SG10202009887TA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10202009887TA
SG10202009887TA SG10202009887TA SG10202009887TA SG10202009887TA SG 10202009887T A SG10202009887T A SG 10202009887TA SG 10202009887T A SG10202009887T A SG 10202009887TA SG 10202009887T A SG10202009887T A SG 10202009887TA SG 10202009887T A SG10202009887T A SG 10202009887TA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10202009887TA
Inventor
KABASAWA Masashi
Motoshima Yasuyuki
Matsuo Hisanori
Kamiki Keisuke
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202009887TA publication Critical patent/SG10202009887TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
SG10202009887TA 2019-10-16 2020-10-06 Polishing apparatus SG10202009887TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019189304A JP7397617B2 (en) 2019-10-16 2019-10-16 polishing equipment

Publications (1)

Publication Number Publication Date
SG10202009887TA true SG10202009887TA (en) 2021-05-28

Family

ID=75403249

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202009887TA SG10202009887TA (en) 2019-10-16 2020-10-06 Polishing apparatus

Country Status (6)

Country Link
US (1) US11897080B2 (en)
JP (1) JP7397617B2 (en)
KR (1) KR20210045314A (en)
CN (1) CN112658972A (en)
SG (1) SG10202009887TA (en)
TW (1) TW202117829A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (en) * 2021-01-14 2022-07-27 株式会社荏原製作所 Polishing device, polishing method, and method for outputting visualized information on film thickness distribution of base plate
CN113732936B (en) * 2021-05-08 2022-07-15 清华大学 Polishing temperature control device, chemical mechanical polishing system and method
CN113442068A (en) * 2021-05-08 2021-09-28 华海清科(北京)科技有限公司 Polishing solution conveying device and chemical mechanical polishing equipment
CN113442058A (en) * 2021-05-08 2021-09-28 华海清科股份有限公司 Polishing solution conveying device and chemical mechanical polishing equipment
CN114986325B (en) * 2022-06-10 2023-09-22 中国工程物理研究院激光聚变研究中心 Optical element full-caliber polishing local area constant temperature processing device and polishing machine

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957750A (en) * 1997-12-18 1999-09-28 Micron Technology, Inc. Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
US6315635B1 (en) * 1999-03-31 2001-11-13 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for slurry temperature control in a polishing process
JP2001162517A (en) 1999-12-03 2001-06-19 Sony Corp Polishing device
JP2005056987A (en) 2003-08-01 2005-03-03 Nitta Haas Inc Polishing apparatus and method
JP4160569B2 (en) * 2004-05-31 2008-10-01 株式会社東芝 Manufacturing method of semiconductor device
JP2006196696A (en) 2005-01-13 2006-07-27 Shinwa Shokai:Kk Heater unit and heating method in heater unit
US20060226123A1 (en) * 2005-04-07 2006-10-12 Applied Materials, Inc. Profile control using selective heating
JP4787063B2 (en) * 2005-12-09 2011-10-05 株式会社荏原製作所 Polishing apparatus and polishing method
US8591286B2 (en) * 2010-08-11 2013-11-26 Applied Materials, Inc. Apparatus and method for temperature control during polishing
JP2012148376A (en) * 2011-01-20 2012-08-09 Ebara Corp Polishing method and polishing apparatus
US9005999B2 (en) * 2012-06-30 2015-04-14 Applied Materials, Inc. Temperature control of chemical mechanical polishing
JP2014124730A (en) * 2012-12-27 2014-07-07 Ebara Corp Substrate polishing device, heat transmission member, and temperature control method for surface of polishing pad
JP6373796B2 (en) 2014-05-29 2018-08-15 株式会社荏原製作所 Substrate polishing equipment
JP6929072B2 (en) * 2016-02-22 2021-09-01 株式会社荏原製作所 Equipment and methods for adjusting the surface temperature of the polishing pad
JP6752657B2 (en) 2016-08-23 2020-09-09 株式会社荏原製作所 Polishing method and polishing equipment
CN207480364U (en) * 2016-11-25 2018-06-12 凯斯科技股份有限公司 Chemical machinery substrate grinding device
JP6923342B2 (en) 2017-04-11 2021-08-18 株式会社荏原製作所 Polishing equipment and polishing method
TWI825043B (en) 2017-11-14 2023-12-11 美商應用材料股份有限公司 Method and system for temperature control of chemical mechanical polishing

Also Published As

Publication number Publication date
KR20210045314A (en) 2021-04-26
TW202117829A (en) 2021-05-01
JP7397617B2 (en) 2023-12-13
US11897080B2 (en) 2024-02-13
JP2021062455A (en) 2021-04-22
CN112658972A (en) 2021-04-16
US20210114164A1 (en) 2021-04-22

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