JP4937278B2 - 板状物品の流体処理用装置 - Google Patents
板状物品の流体処理用装置 Download PDFInfo
- Publication number
- JP4937278B2 JP4937278B2 JP2008557705A JP2008557705A JP4937278B2 JP 4937278 B2 JP4937278 B2 JP 4937278B2 JP 2008557705 A JP2008557705 A JP 2008557705A JP 2008557705 A JP2008557705 A JP 2008557705A JP 4937278 B2 JP4937278 B2 JP 4937278B2
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- ing And Chemical Polishing (AREA)
Description
駆動手段であって、回転ヘッドのまわりに放射状に配列された前記駆動手段;回転軸と実質的に同心な実質的円筒状の壁であって、回転ヘッドと駆動手段との間に配列されかつ回転ヘッドと駆動手段との間に間隙内に挿入された前記円筒状の壁;及び回転ヘッド及び壁を互いに回転軸線に沿って軸方向に動かすための軸方向移動手段を備えた装置を提供することによりこの目的を充たす。
に分離される。かかる分離により、回転ヘッドからカバーまでの距離を変えることができ、このことは、板状物品の処理のためにカバーに取り付けられる機能要素(例えば、超音波変換器、又は加熱用部材、又は複数の液体分配装置、又は発光用要素(例えば、紫外線光源))がある場合に特に有用である。これは、液体処理中の板状物品からカバーまでの距離が板状物品を回転ヘッド上に置き又は取り上げるときよりも恐らくは小さいため有用である。
物品と実質的に平行であるが、処理時には板状物品に関して第1の板材とは反対側にある。従って、この2個の板材は、板状物品の両側を同時に又は交互に処理するために板状物品に隣接して配列することができる。
ル駆動装置23は、カバーユニット20をボールスピンドル3に沿って垂直方向で動かすことができる。カバーユニット20が下向きに動かされると、これはOリングシール19により円筒状側壁5の上の縁に対して封鎖される。
Claims (12)
- 板状物品の流体処理のための装置であって、
板状物品を保持しかつ回転軸線まわりに回転させるための回転ヘッド、
回転ヘッドを接触しないで懸架して駆動するため回転ヘッドのまわりに放射状に配列された駆動手段、
板状物品の第1の面に媒体を供給するための第1の媒体供給手段、
回転軸と同心であり、回転ヘッドと駆動手段との間に設けられかつ回転ヘッドと駆動手段との間の間隙内に挿入され、板状物品を周囲圧力とは異なった選定可能な圧力で処理することができるよう閉鎖可能な室の部分である、円筒状側壁、及び
回転ヘッド及び円筒状側壁を互いに回転軸線に沿って軸方向に動かすための軸方向移動手段、
を備え、
閉鎖可能な室が、円筒状側壁に対して封鎖され回転ヘッド上に板状物品を置き又は取り上げるための接近に適した開口可能なカバーを備え、板状物品が円筒状側壁により囲まれた空間内でない位置に動かされるように回転ヘッドが回転軸線に沿って動き得るように、軸方向移動手段、円筒状側壁、回転ヘッド及び駆動手段が互いに配置される、ことを特徴とする装置。 - 軸方向移動手段が、油圧シリンダー、空気圧シリンダー、ボールスピンドル、リニアモーター、ベルト駆動装置のグループから選定される請求項1に記載の装置。
- 回転ヘッドと駆動手段との間の間隙が2−10mmの範囲内である請求項1に記載の装置。
- 開口可能なカバーを開くための手段が、更に軸方向移動手段である請求項1に記載の装置。
- 開口可能なカバーを開くための手段及び軸方向移動手段が互いに分離された請求項1に記載の装置。
- 開口可能なカバーが、カバーの各面を処理時に板状物品に面するように選ぶことができるように反転可能に取り付けられる請求項1に記載の装置。
- 開口可能なカバーが、媒体を供給するために第1の媒体源に連結される請求項1に記載の装置。
- 板状物品の第2の面に媒体を供給するための第2の媒体供給手段を有する請求項1に記載の装置。
- 板状物品と平行でありかつ処理時に前記板状物品に面している第1の板材を有する請求項1に記載の装置。
- 第1の板材が、壁とともにカップを形成している底部部品の部分である請求項9に記載の装置。
- 第1の板材が、振動要素と音響的に結合される請求項9に記載の装置。
- 板状物品と平行な第2の板材を有する請求項9に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA386/2006 | 2006-03-08 | ||
AT3862006 | 2006-03-08 | ||
PCT/EP2007/051152 WO2007101764A1 (en) | 2006-03-08 | 2007-02-07 | Device for fluid treating plate-like articles |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009528916A JP2009528916A (ja) | 2009-08-13 |
JP4937278B2 true JP4937278B2 (ja) | 2012-05-23 |
Family
ID=37907547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008557705A Expired - Fee Related JP4937278B2 (ja) | 2006-03-08 | 2007-02-07 | 板状物品の流体処理用装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8974631B2 (ja) |
EP (1) | EP1994548A1 (ja) |
JP (1) | JP4937278B2 (ja) |
KR (1) | KR20080107401A (ja) |
CN (1) | CN101395700B (ja) |
TW (1) | TWI346990B (ja) |
WO (1) | WO2007101764A1 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4937278B2 (ja) * | 2006-03-08 | 2012-05-23 | ラム・リサーチ・アクチエンゲゼルシヤフト | 板状物品の流体処理用装置 |
JP2012513185A (ja) | 2008-12-19 | 2012-06-07 | ラム・リサーチ・アーゲー | ディスク状の物品を扱うための装置およびその動作方法 |
TWI591757B (zh) | 2009-03-31 | 2017-07-11 | 蘭研究公司 | 用以處理盤狀物品的裝置 |
EP2372749B1 (de) * | 2010-03-31 | 2021-09-29 | Levitronix GmbH | Behandlungsvorrichtung zur Behandlung einer Oberfläche eines Körpers |
US8485204B2 (en) * | 2010-05-25 | 2013-07-16 | Lam Research Ag | Closed chamber with fluid separation feature |
JP5669461B2 (ja) * | 2010-07-01 | 2015-02-12 | 株式会社ディスコ | スピンナ洗浄装置 |
US9997379B2 (en) | 2010-11-30 | 2018-06-12 | Lam Research Ag | Method and apparatus for wafer wet processing |
US20120305036A1 (en) * | 2011-06-01 | 2012-12-06 | Lam Research Ag | Device for treating surfaces of wafer-shaped articles |
US10269615B2 (en) * | 2011-09-09 | 2019-04-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US8974632B2 (en) | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
US9633890B2 (en) | 2011-12-16 | 2017-04-25 | Lam Research Ag | Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device |
US9548223B2 (en) * | 2011-12-23 | 2017-01-17 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US20130309874A1 (en) | 2012-05-15 | 2013-11-21 | Lam Research Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
KR101501362B1 (ko) | 2012-08-09 | 2015-03-10 | 가부시키가이샤 스크린 홀딩스 | 기판처리장치 및 기판처리방법 |
KR101512560B1 (ko) | 2012-08-31 | 2015-04-15 | 가부시키가이샤 스크린 홀딩스 | 기판처리장치 |
US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
US9870933B2 (en) | 2013-02-08 | 2018-01-16 | Lam Research Ag | Process and apparatus for treating surfaces of wafer-shaped articles |
KR102091291B1 (ko) | 2013-02-14 | 2020-03-19 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
US10043686B2 (en) * | 2013-12-31 | 2018-08-07 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US9597701B2 (en) | 2013-12-31 | 2017-03-21 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US9657397B2 (en) | 2013-12-31 | 2017-05-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US10777432B2 (en) * | 2014-02-27 | 2020-09-15 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
US9947572B2 (en) | 2014-03-26 | 2018-04-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
JP6230941B2 (ja) * | 2014-03-26 | 2017-11-15 | 株式会社Screenホールディングス | 基板処理装置 |
JP6292934B2 (ja) * | 2014-03-26 | 2018-03-14 | 株式会社Screenホールディングス | 基板処理装置 |
JP6294121B2 (ja) * | 2014-03-26 | 2018-03-14 | 株式会社Screenホールディングス | 基板処理装置 |
WO2015162194A1 (en) * | 2014-04-24 | 2015-10-29 | Struers A/S | A method of, and an apparatus for, rinsing materialographic samples |
US10490426B2 (en) * | 2014-08-26 | 2019-11-26 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
US10167552B2 (en) | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
US9911630B2 (en) | 2015-10-30 | 2018-03-06 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US9968970B2 (en) | 2015-12-04 | 2018-05-15 | Lam Research Ag | Spin chuck with in situ cleaning capability |
US9887122B2 (en) * | 2016-05-06 | 2018-02-06 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
US10720343B2 (en) | 2016-05-31 | 2020-07-21 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
US10446416B2 (en) | 2016-08-09 | 2019-10-15 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
US10312117B2 (en) | 2016-08-10 | 2019-06-04 | Lam Research Ag | Apparatus and radiant heating plate for processing wafer-shaped articles |
EP3566244A1 (en) * | 2017-01-09 | 2019-11-13 | Institut National de la Sante et de la Recherche Medicale (INSERM) | Method and apparatus for etching a substrate |
CN108573908B (zh) * | 2017-03-10 | 2020-09-08 | 无锡华瑛微电子技术有限公司 | 半导体基片处理微腔室机械支撑装置 |
US10658204B2 (en) | 2017-08-08 | 2020-05-19 | Lam Research Ag | Spin chuck with concentrated center and radial heating |
CN110899188A (zh) * | 2019-10-28 | 2020-03-24 | 河南飞龙(芜湖)汽车零部件有限公司 | 一种叶片式水泵壳体自动清洗装置 |
CN113460662A (zh) * | 2021-07-22 | 2021-10-01 | 上海隐冠半导体技术有限公司 | 一种双向驱动装置及微动台 |
KR20230090848A (ko) * | 2021-12-15 | 2023-06-22 | 삼성전자주식회사 | 기판 건조 장치 및 그 방법 |
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JPH08316190A (ja) * | 1995-05-18 | 1996-11-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
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TW324834B (en) * | 1996-02-01 | 1998-01-11 | Tokyo Electron Co Ltd | Method for forming membrane |
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JP3527450B2 (ja) | 1999-12-22 | 2004-05-17 | 東京エレクトロン株式会社 | 処理装置 |
US20030045098A1 (en) | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
US6800833B2 (en) * | 2002-03-29 | 2004-10-05 | Mariusch Gregor | Electromagnetically levitated substrate support |
JP2005072559A (ja) | 2003-08-05 | 2005-03-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
US20060108069A1 (en) * | 2004-11-19 | 2006-05-25 | Samsung Electronics Co., Ltd. | Plasma reaction chamber and captive silicon electrode plate for processing semiconductor wafers |
JP4937278B2 (ja) * | 2006-03-08 | 2012-05-23 | ラム・リサーチ・アクチエンゲゼルシヤフト | 板状物品の流体処理用装置 |
US7378618B1 (en) * | 2006-12-14 | 2008-05-27 | Applied Materials, Inc. | Rapid conductive cooling using a secondary process plane |
-
2007
- 2007-02-07 JP JP2008557705A patent/JP4937278B2/ja not_active Expired - Fee Related
- 2007-02-07 TW TW096104434A patent/TWI346990B/zh not_active IP Right Cessation
- 2007-02-07 US US12/281,795 patent/US8974631B2/en not_active Expired - Fee Related
- 2007-02-07 EP EP07704410A patent/EP1994548A1/en not_active Withdrawn
- 2007-02-07 WO PCT/EP2007/051152 patent/WO2007101764A1/en active Application Filing
- 2007-02-07 CN CN2007800081331A patent/CN101395700B/zh not_active Expired - Fee Related
- 2007-02-07 KR KR1020087021412A patent/KR20080107401A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2007101764A1 (en) | 2007-09-13 |
US20090079122A1 (en) | 2009-03-26 |
KR20080107401A (ko) | 2008-12-10 |
US8974631B2 (en) | 2015-03-10 |
CN101395700B (zh) | 2010-09-29 |
JP2009528916A (ja) | 2009-08-13 |
TWI346990B (en) | 2011-08-11 |
EP1994548A1 (en) | 2008-11-26 |
TW200739800A (en) | 2007-10-16 |
CN101395700A (zh) | 2009-03-25 |
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