06-23 | 1999-01-19 | Speedfam Co Ltd | Cmp装置のスラリリサイクルシステム及びその方法 |
JPH11277434A (ja) * | 1998-03-30 | 1999-10-12 | Speedfam Co Ltd | Cmp装置のスラリリサイクルシステム及びその方法 |
JP2000071172A (ja) | 1998-08-28 | 2000-03-07 | Nec Corp | 化学機械研磨用スラリーの再生装置及び再生方法 |
US6641463B1 (en) * | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
JP2000288935A (ja) * | 1999-04-07 | 2000-10-17 | Kurita Water Ind Ltd | 非コロイド状研磨材の回収方法及び装置 |
JP3708748B2 (ja) * | 1999-04-23 | 2005-10-19 | 松下電器産業株式会社 | 研磨剤の再生装置および研磨剤の再生方法 |
US20020197935A1 (en) * | 2000-02-14 | 2002-12-26 | Mueller Brian L. | Method of polishing a substrate |
KR100741216B1 (ko) * | 2000-04-12 | 2007-07-19 | 신에쯔 한도타이 가부시키가이샤 | 반도체 웨이퍼의 제조방법 및 반도체 웨이퍼 |
JP2002239906A (ja) * | 2001-02-13 | 2002-08-28 | Ishikawajima Hanyoki Service Co Ltd | ラップ砥粒スラリーの再生方法及び装置 |
DE10159833C1 (de) * | 2001-12-06 | 2003-06-18 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben |
JP4644120B2 (ja) * | 2003-03-18 | 2011-03-02 | 野村マイクロ・サイエンス株式会社 | 半導体研磨スラリー精製用素材、半導体研磨スラリー精製用モジュールおよび半導体研磨スラリーの精製方法 |
CN101311205A (zh) * | 2004-07-23 | 2008-11-26 | 日立化成工业株式会社 | Cmp研磨剂以及衬底的研磨方法 |
JP4748968B2 (ja) * | 2004-10-27 | 2011-08-17 | 信越半導体株式会社 | 半導体ウエーハの製造方法 |
JP2008093811A (ja) | 2006-10-16 | 2008-04-24 | Shin Etsu Handotai Co Ltd | 研磨ヘッド及び研磨装置 |
JP2008188723A (ja) * | 2007-02-06 | 2008-08-21 | Mitsubishi Electric Corp | 使用済スラリーのリサイクル方法 |
US7820051B2 (en) * | 2007-02-23 | 2010-10-26 | International Business Machines Corporation | Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes |
JP5148948B2 (ja) * | 2007-08-23 | 2013-02-20 | Sumco Techxiv株式会社 | 研磨用スラリーのリサイクル方法 |
JP4580433B2 (ja) * | 2008-04-14 | 2010-11-10 | 野村マイクロ・サイエンス株式会社 | 研磨用スラリーの再生方法 |
JP4955624B2 (ja) | 2008-07-31 | 2012-06-20 | 信越半導体株式会社 | 両面研磨装置 |
JP5760403B2 (ja) * | 2010-11-24 | 2015-08-12 | 株式会社Sumco | 薬液リサイクル方法および該方法に用いる装置 |
JP2014160833A (ja) * | 2014-03-25 | 2014-09-04 | Asahi Glass Co Ltd | 非酸化物単結晶基板の研磨方法 |
-
2014
- 2014-12-15 JP JP2014253069A patent/JP6206388B2/ja active Active
-
2015
- 2015-11-25 WO PCT/JP2015/005847 patent/WO2016098286A1/ja active Application Filing
- 2015-11-25 US US15/528,237 patent/US10460947B2/en active Active
- 2015-11-25 KR KR1020177016099A patent/KR102346305B1/ko active IP Right Grant
- 2015-11-25 DE DE112015005277.1T patent/DE112015005277B4/de active Active
- 2015-11-25 SG SG11201704360UA patent/SG11201704360UA/en unknown
- 2015-11-25 CN CN201580064050.9A patent/CN107004594B/zh active Active
- 2015-11-27 TW TW104139801A patent/TWI632025B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201632312A (zh) | 2016-09-16 |
TWI632025B (zh) | 2018-08-11 |
DE112015005277T5 (de) | 2017-09-28 |
KR102346305B1 (ko) | 2022-01-03 |
JP2016115791A (ja) | 2016-06-23 |
KR20170094213A (ko) | 2017-08-17 |
US10460947B2 (en) | 2019-10-29 |
JP6206388B2 (ja) | 2017-10-04 |
CN107004594A (zh) | 2017-08-01 |
WO2016098286A1 (ja) | 2016-06-23 |
US20170345662A1 (en) | 2017-11-30 |
DE112015005277B4 (de) | 2024-05-02 |
CN107004594B (zh) | 2020-02-21 |
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