SG10201901934TA - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
SG10201901934TA
SG10201901934TA SG10201901934TA SG10201901934TA SG 10201901934T A SG10201901934T A SG 10201901934TA SG 10201901934T A SG10201901934T A SG 10201901934TA SG 10201901934T A SG10201901934T A SG 10201901934TA
Authority
SG
Singapore
Prior art keywords
holding portion
blade
moving support
removal
cutting
Prior art date
Application number
Other languages
English (en)
Inventor
Kazuki Terada
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201901934TA publication Critical patent/SG10201901934TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/157—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling of rotary tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/157—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling of rotary tools
    • B23Q3/15713—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling of rotary tools a transfer device taking a single tool from a storage device and inserting it in a spindle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/02—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
    • B23D45/021—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
    • B23D45/022—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage the carriage performing a vertical movement only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
    • B26D5/22—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member and work feed mechanically connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D35/00—Tools for shearing machines or shearing devices; Holders or chucks for shearing tools
    • B23D35/008—Means for changing the cutting members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B26D1/16—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable arm or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Confectionery (AREA)
SG10201901934T 2018-03-19 2019-03-05 Cutting apparatus SG10201901934TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018051164A JP7126749B2 (ja) 2018-03-19 2018-03-19 切削装置

Publications (1)

Publication Number Publication Date
SG10201901934TA true SG10201901934TA (en) 2019-10-30

Family

ID=67774183

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201901934T SG10201901934TA (en) 2018-03-19 2019-03-05 Cutting apparatus

Country Status (7)

Country Link
US (1) US11311976B2 (de)
JP (1) JP7126749B2 (de)
KR (1) KR102533802B1 (de)
CN (1) CN110281407B (de)
DE (1) DE102019203700B4 (de)
SG (1) SG10201901934TA (de)
TW (1) TWI787481B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7216613B2 (ja) * 2019-05-16 2023-02-01 株式会社ディスコ 加工装置
JP7285754B2 (ja) * 2019-10-10 2023-06-02 株式会社ディスコ 加工装置
JP7430452B2 (ja) * 2020-04-10 2024-02-13 株式会社ディスコ 切削装置、切削ブレードの交換方法及びボードの交換方法
CN112692369A (zh) * 2020-12-15 2021-04-23 重庆凯州标牌有限公司 一种用于标牌生产的智能切割设备
CN112743155A (zh) * 2020-12-15 2021-05-04 重庆凯州标牌有限公司 一种标牌生产用切割设备的切割装置
CN112692370A (zh) * 2020-12-15 2021-04-23 重庆凯州标牌有限公司 一种安全性高的用于标牌生产的切割设备
JP2022101893A (ja) * 2020-12-25 2022-07-07 株式会社ディスコ ブレード交換装置
CN113400490B (zh) * 2021-05-25 2022-09-02 浙江中垚建设有限公司 一种工业化建筑用安全高效的墙板切割机
CN114603626B (zh) * 2022-03-14 2024-05-10 湖北东进包装有限公司 一种集压紧切割及送出一体的泡沫塑料包装内衬切割装置
CN114683311B (zh) * 2022-05-31 2022-08-16 季华实验室 一种被动式的多向微动末端执行器
KR102580420B1 (ko) * 2023-07-05 2023-09-18 정명한 사이드 트리머의 트리밍 나이프 교체장치

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4702136A (en) * 1986-05-22 1987-10-27 Mechtrix Corporation Tool holder for wire cutter
JPH04322993A (ja) * 1991-04-17 1992-11-12 Daikin Ind Ltd 対象物取扱装置
JP2617876B2 (ja) * 1994-02-04 1997-06-04 株式会社ディスコ ブレードオートチェンジャー
KR960028442U (ko) * 1995-02-28 1996-09-17 절삭날 교환장치
JPH0985668A (ja) * 1995-09-28 1997-03-31 Fanuc Ltd フローティング機構
JP3494811B2 (ja) 1996-06-18 2004-02-09 新日本製鐵株式会社 圧延機におけるロールのスラストリング装置の給排油装置
JP4757552B2 (ja) 2005-07-08 2011-08-24 本田技研工業株式会社 燃料電池自動車構造
JP4837970B2 (ja) 2005-10-06 2011-12-14 株式会社ディスコ 切削ブレードの交換装置
JP4837973B2 (ja) * 2005-10-13 2011-12-14 株式会社ディスコ 切削ブレードの交換装置
JP2007208114A (ja) 2006-02-03 2007-08-16 Disco Abrasive Syst Ltd 切削装置
JP5014892B2 (ja) * 2007-06-25 2012-08-29 株式会社ディスコ ブレード交換工具
DE102007044275A1 (de) 2007-09-17 2009-03-19 Reform Maschinenfabrik Adolf Rabenseifner Gmbh & Co. Kg Schleifmaschine, insbesondere Hochgeschwindigkeitsschleifmaschine
EP2457799B1 (de) * 2010-11-12 2019-01-09 Stäubli Tec-Systems GmbH Multikupplung
JP5216075B2 (ja) * 2010-12-22 2013-06-19 Ｔｏｗａ株式会社 ブレード着脱装置
JP5918044B2 (ja) * 2012-06-25 2016-05-18 株式会社ディスコ 加工方法および加工装置
JP6013143B2 (ja) * 2012-11-08 2016-10-25 サクラファインテックジャパン株式会社 替刃供給機構
JP2014120494A (ja) * 2012-12-13 2014-06-30 Disco Abrasive Syst Ltd ウエーハの加工方法
JP6101140B2 (ja) * 2013-04-18 2017-03-22 株式会社ディスコ 切削装置
JP6223862B2 (ja) * 2014-02-27 2017-11-01 株式会社ディスコ 切削装置
JP6355441B2 (ja) * 2014-06-09 2018-07-11 株式会社ディスコ ハブブレード用治具及びハブブレードの取り付け方法
CN204278266U (zh) * 2014-11-19 2015-04-22 王丹 一种刀架水平度调整的调节机构
JP2016132046A (ja) * 2015-01-16 2016-07-25 株式会社ディスコ マウントフランジ
JP6465668B2 (ja) 2015-01-26 2019-02-06 株式会社ディスコ 修正装置
JP6403595B2 (ja) 2015-02-06 2018-10-10 株式会社ディスコ 位置調整治具及び位置調整方法
JP6410626B2 (ja) * 2015-02-06 2018-10-24 株式会社ディスコ 切削装置
JP6695102B2 (ja) * 2015-05-26 2020-05-20 株式会社ディスコ 加工システム
JP6698436B2 (ja) * 2016-06-14 2020-05-27 株式会社ディスコ ブレードケース
JP6934334B2 (ja) * 2017-06-30 2021-09-15 株式会社ディスコ 切削ブレードの装着方法
JP7206065B2 (ja) * 2018-07-26 2023-01-17 株式会社ディスコ 切削装置
JP7313202B2 (ja) * 2019-06-18 2023-07-24 株式会社ディスコ 切削装置及び交換方法

Also Published As

Publication number Publication date
CN110281407A (zh) 2019-09-27
US11311976B2 (en) 2022-04-26
DE102019203700A1 (de) 2019-09-19
KR20190110030A (ko) 2019-09-27
DE102019203700B4 (de) 2024-03-21
JP2019162679A (ja) 2019-09-26
KR102533802B1 (ko) 2023-05-17
TWI787481B (zh) 2022-12-21
TW201938314A (zh) 2019-10-01
JP7126749B2 (ja) 2022-08-29
US20190283195A1 (en) 2019-09-19
CN110281407B (zh) 2022-08-30

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