TWI591757B - 用以處理盤狀物品的裝置 - Google Patents

用以處理盤狀物品的裝置 Download PDF

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TWI591757B
TWI591757B TW103130130A TW103130130A TWI591757B TW I591757 B TWI591757 B TW I591757B TW 103130130 A TW103130130 A TW 103130130A TW 103130130 A TW103130130 A TW 103130130A TW I591757 B TWI591757 B TW I591757B
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瑞那 歐柏韋格
湯瑪士 溫斯伯格
法蘭茲 坤尼格
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蘭研究公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/17—Socket type
    • Y10T279/17615—Obliquely guided reciprocating jaws

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gripping On Spindles (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manipulator (AREA)

Description

用以處理盤狀物品的裝置
本發明係關於一種用於支撐且以一轉子旋轉一盤狀物品的裝置，其包含一用於支撐該盤狀物品的支座，其中該轉子位於一處理室中。
背景技藝
WO 2007/101764 A1揭露一種用於一盤狀物品之流體處理的裝置，其包含固持一盤狀物品且使該盤狀物品繞一旋轉軸旋轉的旋轉頭，一懸浮且無接觸驅動該旋轉頭驅動裝置，該驅動裝置被配置成徑向圍繞旋轉頭，一實質上圓筒狀形壁，該圓筒狀壁實質上與該旋轉軸同心，其中該圓筒狀壁被配置在旋轉頭與驅動裝置之間。
一適當驅動機構被描述於US-Patent 6,485,531中。具有本文揭露的主動磁浮軸承及驅動機構而定子與轉子之間的距離有限。
固持盤狀物品的一些解決方法被提供於US-Patent 5,845,662中。然而，此等固持裝置打開上複雜或要求一最小轉速俾安全地固持盤狀物品。另一個問題是在極高轉速時它們可能以一過高以致於損害盤狀物品的力來固持盤狀物品。
本發明的一目的是提供一種在處理期間安全固持一盤狀物品的裝置。
發明揭露
本發明藉由提供一種用於處理一盤狀物品之裝置來解決該等問題，該裝置包含一卡盤，其固持該盤狀物品且使該盤狀物品繞垂直於該盤狀物品 的一軸A旋轉，其中該卡盤包含一基體，一對於該基體旋轉對稱配置的驅動環，以及在盤狀物品邊緣與其接觸的握持構件，其中該等握持構件可藉由繞軸A相對基體扭動驅動環而相對軸A偏心移動，其中該驅動環由磁力固持。
若卡盤由磁浮軸承(例如在US 6,485,531及WO 2007/101764 A1中所述的主動磁浮軸承)固持及旋轉，此一結構尤其有幫助。然而，此一機構也可與一心軸驅動的一普通卡盤結合使用。
在一個實施例中，該裝置包含將一流體分配至盤狀物品的分配裝置及一固持一盤狀物品且使該盤狀物品繞與其垂直的一軸A旋轉的卡盤，該卡盤包含一基體、一驅動環，及在該盤狀物品邊緣與其接觸的握持構件，其中該等握持構件相對該盤狀物品可偏心移動，其中該等握持構件之偏心移動由一驅動環驅動，其中該驅動環可旋轉安裝於該基體，使得該驅動環可繞軸A向基體旋轉，且因此驅動該等握持構件，其中驅動環向基體的相對旋轉移動藉由固持基體且旋轉驅動環，或藉由固持驅動環且旋轉基體而被實現，藉此欲被固持的部份(驅動環或基體)藉由磁力被固持而不接觸各自欲被固持的部份。在此情況中，欲被旋轉部份(分別為基體或驅動環)可藉由磁力被旋轉而不接觸各自欲被旋轉的部份。
此一磁力典型地被建立於一磁力偶的兩個元件之間。此等磁力偶可例如是下列之一：
-2個永久磁體-第一磁體被固定於驅動環；第二磁體被安裝於一可徑向移動的(相對于軸A徑向)移動構件。此一移動構件可例如藉由一氣壓缸或一電動線性馬達被驅動。
-一個永久磁體及一個電磁體-第一磁體被固定於驅動環；電磁體被安裝於該裝置的一非旋轉部份(例如腔室壁)
在另一實施例中，基體被形成為一中空環，其具有一容納驅動環的環狀腔室。此中空環可包含兩個或兩個以上部份。此等部份可以是被焊接、用螺釘擰旋或膠黏在一起的。
該卡盤較佳地是磁浮的。這可藉由一主動磁浮軸承(如在US 6,485,531中所述)或藉由高溫超導磁體支撐的一軸承被實現。此一包含高溫超導磁體 的驅動機構進一步被描述於澳大利亞專利申請案第A 1987/2008號案取得的公開專利申請案。以此一組配，自旋機構之所有部件以及握持機構的所有部件可對處理流體密封。啟動打開/閉合機構的部份可被置於一閉合處理室外部。
在一個實施例中，驅動環是一齒環，而該等握持構件是對於較小齒輪偏心凸出的凸輪(偏心於該等較小齒輪的旋轉軸)，該等凸輪由齒環驅動。當齒環被扭向基體時，較小齒輪與該等凸輪(銷)旋轉，該等凸輪偏心地由該等較小齒輪凸出，改變它們到軸A之距離。因此該等凸輪握持盤狀物品之邊緣或釋放該盤狀物品。應理解該等凸出凸輪可被安裝於較小齒輪或該等凸輪與該等較小齒輪可由同一塊材料形成。
較佳地，該驅動環藉由一彈性構件(例如，一彈簧)被固持在待用位置，藉此該等握持構件被推入閉合位置。當驅動環由磁力固持且基體被扭轉時，驅動環抗逆夾緊力跨伸。進而盤狀物品被置於該等握持構件之間。之後驅動環及基體再次被扭回，且該等握持構件接觸盤狀物品之邊緣。因此彈性構件之力牢固地夾持盤狀物品。
在一較佳實施例中，該裝置進一步包含一圍繞卡盤之壁，且在處理盤狀物品期間，該卡盤在該壁內自由飄浮。在此情況中，磁力將被建立於其間的元件必須被組配成使得驅動環可被牢固鎖定，同時卡盤之基體被旋轉大約某一角度(例如1°-10°)。
在一較佳實施例中，圍繞卡盤之壁是一閉合室的一部份。這具有卡盤及盤狀物品在該室內旋轉而驅動卡盤及打開握持構件之機構仍在該室之外的優勢。該室僅需在該盤狀物品進入及離開時被打開。
在另一實施例中，分配裝置被提供用於將流體暢通分配到盤狀物品的兩側。如果分配的流體由液體組成那麼這將是有幫助的。
120、220、320‧‧‧環狀卡盤
121、221、321‧‧‧卡盤基體
122、322‧‧‧外壁
125、135、325、335‧‧‧安裝點
127、227‧‧‧銷軸
128、228、328‧‧‧銷
130‧‧‧齒環(驅動環)
131‧‧‧向內觀察齒
133、233、333‧‧‧永久磁體
140、340‧‧‧螺旋彈簧
150、250、350‧‧‧氣壓缸
155、255、355‧‧‧鎖定磁體
160、260、360‧‧‧圓柱壁
200‧‧‧裝置
205‧‧‧定子基板
222‧‧‧下方卡盤蓋
224‧‧‧螺釘
229‧‧‧轉子磁體蓋
230‧‧‧驅動環(齒環)
231‧‧‧向內齒
263‧‧‧上方分配管
265‧‧‧底板
267‧‧‧下方分配管
280‧‧‧定子及主動軸承單元
285‧‧‧轉子磁體
326‧‧‧螺旋壓力彈簧(銷閉合彈簧)
330‧‧‧驅動環
332‧‧‧傾斜平面
A、X‧‧‧軸
D2b、D2d‧‧‧細部
I-I、II-II、III-III‧‧‧平面
L、S‧‧‧箭頭
Tccw‧‧‧逆時針旋轉
To‧‧‧順時針旋轉
W‧‧‧圓片
第1a-1f圖繪示在操作中依據本發明之一實施例的一裝置之示意俯視圖。
第2a-2f圖繪示依據本發明之一實施例的一裝置之不同視圖。
第3a-3c圖繪示本發明之另一實施例。
實施本發明之方式
參考第2a-2f圖，依據本發明之一實施例的一裝置200將被描述。
第2a圖繪示依據本發明之一實施例的一裝置200之一截面透視圖。
第2b圖繪示(第2a圖之)細部D2b之放大視圖。
第2c圖繪示細部D2b之一側視圖。
第2d圖繪示(第2a圖之)細部D2d之放大視圖。
第2e圖繪示與第2b圖相同的視圖，但是鎖定齒狀齒環的鎖定磁體255極接近卡盤之永久磁體233。
第2f圖繪示通過銷軸227及銷228的一截面透視圖之放大細部。
裝置200包含一腔室、一握持及旋轉一圓片(盤狀物品)的環狀卡盤220，及一定子及主動軸承單元280。
該腔室包含一圓柱壁260、一底板265及一頂板(未示於圖中)。一上方分配管263被引向通過頂板且一下方分配管267通過底板265。
定子及主動軸承單元280被安裝於一與圓柱壁260同心的定子基板205。定子基板205可相對圓柱壁260的圓柱軸在軸向上被移動，例如以氣動提升裝置。定子基板205及被安裝於其上的定子及主動軸承單元280具有中心開口，該中心開口具有比圓柱壁260之外徑較大的直徑。該頂板也可以被軸向移動，以打開該腔室。該頂板在閉合位置對該圓柱壁密封。
定子及主動軸承單元280包含數個線圈用於軸向及徑向軸承，且用於驅動轉子磁體285，轉子磁體285是環狀卡盤的一部份。此配置被稱為主動軸承且在US 6,485,531中被進一步描述。
環狀卡盤220之直徑小於圓柱壁之內徑，使得其可在圓柱壁260內自由飄浮及旋轉。環狀卡盤220包含一內卡盤基體221，其以一環狀槽圓周地圍繞在內卡盤基體221之外部，該環狀槽用作驅動環230之軸承。
驅動環230被具體實施為一具有向內齒231的齒環230。向內齒231驅動一銷軸227之齒(見第2f圖)。
此實施例具有六個向下定向銷軸227，它們各具有一由驅動環(齒環)230驅動的小齒輪。諸銷軸227被安裝以使它們繞一平行於環狀卡盤之旋轉軸的軸A旋轉。
一銷228偏心於銷軸之旋轉軸A被安裝於銷軸227，以使該銷在銷軸被驅動環(齒環)230轉動時改變其到環狀卡盤中心的距離。換句話說，當驅動環(齒環)230被扭向卡盤基體221時，該銷被呈徑向地移動。為了將驅動環(齒環)230安裝入卡盤基體221的環狀槽內，驅動環(齒環)230由兩個分離段組成，該兩個分離段當被插入環狀槽時被固定在一起。卡盤基體221及驅動環(齒環)230經由一螺旋彈簧(未示於圖中)被連接，以使驅動環(齒環)230將銷228推入較接近環狀卡盤220中心的位置。
兩個永久磁體233被安裝於齒狀齒環(驅動環)230。至少二十四個永久磁體的複數個轉子磁體285被均勻地配置在卡盤基體221周圍。此等轉子磁體285是驅動及軸承單元的一部份，即安裝於卡盤基體221之轉子的一部份(主動軸承之元件)。
該等複數個轉子磁體285及攜載永久磁體233的驅動環(齒環)230被封包在卡盤基體221。外部下方卡盤蓋222，及轉子磁體蓋229提供一中空環狀空間內。此轉子磁體蓋299可以是一不鏽鋼套。蓋222及229是環狀的，且與卡盤基體221同心。
當裝配環狀卡盤220時，銷軸227從上部被插入它們各自的座，以使該等銷軸對卡盤基體221緊緊密封，如第2f圖所示。各銷軸227以一螺釘224被固定在它們的位置上。另外，各銷軸可藉由銷軸與螺釘之間的一螺旋彈簧被壓入其座中。
附接於定子基板205的是一定子及主動軸承單元280，該定子及主動軸承單元280相對圓柱壁260同心配置。該定子及主動軸承單元280對應於轉子磁體285，因此飄浮、支承且旋轉環狀卡盤220。
在定子及主動軸承單元280之下有兩個安裝於定子基板205的氣壓缸250。在氣壓缸250之桿的遠端配置有鎖定磁體255(永久磁體)。該等鎖定磁體對應於驅動環(齒環)230的永久磁體233。氣壓缸250被配置成使鎖定磁體255可相對圓柱壁260之軸徑向移動。
當諸銷將被打開時，例如以釋放一圓片時，如下步驟被實施。定子基板205及飄浮的環狀卡盤220被舉起，使得圓柱壁260不再位於鎖定磁體255與環狀卡盤220之間的間隙中(見第2e圖)。此後，氣壓缸250將鎖定磁體255移至極接近環狀卡盤220，且卡盤被旋轉，使得永久磁體233及驅動環(齒環)230被鎖定磁體鎖定。此時卡盤被旋轉，而驅動環靜止不動，因此諸銷228打開。可供選擇地，卡盤基體可在氣壓缸被移動時靜止不動，使得鎖定磁體切線旋轉(沿卡盤之圓周)，藉此驅動環被旋轉。
參考第1a-1f圖，銷打開機構之操作將被描述。第1a-1f圖是沿大約一平面I-I的截面的示意圖，如第2c圖所示。
第1a圖繪示裝置在一待用位置。該圖中繪示該裝置的一120°片段。具有一卡盤基體121及一外壁122的環狀卡盤120容納齒狀齒環130。齒環130具有向內觀察齒131。具有銷128的諸銷軸127被配置成使它們的齒輪咬合在齒環130(驅動環)的向內觀察齒131上。諸銷軸位於它們在卡盤基體121之各自的座中。
卡盤基體121及齒環(驅動環)130經由一螺旋彈簧140連接，使得齒環(驅動環)130使諸銷128在最接近環狀卡盤120中心的位置。螺旋彈簧140之力藉由第1b圖中的兩個小箭頭S陳示。圍繞在圓周配置有三個此種螺旋彈簧140，它們在安裝點125被安裝於卡盤基體121，且在安裝點135被安裝於齒環。
鎖定磁體155被固定於氣壓缸150之遠端。鎖定磁體155對應齒環(驅動環)130之永久磁體133。
為了打開及閉合諸銷，例如供夾握及釋放一圓片，如下步驟被實施。飄浮的環狀卡盤120被舉起，使得圓柱壁160(如第1e圖所示)不再位於鎖定磁體155與環狀卡盤120之間的間隙中。因此，圓柱壁未示於第1a-1d圖及第1f圖中。此後環狀卡盤120被旋轉以使永久磁體面對鎖定磁體155(第1a圖)。
接著氣壓缸150移動(見箭頭L)鎖定磁體155使其極接近環狀卡盤120(見第1b圖)，然而卻不接觸環狀卡盤120，以使永久磁體133及齒環(驅動環)130被鎖定磁體鎖定。
此時環狀卡盤120被逆時針旋轉(Tccw)，而齒環(驅動環)130靜止不動，因此銷軸順時針旋轉(To)且諸銷128打開(第1c圖)，同時螺旋彈簧140伸長。一圓片W(虛線)被置於諸銷之間。
接著卡盤基體121被順時針旋轉(見第1d圖)，而諸銷軸逆時針旋轉(Tc)，使得諸銷移向中心，且諸銷固定地固持圓片W。螺旋彈簧140確保此閉合位置。
此後，該等鎖定磁體被撤回，且定子(未示於圖中)與環狀卡盤120被降低，使得圓柱壁160圍繞卡盤(見第1e圖)。之後該腔室蓋被降低且因此腔室被密封。該過程開始，意味著卡盤旋轉，且按順序的不同液體從上方以及下方被分配。
在該過程之後，該腔室再次被打開，且定子再次被舉起。為了釋放圓片，使鎖定磁體155極接近該卡盤。該卡盤被逆時針旋轉(Tccw)以使諸銷打開(To；見第1f圖)。
第3a圖及第3b圖繪示本發明的另一實施例。第3b圖繪示沿平面II-II(見第3a圖)的一截面圖。第3a圖繪示沿平面III-III(見第3b圖)的一截面圖。在第3a圖中繪示該裝置的一120°片段。具有一卡盤基體321及一外壁322的環狀卡盤320容納具有向內傾斜平面332的驅動環330。諸銷328可偏向地被配置，以使它們可繞一軸X傾斜，以將該銷之一端移向或移離圓片之中心。軸X平行於圓片W之一切線，所以垂直於平面II-II。該銷軸承可具有一球形形狀且位於其在卡盤基體321的各自球形座中。此等座也用於密封。對於各銷而言，一螺旋壓力彈簧326(銷閉合彈簧)被提供以推迫該銷位於閉合位置。以此方式，該銷被置於卡盤之環狀空間內的部份被保持與驅動環330之對應傾斜平面332接觸。
卡盤基體321及驅動環330經由一螺旋彈簧340被連接，以使驅動環330允許諸銷328之遠端在最接近環狀卡盤320之中心的位置處。圍繞在周邊配置有三個此種螺旋彈簧340，它們在安裝點325被安裝於卡盤基體321，以及在安裝點335被安裝於齒環。
全部螺旋壓力彈簧(銷閉合彈簧)326之力可被選擇為足夠強以使螺旋彈簧340可被忽略，或甚至此等彈簧可被配置成將驅動環推入相對方向以 使得即使在諸銷於其遠端夾握住一圓片時傾斜平面332也可保持與諸銷接觸。
鎖定磁體355被固定於氣壓缸350之遠端。鎖定磁體355對應於驅動環330的永久磁體333。
為了打開及閉合諸銷，例如供夾握及釋放一圓片，如下步驟將被實施。飄浮的環狀卡盤320被舉起以使圓柱壁360(如第3c圖所示)不再位於鎖定磁體355與環狀卡盤320之間的間隙中。因此，該圓柱壁未示於第3a圖及第3c圖中。此後環狀卡盤320被旋轉以使永久磁體面對鎖定磁體355(第3a圖及第3c圖)。
接著氣壓缸350將鎖定磁體355移至極接近環狀卡盤320，然而卻不接觸環狀卡盤320，以使永久磁體333及驅動環330被鎖定磁體鎖定。
此時環狀卡盤320被逆時針旋轉(Tccw)，而驅動環330靜止不動，且因此諸銷繞軸X傾斜，且諸銷328打開(第3c圖)，而螺旋彈簧340被拉伸，且螺旋壓力彈簧(銷閉合彈簧)326被壓縮。一圓片W(虛線)被置於該等銷之間。接著卡盤基體321被順時針旋轉(見第1d圖)且該等銷被傾斜，使得該等銷向中心移動且該等銷固定地固持圓片W。螺旋壓力彈簧(銷閉合彈簧)326確保此閉合位置。
另外的步驟與參考第1a-1f圖描述者類似。
120‧‧‧環狀卡盤
121‧‧‧卡盤基體
122‧‧‧外壁
125、135‧‧‧安裝點
127‧‧‧銷軸
128‧‧‧銷
130‧‧‧齒環(驅動環)
131‧‧‧向內觀察齒
133‧‧‧永久磁體
140‧‧‧螺旋彈簧
150‧‧‧氣壓缸
155‧‧‧鎖定磁體

Claims (11)

  1. 一種用於以一流體處理一盤狀物品的裝置，該裝置包含用以將流體分配至盤狀物品上的至少一分配器、以及用以固持盤狀物品且使該盤狀物品繞一垂直於該盤狀物品之軸A旋轉的一卡盤，該卡盤包含一基體以及在該盤狀物品邊緣與其接觸的複數握持構件，其中該等握持構件可相對於該軸A進行徑向移動，其中該等握持構件係從該基體之一傾斜徑向朝內的環狀表面向下延伸，以及其中該傾斜徑向朝內的環狀表面係圍繞該等握持構件並且向下延伸至比盤狀物品在被該等握持構件固持時更低的一高度。
  2. 如申請專利範圍第1項所述之裝置，其中該等握持構件的徑向移動係由一驅動環所驅動，其中該驅動環可旋轉地被安裝於該基體，使得該驅動環可繞該軸A而相對於該基體旋轉，並藉以驅動該等握持構件，其中該驅動環相對於該基體的相對旋轉移動係藉由固持該基體並旋轉該驅動環，或藉由固持該驅動環並旋轉該基體而實施，其中欲被固持的該驅動環或該基體係藉由磁力所固持而不接觸該各自欲被固持部份。
  3. 如申請專利範圍第2項所述之裝置，其中欲被旋轉的該驅動環或該基體係藉由磁力所旋轉而不接觸該各自欲被旋轉部份。
  4. 如申請專利範圍第2項所述之裝置，其中該基體被形成為一具有一環狀腔室的中空環，且該驅動環被容納在該環狀腔室中。
  5. 如申請專利範圍第1項所述之裝置，其中該卡盤係藉由一磁浮軸承而自由飄浮。
  6. 如申請專利範圍第1項所述之裝置，其中該卡盤係藉由一主動磁浮軸承或一被高溫超導磁體所支撐的軸承而飄浮及旋轉。
  7. 如申請專利範圍第1項所述之裝置，其中該裝置進一步包含一圍繞該卡盤之壁，且在處理該盤狀物品期間，該卡盤在該壁內自由飄浮。
  8. 如申請專利範圍第7項所述之裝置，其中圍繞該卡盤之該壁為一閉合腔室的部份。
  9. 如申請專利範圍第1項所述之裝置，其中複數個分配器被提供用於將流體暢通分配到該盤狀物品之兩側上。
  10. 一種用於以一流體處理一盤狀物品的裝置，該裝置包含：用以將流體分配至盤狀物品上的至少一分配器、以及用以固持盤狀物 品且使該盤狀物品繞一垂直於該盤狀物品之軸A旋轉的一卡盤，該卡盤包含一基體以及在該盤狀物品邊緣與其接觸的複數握持構件，其中該等握持構件可相對於該軸A進行徑向移動，其中該等握持構件係從該基體之一傾斜徑向朝內的環狀表面向下延伸，其中該等握持構件的徑向移動係由一驅動環所驅動，其中該驅動環可旋轉地被安裝於該基體，使得該驅動環可繞該軸A而相對於該基體旋轉，並藉以驅動該等握持構件，其中該驅動環相對於該基體的相對旋轉移動係藉由固持該基體並旋轉該驅動環，或藉由固持該驅動環並旋轉該基體而實施，其中欲被固持的該驅動環或該基體係藉由磁力所固持而不接觸該各自欲被固持部份，以及其中該驅動環為一齒環，以及該等握持構件為分別偏心安裝於各自較小齒輪的凸輪，該各自較小齒輪係與該齒環嚙合。
  11. 一種用於以一流體處理一盤狀物品的裝置，該裝置包含：用以將流體分配至盤狀物品上的至少一分配器、以及用以固持盤狀物品且使該盤狀物品繞一垂直於該盤狀物品之軸A旋轉的一卡盤，該卡盤包含一基體以及在該盤狀物品邊緣與其接觸的複數握持構件，其中該等握持構件可相對於該軸A進行徑向移動，其中該等握持構件係從該基體之一傾斜徑向朝內的環狀表面向下延伸，其中該等握持構件的徑向移動係由一驅動環所驅動，其中該驅動環可旋轉地被安裝於該基體，使得該驅動環可繞該軸A而相對於該基體旋轉，並藉以驅動該等握持構件，其中該驅動環相對於該基體的相對旋轉移動係藉由固持該基體並旋轉該驅動環，或藉由固持該驅動環並旋轉該基體而實施，其中欲被旋轉的該驅動環或該基體係藉由磁力所固持而不接觸該各自欲被固持部份，以及其中該驅動環係藉由一彈性構件而被固持在待用位置，藉此該等握持構件被推入閉合位置。
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