SG11201503660VA - Substrate supporting apparatus - Google Patents
Substrate supporting apparatusInfo
- Publication number
- SG11201503660VA SG11201503660VA SG11201503660VA SG11201503660VA SG11201503660VA SG 11201503660V A SG11201503660V A SG 11201503660VA SG 11201503660V A SG11201503660V A SG 11201503660VA SG 11201503660V A SG11201503660V A SG 11201503660VA SG 11201503660V A SG11201503660V A SG 11201503660VA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate supporting
- supporting apparatus
- substrate
- supporting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/24—Chucks characterised by features relating primarily to remote control of the gripping means
- B23B31/30—Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
- B23B31/307—Vacuum chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/085319 WO2014082196A1 (fr) | 2012-11-27 | 2012-11-27 | Appareil de support de substrat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201503660VA true SG11201503660VA (en) | 2015-06-29 |
Family
ID=50827010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201503660VA SG11201503660VA (en) | 2012-11-27 | 2012-11-27 | Substrate supporting apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10410906B2 (fr) |
| JP (1) | JP6198840B2 (fr) |
| KR (1) | KR102124417B1 (fr) |
| CN (2) | CN110610894B (fr) |
| SG (1) | SG11201503660VA (fr) |
| WO (1) | WO2014082196A1 (fr) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2843695B9 (fr) * | 2013-08-28 | 2021-04-14 | Mechatronic Systemtechnik GmbH | Dispositif, notamment effecteur terminal |
| CN104362116B (zh) * | 2014-11-04 | 2017-06-27 | 合肥京东方光电科技有限公司 | 一种气悬浮式下部电极及干法刻蚀装置 |
| JP6456708B2 (ja) * | 2015-02-03 | 2019-01-23 | 株式会社ディスコ | 研削装置 |
| CN105033630A (zh) * | 2015-07-30 | 2015-11-11 | 马瑞利汽车零部件(芜湖)有限公司 | 汽车车灯壳体打安装螺丝装置 |
| JP6116629B2 (ja) * | 2015-08-11 | 2017-04-19 | 株式会社ハーモテック | 吸引装置 |
| US9911640B2 (en) * | 2015-09-01 | 2018-03-06 | Boris Kesil | Universal gripping and suction chuck |
| WO2017066418A1 (fr) * | 2015-10-15 | 2017-04-20 | Applied Materials, Inc. | Système de support de substrat |
| CN107301963A (zh) * | 2016-04-15 | 2017-10-27 | 上海新昇半导体科技有限公司 | 伯努利基座装置及沉积设备 |
| CN107301964A (zh) * | 2016-04-15 | 2017-10-27 | 上海新昇半导体科技有限公司 | 伯努利基座装置及沉积设备 |
| CN107301962A (zh) * | 2016-04-15 | 2017-10-27 | 上海新昇半导体科技有限公司 | 伯努利基座装置及沉积设备 |
| EP3442016B1 (fr) * | 2016-05-26 | 2023-06-07 | Mimasu Semiconductor Industry Co., Ltd. | Dispositif et procédé de chauffage et de maintien de tranche pour plateau rotatif, et dispositif de rotation et de maintien de tranche |
| JP6758587B2 (ja) * | 2016-07-06 | 2020-09-23 | エーシーエム リサーチ （シャンハイ） インコーポレーテッド | 基板支持装置 |
| CN107665850B (zh) * | 2016-07-29 | 2019-09-17 | 上海微电子装备（集团）股份有限公司 | 基板的对接装置及对接方法 |
| JP2019529691A (ja) * | 2016-08-09 | 2019-10-17 | ジングルス・テヒノロギース・アクチェンゲゼルシャフトＳｉｎｇｕｌｕｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ａｇ | 基板の同時の回転及び浮揚のための非接触基板キャリア |
| CN107761165A (zh) * | 2016-08-15 | 2018-03-06 | 上海新昇半导体科技有限公司 | 一种基于伯努利效应的底座及外延设备 |
| CN106653660B (zh) * | 2017-01-25 | 2019-08-20 | 重庆京东方光电科技有限公司 | 一种气体流量控制装置及等离子体刻蚀设备 |
| JP2018122380A (ja) * | 2017-01-31 | 2018-08-09 | ブラザー工業株式会社 | 部品保持装置 |
| JP2018122381A (ja) * | 2017-01-31 | 2018-08-09 | ブラザー工業株式会社 | 部品保持装置 |
| CN108723972B (zh) * | 2017-04-20 | 2020-09-22 | 上海新昇半导体科技有限公司 | 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法 |
| TWI613032B (zh) * | 2017-04-25 | 2018-02-01 | 直驅式分度盤工件負壓吸附結構 | |
| JP7084385B2 (ja) * | 2017-05-11 | 2022-06-14 | ローツェ株式会社 | 薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット |
| US10147610B1 (en) * | 2017-05-30 | 2018-12-04 | Lam Research Corporation | Substrate pedestal module including metallized ceramic tubes for RF and gas delivery |
| US11254014B2 (en) * | 2017-07-21 | 2022-02-22 | Electro Scientific Industries, Inc. | Non-contact handler and method of handling workpieces using the same |
| CN107910250A (zh) * | 2017-11-16 | 2018-04-13 | 德淮半导体有限公司 | 晶片处理设备及方法 |
| CN108177199A (zh) * | 2018-02-11 | 2018-06-19 | 重庆双驰门窗有限公司 | 电脑裁板锯操作台 |
| WO2020023409A1 (fr) * | 2018-07-24 | 2020-01-30 | Applied Materials, Inc. | Socle optiquement transparent permettant de supporter un substrat de manière fluidique |
| WO2020076650A1 (fr) * | 2018-10-10 | 2020-04-16 | Kateeva, Inc. | Systèmes et procédés de support et de transport d'un substrat |
| JP6979935B2 (ja) * | 2018-10-24 | 2021-12-15 | 三菱電機株式会社 | 半導体製造装置および半導体製造方法 |
| JP6787972B2 (ja) * | 2018-10-31 | 2020-11-18 | ファナック株式会社 | 主軸装置 |
| JP7221657B2 (ja) * | 2018-11-12 | 2023-02-14 | キオクシア株式会社 | 基板処理装置 |
| CN111223809A (zh) * | 2018-11-23 | 2020-06-02 | 东泰高科装备科技有限公司 | 一种承载半导体衬底的基座、衬底移动装置及其使用方法 |
| JP7390142B2 (ja) * | 2019-09-20 | 2023-12-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板搬送方法 |
| JP7437899B2 (ja) * | 2019-09-20 | 2024-02-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| US20210114067A1 (en) * | 2019-10-18 | 2021-04-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor cleaning apparatus and method |
| CN111146120B (zh) * | 2019-12-24 | 2024-03-15 | 上海集成电路研发中心有限公司 | 一种晶圆清洗固定装置和方法 |
| CN111136570B (zh) * | 2020-02-11 | 2021-04-27 | 常州我信光学有限公司 | 一种光学镜片加工机构 |
| CN111341718B (zh) * | 2020-03-12 | 2023-03-21 | 北京北方华创微电子装备有限公司 | 半导体清洗设备的卡盘结构及半导体清洗设备 |
| CN111633583B (zh) * | 2020-05-25 | 2021-09-07 | 嘉兴跃华节能科技有限公司 | 一种玻璃加工用的快速装夹定位装置及方法 |
| KR20230117238A (ko) * | 2020-12-16 | 2023-08-07 | 에이씨엠 리서치 (상하이), 인코포레이티드 | 기판 지지 장치 |
| CN112845296B (zh) * | 2020-12-31 | 2022-08-23 | 至微半导体(上海)有限公司 | 可改善单片清洗固体结晶物堆积的装置及湿法清洗设备 |
| CN113108715B (zh) * | 2021-04-13 | 2024-01-23 | 南京中安半导体设备有限责任公司 | 悬浮物的测量装置和气浮卡盘 |
| CN115608713A (zh) * | 2021-07-14 | 2023-01-17 | 北京小米移动软件有限公司 | 盖板承载台、盖板清洗装置及盖板清洗方法 |
| CN116264153A (zh) * | 2021-12-14 | 2023-06-16 | 盛美半导体设备(上海)股份有限公司 | 晶圆背面清洗方法 |
| EP4235761A1 (fr) * | 2022-02-24 | 2023-08-30 | Semsysco GmbH | Dispositif de manipulation de substrat |
| CN114899139B (zh) * | 2022-07-11 | 2022-09-23 | 沈阳芯达科技有限公司 | 一种晶圆定位夹紧组件 |
| CN117373988B (zh) * | 2023-11-27 | 2024-04-16 | 苏州恩腾半导体科技有限公司 | 一种基于伯努利卡盘的晶圆保持装置 |
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| US4874273A (en) * | 1987-03-16 | 1989-10-17 | Hitachi, Ltd. | Apparatus for holding and/or conveying articles by fluid |
| ATE171306T1 (de) | 1993-02-08 | 1998-10-15 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige gegenstände |
| JPH09107023A (ja) * | 1995-10-13 | 1997-04-22 | Toshiba Microelectron Corp | 被処理物の回転保持装置 |
| JPH11165868A (ja) | 1997-12-06 | 1999-06-22 | Horiba Ltd | 板状部材保持装置 |
| US20030198551A1 (en) * | 1997-12-15 | 2003-10-23 | Schmidt Wayne J. | Robots for microelectronic workpiece handling |
| JP2000021951A (ja) | 1998-07-03 | 2000-01-21 | Zetekku Kk | ウエハ搬送装置およびウエハ載置台 |
| EP1052682B1 (fr) | 1999-04-28 | 2002-01-09 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Dispositif et procédé pour le traitement par liquide d'objets en forme de disque |
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| EP1202326B1 (fr) * | 2000-10-31 | 2004-01-02 | Sez Ag | Dispositif pour le traitement liquide d'objets en forme de plaquettes |
| JP3892676B2 (ja) * | 2001-03-22 | 2007-03-14 | 大日本スクリーン製造株式会社 | 基板処置装置および基板処理方法 |
| US6669808B2 (en) | 2001-03-22 | 2003-12-30 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP3846697B2 (ja) * | 2001-08-14 | 2006-11-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4018958B2 (ja) | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2003170382A (ja) | 2001-12-03 | 2003-06-17 | Jel:Kk | 基板搬送用ロボット |
| JP2003282515A (ja) | 2002-03-27 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
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| US7056392B1 (en) * | 2003-04-16 | 2006-06-06 | Lsi Logic Corporation | Wafer chucking apparatus and method for spin processor |
| JP4312001B2 (ja) | 2003-07-28 | 2009-08-12 | リアライズ・アドバンストテクノロジ株式会社 | 基板支持装置および基板取り外し方法 |
| KR20050045339A (ko) | 2003-11-11 | 2005-05-17 | 삼성전자주식회사 | 웨이퍼 이송장치 |
| JP4541824B2 (ja) * | 2004-10-14 | 2010-09-08 | リンテック株式会社 | 非接触型吸着保持装置 |
| KR100624882B1 (ko) | 2004-11-26 | 2006-09-18 | 가부시끼가이샤가이죠 | 기판 지지용 척 |
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| JP2007176637A (ja) | 2005-12-27 | 2007-07-12 | Harmotec Corp | 非接触搬送装置 |
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| JP5913162B2 (ja) | 2012-04-04 | 2016-04-27 | 東京エレクトロン株式会社 | 基板保持装置および基板保持方法 |
-
2012
- 2012-11-27 JP JP2015543233A patent/JP6198840B2/ja active Active
- 2012-11-27 US US14/647,729 patent/US10410906B2/en active Active
- 2012-11-27 WO PCT/CN2012/085319 patent/WO2014082196A1/fr active Application Filing
- 2012-11-27 SG SG11201503660VA patent/SG11201503660VA/en unknown
- 2012-11-27 CN CN201911043432.XA patent/CN110610894B/zh active Active
- 2012-11-27 CN CN201280077307.0A patent/CN104813460A/zh active Pending
- 2012-11-27 KR KR1020157016200A patent/KR102124417B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150088828A (ko) | 2015-08-03 |
| WO2014082196A1 (fr) | 2014-06-05 |
| KR102124417B1 (ko) | 2020-06-24 |
| JP6198840B2 (ja) | 2017-09-20 |
| CN110610894A (zh) | 2019-12-24 |
| US20150325466A1 (en) | 2015-11-12 |
| CN110610894B (zh) | 2023-08-04 |
| JP2015537385A (ja) | 2015-12-24 |
| CN104813460A (zh) | 2015-07-29 |
| US10410906B2 (en) | 2019-09-10 |
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