SG10202102760UA - Polishing head system and polishing apparatus - Google Patents

Polishing head system and polishing apparatus

Info

Publication number
SG10202102760UA
SG10202102760UA SG10202102760UA SG10202102760UA SG 10202102760U A SG10202102760U A SG 10202102760UA SG 10202102760U A SG10202102760U A SG 10202102760UA SG 10202102760U A SG10202102760U A SG 10202102760UA
Authority
SG
Singapore
Prior art keywords
polishing
head system
polishing apparatus
polishing head
head
Prior art date
Application number
Inventor
Watanabe Katsuhide
Kobata Itsuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202102760UA publication Critical patent/SG10202102760UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202102760U 2020-03-26 2021-03-18 Polishing head system and polishing apparatus SG10202102760UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020056240A JP7365282B2 (en) 2020-03-26 2020-03-26 Polishing head system and polishing equipment

Publications (1)

Publication Number Publication Date
SG10202102760UA true SG10202102760UA (en) 2021-10-28

Family

ID=77809393

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202102760U SG10202102760UA (en) 2020-03-26 2021-03-18 Polishing head system and polishing apparatus

Country Status (6)

Country Link
US (1) US11673222B2 (en)
JP (1) JP7365282B2 (en)
KR (1) KR20210120860A (en)
CN (1) CN113442054A (en)
SG (1) SG10202102760UA (en)
TW (1) TW202135983A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023517454A (en) * 2020-06-24 2023-04-26 アプライド マテリアルズ インコーポレイテッド Polishing of carrier head by piezoelectric pressure control
CN115151376B (en) * 2020-07-08 2024-05-24 应用材料公司 Multi-tooth magnetic control retaining ring
US20230063687A1 (en) * 2021-08-27 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Apparatus for polishing a wafer
JP2023045831A (en) 2021-09-22 2023-04-03 日亜化学工業株式会社 Light-emitting device and manufacturing method of light-emitting device
US20230219189A1 (en) * 2022-01-07 2023-07-13 Applied Materials, Inc. Apparatus and method for selective material removal during polishing
WO2023176611A1 (en) * 2022-03-14 2023-09-21 株式会社荏原製作所 Substrate polishing device, substrate polishing method, polishing device, and polishing method
CN114800052B (en) * 2022-03-18 2023-09-26 大连理工大学 Grinding method for improving surface shape of optical wafer

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09225820A (en) 1996-02-23 1997-09-02 Hitachi Ltd Polishing device
JPH10128655A (en) 1996-10-31 1998-05-19 Toshiba Corp Polishing device
US5868896A (en) * 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
KR100475845B1 (en) * 1997-04-04 2005-06-17 도쿄 세이미츄 코퍼레이션 리미티드 Polishing device
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US5997384A (en) * 1997-12-22 1999-12-07 Micron Technology, Inc. Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates
JP2000127024A (en) 1998-10-27 2000-05-09 Toshiba Corp Polishing device and polishing method
JP2000246628A (en) 1999-02-23 2000-09-12 Ebara Corp Substrate holding device and polishing device
TW436382B (en) * 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6290584B1 (en) * 1999-08-13 2001-09-18 Speedfam-Ipec Corporation Workpiece carrier with segmented and floating retaining elements
US6325696B1 (en) * 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
JP3753577B2 (en) * 1999-11-16 2006-03-08 株式会社荏原製作所 Substrate holding device and polishing apparatus provided with the substrate holding device
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6776695B2 (en) * 2000-12-21 2004-08-17 Lam Research Corporation Platen design for improving edge performance in CMP applications
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
DE10303407A1 (en) * 2003-01-27 2004-08-19 Friedrich-Schiller-Universität Jena Method and device for high-precision processing of the surface of an object, in particular for polishing and lapping semiconductor substrates
US7131891B2 (en) 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
JP2006048302A (en) * 2004-08-03 2006-02-16 Sony Corp Piezoelectric complex unit, its manufacturing method, its handling method, its control method, input/output device and electronic equipment
US7048621B2 (en) * 2004-10-27 2006-05-23 Applied Materials Inc. Retaining ring deflection control
CN104044057B (en) * 2004-11-01 2017-05-17 株式会社荏原制作所 Polishing device
CN100548577C (en) * 2005-01-21 2009-10-14 株式会社荏原制作所 The method and apparatus of substrate polishing
TWI386989B (en) * 2005-02-25 2013-02-21 Ebara Corp Polishing apparatus and polishing method
JP4762647B2 (en) 2005-02-25 2011-08-31 株式会社荏原製作所 Polishing apparatus and polishing method
JP5464820B2 (en) * 2007-10-29 2014-04-09 株式会社荏原製作所 Polishing equipment
JP5148259B2 (en) * 2007-12-14 2013-02-20 株式会社 東北テクノアーチ Processing equipment
US20090311945A1 (en) * 2008-06-17 2009-12-17 Roland Strasser Planarization System
JP5980476B2 (en) 2010-12-27 2016-08-31 株式会社荏原製作所 Polishing apparatus and polishing method
EP2771968B1 (en) * 2011-10-25 2017-12-13 Robert Bosch GmbH Actuating device
US20140273766A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Polishing System with Front Side Pressure Control
JP6145342B2 (en) * 2013-07-12 2017-06-07 株式会社荏原製作所 Film thickness measuring apparatus, film thickness measuring method, and polishing apparatus equipped with film thickness measuring apparatus
JP6454326B2 (en) * 2014-04-18 2019-01-16 株式会社荏原製作所 Substrate processing apparatus, substrate processing system, and substrate processing method
US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
JP6562779B2 (en) 2015-09-02 2019-08-21 株式会社荏原製作所 Polishing apparatus and polishing method
JP6585445B2 (en) * 2015-09-28 2019-10-02 株式会社荏原製作所 Polishing method
JP6818614B2 (en) 2017-03-31 2021-01-20 株式会社荏原製作所 Substrate processing equipment and substrate processing system including substrate processing equipment

Also Published As

Publication number Publication date
JP7365282B2 (en) 2023-10-19
CN113442054A (en) 2021-09-28
TW202135983A (en) 2021-10-01
KR20210120860A (en) 2021-10-07
JP2021154421A (en) 2021-10-07
US20210308823A1 (en) 2021-10-07
US11673222B2 (en) 2023-06-13

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