SG10201704180PA - Method and apparatus for processing wafer-shaped articles - Google Patents

Method and apparatus for processing wafer-shaped articles

Info

Publication number
SG10201704180PA
SG10201704180PA SG10201704180PA SG10201704180PA SG10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA
Authority
SG
Singapore
Prior art keywords
shaped articles
processing wafer
wafer
processing
articles
Prior art date
Application number
SG10201704180PA
Other languages
English (en)
Inventor
Mui David
Berney Butch
Goller Alois
Ravkin Mike
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of SG10201704180PA publication Critical patent/SG10201704180PA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
SG10201704180PA 2016-05-31 2017-05-23 Method and apparatus for processing wafer-shaped articles SG10201704180PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/169,330 US10720343B2 (en) 2016-05-31 2016-05-31 Method and apparatus for processing wafer-shaped articles

Publications (1)

Publication Number Publication Date
SG10201704180PA true SG10201704180PA (en) 2017-12-28

Family

ID=60418268

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201704180PA SG10201704180PA (en) 2016-05-31 2017-05-23 Method and apparatus for processing wafer-shaped articles

Country Status (6)

Country Link
US (2) US10720343B2 (https=)
JP (2) JP7231321B2 (https=)
KR (1) KR102101536B1 (https=)
CN (1) CN107452654B (https=)
SG (1) SG10201704180PA (https=)
TW (1) TWI734788B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10861719B2 (en) 2016-05-31 2020-12-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles

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KR102208753B1 (ko) * 2018-04-06 2021-01-28 세메스 주식회사 기판 지지 유닛 및 이를 갖는 기판 처리 장치
KR102078157B1 (ko) 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
KR102102277B1 (ko) 2018-09-20 2020-04-20 주식회사 에이치에스하이테크 웨이퍼를 프로세싱하기 위한 장치
KR102244605B1 (ko) 2018-09-20 2021-04-26 주식회사 에이치에스하이테크 웨이퍼를 프로세싱하기 위한 장치
KR102102202B1 (ko) * 2018-11-07 2020-04-21 세메스 주식회사 기판 처리 장치 및 시스템
GB201900912D0 (en) 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
GB201901637D0 (en) 2019-02-06 2019-03-27 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
KR102232654B1 (ko) * 2019-08-05 2021-03-26 주식회사 에이치에스하이테크 엘이디 스핀척
KR102303593B1 (ko) * 2019-11-05 2021-09-23 세메스 주식회사 기판 처리 장치 및 방법
KR102347145B1 (ko) * 2020-01-29 2022-01-04 무진전자 주식회사 회전 척에 내장된 광원을 이용한 기판 처리 장치
GB202002798D0 (en) 2020-02-27 2020-04-15 Lam Res Ag Apparatus for processing a wafer
JP7717717B2 (ja) * 2020-04-01 2025-08-04 ラム リサーチ コーポレーション 熱エッチングのための急速かつ正確な温度制御
KR102347146B1 (ko) * 2020-06-09 2022-01-04 무진전자 주식회사 광원을 이용한 기판 처리 장치
GB202015527D0 (en) 2020-09-30 2020-11-11 Lam Res Ag Apparatus for processing wafer-shaped articles
GB202016750D0 (en) 2020-10-22 2020-12-09 Lam Res Ag Apparatus for processing a wafer-shaped article
KR102584511B1 (ko) * 2020-12-07 2023-10-06 세메스 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
US12568781B2 (en) 2021-01-25 2026-03-03 Lam Research Corporation Selective silicon trim by thermal etching
GB202101428D0 (en) 2021-02-02 2021-03-17 Lam Res Ag Apparatus for dispensing a liquid
JP7625458B2 (ja) * 2021-03-22 2025-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11832520B2 (en) * 2021-04-27 2023-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Voltage breakdown uniformity in piezoelectric structure for piezoelectric devices
JP2025037020A (ja) * 2023-09-05 2025-03-17 ウシオ電機株式会社 光源ユニット
KR102665721B1 (ko) * 2023-09-15 2024-05-13 (주)디바이스이엔지 발열부가 장착된 기판 처리장치
KR102675833B1 (ko) * 2023-09-15 2024-06-17 (주)디바이스이엔지 발열부가 장착된 기판 처리장치
GB202315890D0 (en) 2023-10-17 2023-11-29 Lam Res Ag Apparatus for processing a wafer
KR102892705B1 (ko) 2024-04-19 2025-12-02 렉트론디에스피 주식회사 Led 가열부 및 이를 구비하는 led 스핀 척
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10861719B2 (en) 2016-05-31 2020-12-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Also Published As

Publication number Publication date
KR20170135714A (ko) 2017-12-08
JP7231321B2 (ja) 2023-03-01
JP2017224807A (ja) 2017-12-21
CN107452654A (zh) 2017-12-08
CN107452654B (zh) 2020-11-24
US10720343B2 (en) 2020-07-21
KR102101536B1 (ko) 2020-04-17
JP7324323B2 (ja) 2023-08-09
US20200227284A1 (en) 2020-07-16
US10861719B2 (en) 2020-12-08
TW201806058A (zh) 2018-02-16
US20170345681A1 (en) 2017-11-30
TWI734788B (zh) 2021-08-01
JP2022058827A (ja) 2022-04-12

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