SG10202100222WA - Polishing head system and polishing apparatus - Google Patents

Polishing head system and polishing apparatus

Info

Publication number
SG10202100222WA
SG10202100222WA SG10202100222WA SG10202100222WA SG10202100222WA SG 10202100222W A SG10202100222W A SG 10202100222WA SG 10202100222W A SG10202100222W A SG 10202100222WA SG 10202100222W A SG10202100222W A SG 10202100222WA SG 10202100222W A SG10202100222W A SG 10202100222WA
Authority
SG
Singapore
Prior art keywords
polishing
head system
polishing apparatus
polishing head
head
Prior art date
Application number
SG10202100222WA
Other languages
English (en)
Inventor
Kobata Itsuki
Yasuda Hozumi
Yanai Akio
Takahashi Nobuyuki
Nakamura Takamasa
SAKATA Keisuke
Takada Nobuyuki
Yagi Yuji
Takada Yasuhiro
Watanabe Katsuhide
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202100222WA publication Critical patent/SG10202100222WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10202100222WA 2020-01-17 2021-01-08 Polishing head system and polishing apparatus SG10202100222WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020006393A JP2021112797A (ja) 2020-01-17 2020-01-17 研磨ヘッドシステムおよび研磨装置

Publications (1)

Publication Number Publication Date
SG10202100222WA true SG10202100222WA (en) 2021-08-30

Family

ID=76810083

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202100222WA SG10202100222WA (en) 2020-01-17 2021-01-08 Polishing head system and polishing apparatus

Country Status (6)

Country Link
US (1) US12017323B2 (ko)
JP (1) JP2021112797A (ko)
KR (1) KR20210093167A (ko)
CN (1) CN113134785B (ko)
SG (1) SG10202100222WA (ko)
TW (1) TW202128350A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202116485A (zh) * 2019-08-27 2021-05-01 美商應用材料股份有限公司 化學機械拋光校正工具
US11862482B2 (en) * 2021-03-11 2024-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor substrate bonding tool and methods of operation
EP4353726A1 (en) 2021-07-07 2024-04-17 Tosoh Corporation Hole transport promoting material, material for light receiving element, cyano compound, and organic light receiving element
WO2024008338A1 (en) * 2022-07-08 2024-01-11 Struers ApS A grinding and/or polishing machine and a specimen holder
JP2024057926A (ja) * 2022-10-13 2024-04-25 株式会社荏原製作所 トップリングおよび基板処理装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD206612A1 (de) * 1982-06-25 1984-02-01 Klaus Brueckner Schaltungsanordnung zur regelung von fremderregten generatoren
JPH09225820A (ja) 1996-02-23 1997-09-02 Hitachi Ltd 研磨装置
JPH10128655A (ja) 1996-10-31 1998-05-19 Toshiba Corp 研磨装置
US5868896A (en) 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
KR100475845B1 (ko) * 1997-04-04 2005-06-17 도쿄 세이미츄 코퍼레이션 리미티드 연마장치
JPH1170460A (ja) 1997-08-28 1999-03-16 Canon Inc 配線基板の平坦化研磨方法および装置
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
JP2000006002A (ja) * 1998-06-17 2000-01-11 Ebara Corp ポリッシング装置
JP2000246628A (ja) * 1999-02-23 2000-09-12 Ebara Corp 基板把持装置及び研磨装置
JP4476398B2 (ja) * 1999-11-02 2010-06-09 三菱マテリアル株式会社 ウェーハ研磨装置及び研磨状態検出方法
US6325696B1 (en) 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
US6542326B1 (en) * 1999-10-28 2003-04-01 Seagate Technology Llc Microactuator-induced reactive forces for fine positioning a sensor
JP3835122B2 (ja) * 2000-05-29 2006-10-18 信越半導体株式会社 ワークの研磨方法
US6863771B2 (en) 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6859984B2 (en) * 2002-09-05 2005-03-01 Vermon Method for providing a matrix array ultrasonic transducer with an integrated interconnection means
US7131891B2 (en) * 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
DE102005016411B4 (de) 2005-04-08 2007-03-29 IGAM Ingenieurgesellschaft für angewandte Mechanik mbH Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes
CN101543974B (zh) * 2008-03-28 2011-12-14 新科实业有限公司 磁头滑块的研磨装置和研磨方法
KR101225490B1 (ko) * 2011-03-10 2013-01-23 이병수 웨이퍼 연마속도 제어장치, 웨이퍼 연마장치 및 그를 이용한 웨이퍼 연마방법
JP6046933B2 (ja) * 2012-07-10 2016-12-21 株式会社荏原製作所 研磨方法
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
US20140273766A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Polishing System with Front Side Pressure Control
NL2012419B1 (en) * 2014-03-13 2016-01-06 Novioscan B V High voltage MEMS, and a portable ultrasound device comprising such a MEMS.
JP2015193065A (ja) * 2014-03-31 2015-11-05 株式会社荏原製作所 研磨装置および研磨方法
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
JP6562779B2 (ja) * 2015-09-02 2019-08-21 株式会社荏原製作所 研磨装置及び研磨方法
JP6884015B2 (ja) * 2017-03-22 2021-06-09 株式会社荏原製作所 基板の研磨装置および研磨方法
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
WO2019069454A1 (ja) * 2017-10-06 2019-04-11 ギガフォトン株式会社 極端紫外光生成装置及びターゲット供給装置
JP6847811B2 (ja) * 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
JP2019149461A (ja) * 2018-02-27 2019-09-05 株式会社ディスコ 加工装置
US10795346B2 (en) * 2018-03-13 2020-10-06 Applied Materials, Inc. Machine learning systems for monitoring of semiconductor processing
KR102130883B1 (ko) * 2018-04-02 2020-07-06 주식회사 케이씨텍 압력 검출 장치 및 이를 포함하는 기판 연마 시스템
JP6480626B1 (ja) * 2018-07-11 2019-03-13 誠 勝部 携帯端末用発電装置

Also Published As

Publication number Publication date
JP2021112797A (ja) 2021-08-05
CN113134785A (zh) 2021-07-20
CN113134785B (zh) 2024-05-14
US20210237224A1 (en) 2021-08-05
KR20210093167A (ko) 2021-07-27
US12017323B2 (en) 2024-06-25
TW202128350A (zh) 2021-08-01

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