SG10202100330YA - Grinding apparatus - Google Patents

Grinding apparatus

Info

Publication number
SG10202100330YA
SG10202100330YA SG10202100330YA SG10202100330YA SG10202100330YA SG 10202100330Y A SG10202100330Y A SG 10202100330YA SG 10202100330Y A SG10202100330Y A SG 10202100330YA SG 10202100330Y A SG10202100330Y A SG 10202100330YA SG 10202100330Y A SG10202100330Y A SG 10202100330YA
Authority
SG
Singapore
Prior art keywords
grinding apparatus
grinding
Prior art date
Application number
SG10202100330YA
Inventor
Sudo Yujiro
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202100330YA publication Critical patent/SG10202100330YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
SG10202100330YA 2020-02-04 2021-01-12 Grinding apparatus SG10202100330YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020016990A JP7430448B2 (en) 2020-02-04 2020-02-04 Grinding equipment and grinding method

Publications (1)

Publication Number Publication Date
SG10202100330YA true SG10202100330YA (en) 2021-09-29

Family

ID=76854117

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202100330YA SG10202100330YA (en) 2020-02-04 2021-01-12 Grinding apparatus

Country Status (7)

Country Link
US (1) US11612980B2 (en)
JP (1) JP7430448B2 (en)
KR (1) KR20210099521A (en)
CN (1) CN113211241A (en)
DE (1) DE102021201032A1 (en)
SG (1) SG10202100330YA (en)
TW (1) TW202131443A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114770289B (en) * 2022-03-23 2024-02-06 深圳市智能机器人研究院 Grinding and polishing device and calibration method
CN115179161A (en) * 2022-07-25 2022-10-14 何圣榜 Mechanical automation processing equipment and operation method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3467807B2 (en) * 1993-09-30 2003-11-17 豊田工機株式会社 Grinding equipment
US6656818B1 (en) * 1999-09-20 2003-12-02 Shin-Etsu Handotai Co., Ltd. Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing
US20040014401A1 (en) * 2001-08-07 2004-01-22 Chun-Cheng Tsao Method for backside die thinning and polishing of packaged integrated circuits
JP2009043931A (en) * 2007-08-08 2009-02-26 Disco Abrasive Syst Ltd Rear-surface grinding method for wafer
JP5276823B2 (en) 2007-10-04 2013-08-28 株式会社ディスコ Wafer grinding equipment
US8968052B2 (en) * 2011-10-21 2015-03-03 Strasbaugh Systems and methods of wafer grinding
US9393669B2 (en) * 2011-10-21 2016-07-19 Strasbaugh Systems and methods of processing substrates
JP6336772B2 (en) 2014-02-14 2018-06-06 株式会社ディスコ Grinding and polishing equipment
JP2015160260A (en) * 2014-02-26 2015-09-07 株式会社東芝 Grinding device and grinding method
US9656370B2 (en) * 2015-10-06 2017-05-23 Disco Corporation Grinding method
JP6632356B2 (en) 2015-12-10 2020-01-22 株式会社東京精密 Grinding equipment
JP6869051B2 (en) 2017-02-27 2021-05-12 株式会社東京精密 Grinding device

Also Published As

Publication number Publication date
KR20210099521A (en) 2021-08-12
DE102021201032A1 (en) 2021-08-05
CN113211241A (en) 2021-08-06
TW202131443A (en) 2021-08-16
JP2021122881A (en) 2021-08-30
US20210237225A1 (en) 2021-08-05
JP7430448B2 (en) 2024-02-13
US11612980B2 (en) 2023-03-28

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