SG11201500235XA - Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices - Google Patents
Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devicesInfo
- Publication number
- SG11201500235XA SG11201500235XA SG11201500235XA SG11201500235XA SG11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA
- Authority
- SG
- Singapore
- Prior art keywords
- devices
- micromachines
- composition
- integrated circuit
- manufacturing integrated
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261671806P | 2012-07-16 | 2012-07-16 | |
| PCT/IB2013/055728 WO2014013396A2 (en) | 2012-07-16 | 2013-07-12 | Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201500235XA true SG11201500235XA (en) | 2015-02-27 |
Family
ID=49949313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201500235XA SG11201500235XA (en) | 2012-07-16 | 2013-07-12 | Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20150192854A1 (https=) |
| EP (1) | EP2875406A4 (https=) |
| JP (1) | JP6328630B2 (https=) |
| KR (1) | KR102107370B1 (https=) |
| CN (1) | CN104471487B (https=) |
| IL (1) | IL236457B (https=) |
| MY (1) | MY171072A (https=) |
| RU (1) | RU2015104902A (https=) |
| SG (1) | SG11201500235XA (https=) |
| TW (1) | TWI665177B (https=) |
| WO (1) | WO2014013396A2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015028576A (ja) * | 2013-07-01 | 2015-02-12 | 富士フイルム株式会社 | パターン形成方法 |
| KR102374206B1 (ko) | 2017-12-05 | 2022-03-14 | 삼성전자주식회사 | 반도체 장치 제조 방법 |
| WO2022008306A1 (en) * | 2020-07-09 | 2022-01-13 | Basf Se | Composition comprising a siloxane and an alkane for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4628023A (en) * | 1981-04-10 | 1986-12-09 | Shipley Company Inc. | Metal ion free photoresist developer composition with lower alkyl quaternary ammonium hydrozide as alkalai agent and a quaternary ammonium compound as surfactant |
| JP3707856B2 (ja) * | 1996-03-07 | 2005-10-19 | 富士通株式会社 | レジストパターンの形成方法 |
| JPH11218932A (ja) * | 1997-10-31 | 1999-08-10 | Nippon Zeon Co Ltd | ポリイミド系感光性樹脂組成物用現像液 |
| US6403289B1 (en) * | 1997-10-31 | 2002-06-11 | Nippon Zeon Co., Ltd. | Developer for photosensitive polyimide resin composition |
| JP4265741B2 (ja) * | 2003-02-28 | 2009-05-20 | 日本カーリット株式会社 | レジスト剥離剤 |
| JP3993549B2 (ja) * | 2003-09-30 | 2007-10-17 | 株式会社東芝 | レジストパターン形成方法 |
| US7157213B2 (en) * | 2004-03-01 | 2007-01-02 | Think Laboratory Co., Ltd. | Developer agent for positive type photosensitive compound |
| KR100993516B1 (ko) * | 2005-06-13 | 2010-11-10 | 가부시끼가이샤 도꾸야마 | 포토레지스트 현상액, 및 그 현상액을 사용한 기판의 제조방법 |
| JP5206304B2 (ja) * | 2008-10-15 | 2013-06-12 | 東ソー株式会社 | 第四級アンモニウム塩の回収方法 |
| KR101732747B1 (ko) * | 2009-03-12 | 2017-05-04 | 바스프 에스이 | 1-아다만틸트리메틸암모늄 히드록시드의 제조 방법 |
| WO2010127943A1 (en) * | 2009-05-07 | 2010-11-11 | Basf Se | Resist stripping compositions and methods for manufacturing electrical devices |
| EP2287669A1 (en) * | 2009-06-26 | 2011-02-23 | Rohm and Haas Electronic Materials, L.L.C. | Methods of forming electronic devices |
| CN101993377A (zh) * | 2009-08-07 | 2011-03-30 | 出光兴产株式会社 | 具有金刚烷骨架的胺类和季铵盐的制造方法 |
| JP2011145557A (ja) * | 2010-01-15 | 2011-07-28 | Tokyo Ohka Kogyo Co Ltd | フォトリソグラフィ用現像液 |
| JP6213296B2 (ja) * | 2013-04-10 | 2017-10-18 | 信越化学工業株式会社 | 現像液を用いたパターン形成方法 |
-
2013
- 2013-07-12 RU RU2015104902A patent/RU2015104902A/ru not_active Application Discontinuation
- 2013-07-12 JP JP2015522210A patent/JP6328630B2/ja active Active
- 2013-07-12 WO PCT/IB2013/055728 patent/WO2014013396A2/en not_active Ceased
- 2013-07-12 CN CN201380037762.2A patent/CN104471487B/zh active Active
- 2013-07-12 US US14/413,252 patent/US20150192854A1/en not_active Abandoned
- 2013-07-12 MY MYPI2015000076A patent/MY171072A/en unknown
- 2013-07-12 EP EP13819208.3A patent/EP2875406A4/en not_active Withdrawn
- 2013-07-12 SG SG11201500235XA patent/SG11201500235XA/en unknown
- 2013-07-12 KR KR1020157004223A patent/KR102107370B1/ko active Active
- 2013-07-15 TW TW102125198A patent/TWI665177B/zh active
-
2014
- 2014-12-25 IL IL236457A patent/IL236457B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN104471487A (zh) | 2015-03-25 |
| EP2875406A4 (en) | 2016-11-09 |
| JP2015524577A (ja) | 2015-08-24 |
| MY171072A (en) | 2019-09-24 |
| US20150192854A1 (en) | 2015-07-09 |
| IL236457B (en) | 2020-04-30 |
| TWI665177B (zh) | 2019-07-11 |
| JP6328630B2 (ja) | 2018-05-23 |
| WO2014013396A2 (en) | 2014-01-23 |
| IL236457A0 (en) | 2015-02-26 |
| EP2875406A2 (en) | 2015-05-27 |
| RU2015104902A (ru) | 2016-09-10 |
| WO2014013396A3 (en) | 2014-03-06 |
| TW201425279A (zh) | 2014-07-01 |
| KR20150042796A (ko) | 2015-04-21 |
| CN104471487B (zh) | 2019-07-09 |
| KR102107370B1 (ko) | 2020-05-07 |
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