SG10202012501UA - Method for producing semiconductor device and apparatus for producing the same - Google Patents

Method for producing semiconductor device and apparatus for producing the same

Info

Publication number
SG10202012501UA
SG10202012501UA SG10202012501UA SG10202012501UA SG10202012501UA SG 10202012501U A SG10202012501U A SG 10202012501UA SG 10202012501U A SG10202012501U A SG 10202012501UA SG 10202012501U A SG10202012501U A SG 10202012501UA SG 10202012501U A SG10202012501U A SG 10202012501UA
Authority
SG
Singapore
Prior art keywords
producing
semiconductor device
same
producing semiconductor
semiconductor
Prior art date
Application number
SG10202012501UA
Other languages
English (en)
Inventor
Tatsuiwa Tsuyoshi
HIRAKI Kazuo
Original Assignee
Suzuki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzuki Co Ltd filed Critical Suzuki Co Ltd
Publication of SG10202012501UA publication Critical patent/SG10202012501UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG10202012501UA 2019-12-24 2020-12-14 Method for producing semiconductor device and apparatus for producing the same SG10202012501UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019232231A JP6691998B1 (ja) 2019-12-24 2019-12-24 半導体装置の製造方法及び半導体装置の製造装置

Publications (1)

Publication Number Publication Date
SG10202012501UA true SG10202012501UA (en) 2021-07-29

Family

ID=70549829

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202012501UA SG10202012501UA (en) 2019-12-24 2020-12-14 Method for producing semiconductor device and apparatus for producing the same

Country Status (5)

Country Link
JP (1) JP6691998B1 (ko)
KR (1) KR102212841B1 (ko)
CN (1) CN113036026B (ko)
SG (1) SG10202012501UA (ko)
TW (1) TWI721912B (ko)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700519A (en) 1969-05-13 1972-10-24 Ciba Geigy Corp Methods of forming a fiber reinforced pipe on an inflatable mandrel
JPS5721213A (en) 1980-07-14 1982-02-03 Mitsubishi Metal Corp Drill
JPH0577939U (ja) * 1992-03-27 1993-10-22 セイコーエプソン株式会社 回路の接続方法
JPH06164130A (ja) * 1992-11-18 1994-06-10 Toshiba Corp プリント基板のリフロー炉
JP3146888B2 (ja) * 1994-10-31 2001-03-19 松下電器産業株式会社 電子部品の仮止め用ボンド
US5639010A (en) * 1995-08-31 1997-06-17 Ford Motor Company Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices
JPH09162235A (ja) * 1995-12-05 1997-06-20 Hitachi Chem Co Ltd Ｉｃチップの実装方法及び接続部材
JPH11298136A (ja) * 1998-04-10 1999-10-29 Toyo Commun Equip Co Ltd リフロー装置
JP2000133929A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd リフロー加熱方法及びリフロー装置
JP4278753B2 (ja) * 1999-01-26 2009-06-17 パナソニック株式会社 基板搬送装置
DE60025720T2 (de) * 1999-06-18 2006-11-09 Hitachi Chemical Co., Ltd. Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält
JP3402280B2 (ja) * 1999-09-20 2003-05-06 ソニーケミカル株式会社 接続方法
JP2001308501A (ja) * 2000-04-27 2001-11-02 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP4175057B2 (ja) * 2002-08-26 2008-11-05 松下電器産業株式会社 電子部品実装システム
WO2005005088A2 (en) * 2003-07-01 2005-01-20 Chippac, Inc. Method and apparatus for flip chip attachment by post-collapse re-melt and re-solidification of bumps
JP4818952B2 (ja) * 2007-02-26 2011-11-16 株式会社鈴木 リフロー炉
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
WO2012111814A1 (ja) * 2011-02-18 2012-08-23 古河電気工業株式会社 配線基板およびその製造方法ならびに半導体装置
JP2014072305A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体モジュールの製造方法、接合装置、半導体モジュール
CN105308730A (zh) * 2013-08-22 2016-02-03 积水化学工业株式会社 半导体用粘接剂
WO2016148004A1 (ja) 2015-03-18 2016-09-22 デクセリアルズ株式会社 発光装置製造方法
JP6402127B2 (ja) * 2016-03-09 2018-10-10 株式会社タムラ製作所 電子部品の接合方法
WO2018147163A1 (ja) * 2017-02-13 2018-08-16 デクセリアルズ株式会社 接続構造体、異方性接着材料、および接続構造体の製造方法
JP7362286B2 (ja) * 2018-05-07 2023-10-17 キヤノン株式会社 プリント回路板の製造方法、プリント回路板、及び電子機器

Also Published As

Publication number Publication date
KR102212841B1 (ko) 2021-02-05
TWI721912B (zh) 2021-03-11
CN113036026B (zh) 2022-04-19
CN113036026A (zh) 2021-06-25
TW202126135A (zh) 2021-07-01
JP6691998B1 (ja) 2020-05-13
JP2021100084A (ja) 2021-07-01

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