SG10202006118SA - Memory device - Google Patents

Memory device

Info

Publication number
SG10202006118SA
SG10202006118SA SG10202006118SA SG10202006118SA SG10202006118SA SG 10202006118S A SG10202006118S A SG 10202006118SA SG 10202006118S A SG10202006118S A SG 10202006118SA SG 10202006118S A SG10202006118S A SG 10202006118SA SG 10202006118S A SG10202006118S A SG 10202006118SA
Authority
SG
Singapore
Prior art keywords
memory device
memory
Prior art date
Application number
SG10202006118SA
Other languages
English (en)
Inventor
Song Seungmin
Koh Beyounghyun
Kwon Yongjin
Kim Kangmin
Shin Jaehoon
Shin Joongshik
Ahn Sungsoo
Lee Seunghwan
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10202006118SA publication Critical patent/SG10202006118SA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/10EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B43/23EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/40EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/50EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
SG10202006118SA 2019-10-10 2020-06-25 Memory device SG10202006118SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190125694A KR20210042759A (ko) 2019-10-10 2019-10-10 메모리 장치

Publications (1)

Publication Number Publication Date
SG10202006118SA true SG10202006118SA (en) 2021-05-28

Family

ID=75155992

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202006118SA SG10202006118SA (en) 2019-10-10 2020-06-25 Memory device

Country Status (6)

Country Link
US (2) US11430808B2 (ko)
JP (1) JP2021064778A (ko)
KR (1) KR20210042759A (ko)
CN (1) CN112652628A (ko)
DE (1) DE102020111651B4 (ko)
SG (1) SG10202006118SA (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI844824B (zh) * 2022-02-23 2024-06-11 旺宏電子股份有限公司 半導體結構與其製作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102002802B1 (ko) 2012-09-05 2019-07-23 삼성전자주식회사 반도체 장치
KR102161814B1 (ko) * 2013-11-19 2020-10-06 삼성전자주식회사 수직형 메모리 장치 및 그 제조 방법
US10202910B2 (en) 2014-07-07 2019-02-12 Ford Global Technologies, Llc System and method for selective cylinder deactivation
KR20160080365A (ko) 2014-12-29 2016-07-08 에스케이하이닉스 주식회사 전자 장치 및 그 제조 방법
KR20170011394A (ko) 2015-07-22 2017-02-02 에스케이하이닉스 주식회사 반도체 장치 및 그 제조 방법
US20170104000A1 (en) 2015-10-13 2017-04-13 Joo-Hee PARK Vertical memory devices
KR20170119158A (ko) 2016-04-18 2017-10-26 삼성전자주식회사 반도체 메모리 장치 및 반도체 장치
KR102630954B1 (ko) 2016-11-08 2024-01-31 에스케이하이닉스 주식회사 반도체 장치 및 그 제조방법
KR20180106727A (ko) 2017-03-21 2018-10-01 에스케이하이닉스 주식회사 반도체 장치 및 그 제조 방법
US10685914B2 (en) 2017-08-31 2020-06-16 SK Hynix Inc. Semiconductor device and manufacturing method thereof
KR102521282B1 (ko) 2017-10-12 2023-04-14 에스케이하이닉스 주식회사 반도체 장치 및 그 제조방법
KR102484394B1 (ko) 2017-12-06 2023-01-03 삼성전자주식회사 반도체 장치
US11342351B2 (en) 2018-01-10 2022-05-24 Samsung Electronics Co., Ltd. Three-dimensional semiconductor device

Also Published As

Publication number Publication date
DE102020111651A1 (de) 2021-04-15
CN112652628A (zh) 2021-04-13
DE102020111651A9 (de) 2021-06-10
DE102020111651B4 (de) 2024-10-17
KR20210042759A (ko) 2021-04-20
JP2021064778A (ja) 2021-04-22
US20220367513A1 (en) 2022-11-17
US11430808B2 (en) 2022-08-30
US20210111188A1 (en) 2021-04-15

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