SG11201608933SA - Lead-free solder alloy - Google Patents
Lead-free solder alloyInfo
- Publication number
- SG11201608933SA SG11201608933SA SG11201608933SA SG11201608933SA SG11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA
- Authority
- SG
- Singapore
- Prior art keywords
- lead
- free solder
- solder alloy
- alloy
- free
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014094277 | 2014-04-30 | ||
| JP2015004403 | 2015-01-13 | ||
| PCT/JP2015/062818 WO2015166945A1 (ja) | 2014-04-30 | 2015-04-28 | 鉛フリーはんだ合金 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201608933SA true SG11201608933SA (en) | 2016-12-29 |
Family
ID=54358672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201608933SA SG11201608933SA (en) | 2014-04-30 | 2015-04-28 | Lead-free solder alloy |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US10286497B2 (ko) |
| EP (2) | EP3708292A1 (ko) |
| JP (3) | JP5872114B1 (ko) |
| KR (1) | KR20160147996A (ko) |
| CN (3) | CN114161023A (ko) |
| AU (1) | AU2015254179B2 (ko) |
| BR (2) | BR122021001612B1 (ko) |
| CA (1) | CA2946994C (ko) |
| HK (1) | HK1259425A1 (ko) |
| MX (2) | MX2016014012A (ko) |
| MY (1) | MY188657A (ko) |
| PH (1) | PH12016502152B1 (ko) |
| RU (3) | RU2662176C2 (ko) |
| SG (1) | SG11201608933SA (ko) |
| WO (1) | WO2015166945A1 (ko) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201608933SA (en) * | 2014-04-30 | 2016-12-29 | Nihon Superior Co Ltd | Lead-free solder alloy |
| JP6788337B2 (ja) * | 2015-10-16 | 2020-11-25 | Ａｇｃ株式会社 | 接合用組成物 |
| JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| CN105665956A (zh) * | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
| JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| HUE053519T2 (hu) | 2016-09-13 | 2021-07-28 | Senju Metal Industry Co | Forrasztó ötvözet, forrasztó gömb és forrasztási kötés |
| CN106825983B (zh) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | 一种SnAgSbNi系无铅焊锡合金及其制备方法和应用 |
| WO2018174162A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社日本スペリア社 | はんだ継手 |
| KR102071255B1 (ko) * | 2017-03-31 | 2020-01-31 | 센주긴조쿠고교 가부시키가이샤 | 땜납 합금, 솔더 페이스트 및 땜납 조인트 |
| WO2018235925A1 (ja) * | 2017-06-22 | 2018-12-27 | Ａｇｃ株式会社 | 窓材、光学パッケージ |
| CN107671451A (zh) * | 2017-08-21 | 2018-02-09 | 番禺得意精密电子工业有限公司 | 电连接器及其焊料 |
| US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| JP7420363B2 (ja) * | 2018-03-06 | 2024-01-23 | 株式会社日本スペリア社 | はんだ継手 |
| JP7287606B2 (ja) * | 2018-08-10 | 2023-06-06 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| CN108994480A (zh) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | 一种SnBiAgCu高可靠性无铅焊料合金 |
| CN109702374B (zh) * | 2019-02-13 | 2021-02-09 | 南昌大学 | 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法 |
| JP6804126B1 (ja) * | 2019-04-11 | 2020-12-23 | 株式会社日本スペリア社 | 鉛フリーはんだ合金及びはんだ接合部 |
| CN110315238B (zh) * | 2019-07-31 | 2021-09-17 | 广东省科学院中乌焊接研究所 | 一种碳纳米管增强无铅钎料、其制备方法及其应用 |
| JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| MX2023005700A (es) * | 2020-11-19 | 2023-11-30 | Senju Metal Industry Co | Aleacion de soldadura, bola de soldadura y junta de soldadura. |
| KR20220091404A (ko) * | 2020-12-23 | 2022-06-30 | 엠케이전자 주식회사 | 무연 솔더 합금, 그를 포함하는 솔더 페이스트, 및 그를 포함하는 반도체 부품 |
| JP2023060639A (ja) * | 2021-10-18 | 2023-04-28 | Tdk株式会社 | はんだ組成物および電子部品 |
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| US4879096A (en) | 1989-04-19 | 1989-11-07 | Oatey Company | Lead- and antimony-free solder composition |
| KR19980068127A (ko) | 1997-02-15 | 1998-10-15 | 김광호 | 납땜용 무연 합금 |
| JP3152945B2 (ja) | 1998-03-26 | 2001-04-03 | 株式会社日本スペリア社 | 無鉛はんだ合金 |
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| JP3262113B2 (ja) | 1999-01-29 | 2002-03-04 | 富士電機株式会社 | はんだ合金 |
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| PL195528B1 (pl) | 2000-11-16 | 2007-09-28 | Singapore Asahi Chemical And S | Bezołowiowy stop lutowniczy |
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| TW592872B (en) | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
| RU2219030C1 (ru) | 2002-05-27 | 2003-12-20 | Открытое акционерное общество "ГАЗ" | Припой для низкотемпературной пайки |
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| CN1788918A (zh) * | 2005-12-20 | 2006-06-21 | 徐振五 | 无铅环保焊料 |
| US20070172381A1 (en) | 2006-01-23 | 2007-07-26 | Deram Brian T | Lead-free solder with low copper dissolution |
| CN100439028C (zh) * | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
| WO2009013114A1 (de) | 2007-07-20 | 2009-01-29 | Inventio Ag | Verfahren zur ermittlung der geschwindigkeit einer aufzugskabine und eine steuereinheit zur durchführung dieses verfahrens |
| CN101214591B (zh) * | 2008-01-18 | 2010-11-24 | 重庆工学院 | 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料 |
| CN101952081B (zh) * | 2008-02-22 | 2016-01-13 | 日本斯倍利亚社股份有限公司 | 含有Ni的无铅焊料的Ni浓度调节方法 |
| CN102066042B (zh) * | 2008-04-23 | 2016-03-23 | 千住金属工业株式会社 | 无铅焊料 |
| KR101318454B1 (ko) * | 2008-04-23 | 2013-10-16 | 센주긴조쿠고교 가부시키가이샤 | 수축공이 억제된 납프리 땜납 합금 |
| CN101585119A (zh) * | 2009-02-26 | 2009-11-25 | 郴州金箭焊料有限公司 | 抗氧化低银无铅焊料合金 |
| JP2011251310A (ja) * | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
| JP4787384B1 (ja) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
| WO2012141331A1 (ja) * | 2011-04-15 | 2012-10-18 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| JP2013000744A (ja) | 2011-06-10 | 2013-01-07 | Nihon Superior Co Ltd | 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部 |
| JP2013252548A (ja) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | 微細部品接合用のソルダペースト |
| WO2014002304A1 (ja) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| JP5238088B1 (ja) * | 2012-06-29 | 2013-07-17 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| US8875253B2 (en) * | 2012-07-03 | 2014-10-28 | Facebook, Inc. | Trust metrics on shared computers |
| TWI655052B (zh) * | 2012-10-09 | 2019-04-01 | 美商‧阿爾發裝配解決方案公司 | 無鉛、無銻焊接合金、彼之用途、包含彼之焊接點，以及形成焊接點之方法 |
| TWI460046B (zh) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
| CN103008904B (zh) * | 2012-11-28 | 2015-04-08 | 一远电子科技有限公司 | 一种SnCuNiGaGeIn系无银无铅焊料合金 |
| TWI576195B (zh) | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| SG11201608933SA (en) * | 2014-04-30 | 2016-12-29 | Nihon Superior Co Ltd | Lead-free solder alloy |
-
2015
- 2015-04-28 SG SG11201608933SA patent/SG11201608933SA/en unknown
- 2015-04-28 CN CN202111526384.7A patent/CN114161023A/zh active Pending
- 2015-04-28 CN CN201580001155.XA patent/CN105339131A/zh active Pending
- 2015-04-28 AU AU2015254179A patent/AU2015254179B2/en active Active
- 2015-04-28 WO PCT/JP2015/062818 patent/WO2015166945A1/ja active Application Filing
- 2015-04-28 CN CN201810326161.8A patent/CN108515289A/zh active Pending
- 2015-04-28 EP EP20170413.7A patent/EP3708292A1/en active Pending
- 2015-04-28 JP JP2015524557A patent/JP5872114B1/ja active Active
- 2015-04-28 CA CA2946994A patent/CA2946994C/en active Active
- 2015-04-28 RU RU2016146520A patent/RU2662176C2/ru active
- 2015-04-28 BR BR122021001612-7A patent/BR122021001612B1/pt active IP Right Grant
- 2015-04-28 RU RU2018118008A patent/RU2018118008A/ru not_active Application Discontinuation
- 2015-04-28 BR BR112016024855-4A patent/BR112016024855B1/pt active IP Right Grant
- 2015-04-28 RU RU2018118007A patent/RU2695791C2/ru active
- 2015-04-28 MX MX2016014012A patent/MX2016014012A/es unknown
- 2015-04-28 KR KR1020167033604A patent/KR20160147996A/ko active Search and Examination
- 2015-04-28 MY MYPI2016001916A patent/MY188657A/en unknown
- 2015-04-28 US US14/901,638 patent/US10286497B2/en active Active
- 2015-04-28 EP EP15785689.9A patent/EP3138658B1/en active Active
- 2015-12-03 JP JP2015236930A patent/JP6339993B2/ja active Active
-
2016
- 2016-04-08 JP JP2016078295A patent/JP2016129908A/ja active Pending
- 2016-10-25 MX MX2021000260A patent/MX2021000260A/es unknown
- 2016-10-27 PH PH12016502152A patent/PH12016502152B1/en unknown
-
2019
- 2019-01-31 HK HK19101829.4A patent/HK1259425A1/zh unknown
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