CN102356460B - 处理盘状制品的设备 - Google Patents

处理盘状制品的设备 Download PDF

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CN102356460B
CN102356460B CN201080012324.7A CN201080012324A CN102356460B CN 102356460 B CN102356460 B CN 102356460B CN 201080012324 A CN201080012324 A CN 201080012324A CN 102356460 B CN102356460 B CN 102356460B
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CN102356460A (zh
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赖纳·奥博威格
弗朗茨·康姆尼格
托马斯·维恩斯伯格
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Lam Research Corp
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    • H—ELECTRICITY
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/17—Socket type
    • Y10T279/17615—Obliquely guided reciprocating jaws

Abstract

本发明涉及一种用流体处理盘状制品的设备，所述设备包括用于在所述盘状制品上分配流体的分配工具以及用于支持所述盘状制品并绕垂直于所述盘状制品的轴A转动所述盘状制品的卡盘，所述卡盘包括基体、驱动环以及用于接触所述盘状制品的边缘的夹持件，其中所述夹持件相对所述盘状制品的中心离心移动，其中所述夹持件的所述离心移动由驱动环驱动，其中所述驱动环可转动地安装于所述基体，使得所述驱动环相对所述基体绕所述轴A转动从而驱动所述夹持件，其中所述驱动环相对所述基体的所述相对转动通过支持所述基体并转动所述驱动环而进行或者通过支持所述驱动环并转动所述基体而进行，因此待支持部件(驱动环或基体)通过磁力支持无需接触相应的待支持部件。

Description

处理盘状制品的设备
技术领域
本发明涉及一种通过转子支撑盘状制品以及转动盘状制品的设备，转子包括用于支撑盘状制品的支撑件，其中转子位于处理室内。
背景技术
WO 2007/101764A1披露了一种盘状制品的流体处理设备，其包括用于支持盘状制品以及绕转轴转动盘状制品的旋转头，无接触悬浮以及驱动旋转头的驱动工具，该驱动工具围绕旋转头径向排列，基本上与转轴同轴的基本呈圆筒形状的圆筒形壁，其中圆筒形壁列于旋转头和驱动工具之间。
美国专利6,485,531中描述了合适的驱动装置。本文中所披露的主动磁轴承和驱动装置限制了定子与转子之间的距离。
美国专利5,845,662中提供了一些支持盘状制品的方案。然而，这些支持工具结构复杂难以打开或需要最小转速以便牢固支持盘状制品。另一问题是在非常高的转速下，它们支持盘状制品的力可强到损坏盘状制品。
本发明的目的在于提供一种在处理期间安全地支持盘状制品的设备。
发明内容
本发明通过提供一种处理盘状制品的设备解决了该问题，所述设备包括用于支持盘状制品并绕垂直于盘状制品的轴A转动盘状制品的卡盘，其中卡盘包括基体、与基体轴对称排列的驱动环以及用于接触盘状制品的边缘的夹持件，其中所述夹持件通过相对基体绕轴A扭转驱动环可相对轴A离心移动，其中驱动环由磁力支持。
如果卡盘由磁轴承支持和转动时，这种配置特别有帮助(如美国专利6,485,531或国际公布号WO2007/101764A1所描述的主动磁轴承)。然而，这种装置还可与锭子所驱动的常规卡盘结合使用。
在一实施方式中，该设备包括用于在盘状制品上分配流体的分配工具以及用于支持盘状制品并绕垂直于盘状制品的轴A转动盘状制品的卡盘，该卡盘包括基体、驱动环以及用于接触盘状制品的边缘的夹持件，其中夹持件相对盘状制品的中心离心移动，其中夹持件的离心移动由驱动环驱动，其中驱动环可转动地安装于基体，使得驱动环相对着基体绕轴A可转动从而驱动夹持件，其中驱动环相对基体的相对转动通过支持基体并转动驱动环而进行或者通过支持驱动环并转动基体而进行，因此待支持部件(驱动环或基体)通过磁力支持无需接触相应的待支持部件。在这种情况下，待转动部件(分别为基体或驱动环)可通过磁力转动无需接触相应的待转动部件。
这种磁力通常建立在磁偶(magnetic couple)的两元件之间。例如，这种偶可为例如下述之一：
——2个永磁体——第一磁体固定于驱动环；第二磁体安装于移动部件，其可径向移动(相对轴A径向地)。例如，这种移动部件可由气压缸或电动线性电动机驱动。
——一个永磁体和一个电磁体——第一磁体固定于驱动环；电磁体安装于设备的非旋转部件(例如，室壁)。
在另一实施方式中，基体形成了具有容纳驱动环的环形室的中空环。这种中空环可包括两个或两个以上的部件。这种部件可焊接、螺旋或者粘合在一起。
优选，卡盘为磁悬浮的。这可通过主动磁轴承进行(如美国专利6,485,531所述)或者通过高温超导磁体所支撑的轴承进行。派生于澳大利亚专利申请号A 1987/2008的公开的专利申请进一步描述了这种包括高温超导磁体的驱动装置。通过这种配置，旋转装置的所有部件和夹持装置的所有部件向对于处理流体可以实现密封。启动打开/关闭装置的部件可位于封闭处理室之外。
在一实施方式中，驱动环为齿圈，夹持件为相对小齿轮(相对小齿轮的转轴离心)离心地凸出的凸轮，所述小齿轮由齿圈驱动。当齿圈相对基体扭转时，小齿轮转动，因而从小齿轮离心地凸出的凸轮(销)连同小齿轮改变了它们与轴A的距离。因此，凸轮夹持盘状制品的边缘或者释放盘状制品。应理解为凸出的凸轮可安装于小齿轮，或者凸轮和小齿轮可一体成型。
优选，驱动环被弹性元件(如，弹簧)支持在待用位置，从而夹持件被推入关闭位置。当驱动环由磁力支持并且基体被扭转时，驱动环逆着夹持力旋转。然后，盘状制品位于夹持件之间。其后，再次扭转驱动环和基体回来，夹持件接触盘状制品的边缘。结果，弹性元件的力牢固地夹持盘状制品。
在优选的实施方式中，该设备进一步包括环绕卡盘的壁，在处理盘状制品期间卡盘自由悬浮在壁内。在这种情况下，必须配置部件(在其间建立磁力)以便在卡盘的基体转动大约一定角度(例如，1°-10°)时可牢固地锁定驱动环。
在优选的实施方式中，环绕卡盘的壁为封闭室的一部分。这具有卡盘和盘状制品在室内转动而驱动卡盘和开启夹持件的装置仍在室外的优点。室仅在盘状制品进入和离开时打开。
在另一实施方式中，提供了用于在盘状制品的两个面上无阻碍分配流体的分配工具。如果分配流体包括液体时，这是有帮助的。
附图说明
图1a-1f示出按照本发明的一实施方式运行中的设备的简要顶视图。
图2a-2f示出按照本发明的一实施方式的设备的不同视角图。
图3a-3c示出本发明的另一实施方式。
具体实施方式
参照图2a-2f描述了按照本发明的一实施方式的设备200。
图2a示出按照本发明的一实施方式的设备200的横截透视图。
图2b示出细节D2b(图2a)的放大图。
图2c示出细节D2b的侧视图。
图2d示出细节D2b(图2a)的放大图。
图2e示出图2b的相同视角，但是锁定齿圈的永磁体255进入紧靠卡盘的永磁体233的位置。
图2f示出透过销轴227和销228的横截透视图的放大细节。
设备200包括室、用于夹持和转动晶片(盘状制品)的环形卡盘220以及定子280。
室包括圆筒形壁260、底板265以及顶板(未图示)。上部分配管263穿过顶板，下部分配管267穿过底板265。
定子280安装于与圆筒形壁260同轴的定子基板205。定子基板205可相对圆筒形壁260的圆筒形轴在轴向移动，例如，通过气动升降工具。定子基板205与其所安装的定子280具有中心口，所述中心口具有大于圆筒形壁260外径的直径。顶板也可轴向移动以便打开室。在关闭位置，顶板与圆筒形壁密封。
定子280包括一些用于轴向轴承和径向轴承的线圈以及驱动转子285的线圈，转子285为环形卡盘的一部分。这种配置称为主动轴承，在美国专利6,485,531中被进一步描述了。
环形卡盘220的直径小于圆筒形壁的内径，使得其可在圆筒形壁260内自由漂浮和转动。环形卡盘220包括内部卡盘基体221，所述内部卡盘基体221具有在圆周上环绕内部卡盘基体221外部的环形槽，环形槽起到驱动环230的轴承的作用。
驱动环230体现为具有里向齿231的齿圈230。里向齿231驱动销轴227的齿(参见图2f)。
该实施方式具有六个朝下导向销轴227，其中每一个具有由驱动环230所驱动的小齿轮。安装销轴227以便其可绕轴A转动，轴A平行于环形卡盘的转轴。
销228相对销轴的转轴A离心地安装于销轴227，以便在驱动环230转动销轴时销改变其到环形卡盘中心的距离。换而言之，当驱动环230相对于卡盘基体221扭转时，销径向移动。为了安装驱动环230到卡盘基体221的环形槽内，驱动环230由两个单独的部分组成，当这两个部分插入环形槽时是固定在一起的。卡盘基体221和驱动环230通过螺旋弹簧(未图示)连接，以便驱动环230将销228推入靠近环形卡盘220中心的位置。
两个永磁体233安装于齿圈230。至少二十四个转子磁体285(其为永磁体)中的多个，围绕卡盘基体221均匀布置。这些转子磁体285为驱动和轴承单元的一部分，即转子(主动轴承的元件)的一部分，其安装于卡盘基体221。
所述多个转子磁体285和携带永磁体233的驱动环230被封闭在由卡盘基体221、外部下卡盘盖222以及转子磁体盖229所提供的中空环形空间中。这种转子磁体盖229可为不锈钢盖。盖222和229为环形，并与卡盘基体221同心。
当装配卡盘220时，销轴227从上面插入到其各自的底座，以便如图2f所示销轴与卡盘基体221紧紧密封。每个销轴227通过螺丝224固定于其位置。此外，每个销轴可被销轴和螺丝之间的螺旋弹簧压入其底座。
定子和主动轴承单元280附着于定子基板205，并相对圆筒形壁260同心地排列。轴承单元280对应转子磁体285，从而悬浮、支承和转动卡盘220。
主动轴承单元280的下方有两个安装于定子基板205的气压缸250。锁定磁体255(永磁体)列于在气压缸250的杆的远端。锁定磁体对应驱动环230的永磁体233。气压缸250排列以便锁定磁体255可相对圆筒形壁260的轴径向移动。
例如，当销打开以释放晶片，进行以下程序。抬升定子基板205以及悬浮的卡盘220，以便圆筒形壁260不再位于锁定磁体255和卡盘220之间的空隙中(参见图2e)。此后，气压缸250移动锁定磁体255靠近卡盘220，以及转动卡盘，以便通过锁定磁体锁定永磁体233和驱动环230。此时，驱动环保持不动同时转动卡盘，从而打开销228。替代地，卡盘基体保持不动同时移动气压缸，以便锁定磁体在切线方向转动(沿着卡盘的圆周)，从而转动驱动环。
参考图1a-1f描述销打开装置的操作。图1a-1f为沿着关于图2c所示平面I-I的示意图。
图1a示出待用位置的设备。此处示出设备的120°(三分之一)部分。具有卡盘基体的121和外壁122的卡盘120容纳齿圈130。齿圈130具有里向齿131。具有销128的销轴127排列以便齿轮咬合齿圈130(驱动环)的齿131。销轴坐落于卡盘基体121上其各自底座中。
卡盘基体121和驱动环130通过螺旋弹簧140连接以便驱动环130将销128推入最靠近环形卡盘120中心的位置中。通过图1b中的两个小箭头，可视化螺旋弹簧140的力。沿着圆周排列有三个这种螺旋弹簧140，其安装于卡盘基体121的安装点125以及齿圈的安装点135。
锁定磁体155固定于气压缸150的远端。锁定磁体155对应齿圈130的永磁体133。
例如，为了打开和关闭销以抓住和释放晶片，进行以下程序。抬升悬浮的卡盘120，以便圆筒形壁160(参见图1e)不再位于锁定磁体155和卡盘120之间的空隙中。因此，圆筒形壁未图示在图1a-1d以及图1f中。此后，转动卡盘120，以便永磁体朝向锁定磁体155(图1a)。
然后气压缸150移动(参见箭头L)锁定磁体155靠近卡盘120(参见图1b)，但是不接触卡盘120，以便锁定磁体锁定永磁体133和驱动环130。
此时，逆时针方向(Tccw)转动卡盘120，同时驱动环130保持不动，从而顺时针方向(TO)转动销轴，以及打开销128(图1c)，同时螺旋弹簧140伸长。晶片W(虚线)位于销之间。
然后顺时针方向(见图1d)转动卡盘基体121以及逆时针方向(Tc)转动销轴，以便销朝着中心移动并牢固的支持晶片W。螺旋弹簧140确保该关闭位置。
此后，回撤锁定磁体，通过卡盘120下降定子(未图示)，以便圆筒形室壁160环绕卡盘(参见图1e)。此后，下降室盖，从而封闭室。开始处理，意味着卡盘转动以及按顺序从上方和下方分配不同的液体。
处理之后，再次打开室，再次抬升定子。为了释放晶片，锁定磁体155进入紧靠卡盘的位置。逆时针方向(Tccw)转动卡盘，以便打开销(To；参见图1f)。
图3a和3b示出本发明的另一实施方式。图3b示出沿着平面II-II的横截面示意图(参见图3a)。图3a示出沿着平面III-III的横截示意图(参见图3b)。在图3a中示出设备的120°部分。具有卡盘基体321和外壁322的卡盘320容纳具有里向斜面332的驱动环330。销328倾斜排列，以便其可相对轴X倾斜，从而从晶片的中心和朝晶片的中心移动销的一末端。轴X平行于晶片W的切线，因此其垂直于平面II-II。销轴承可具有球形的形状，并坐落于卡盘基体321的其各自球形底座。这种底座还起到密封的作用。提供每一个销的螺旋压力弹簧326(销靠近弹簧)以推动关闭位置中的销。以这种方式，位于卡盘环形空间内的销的那部分保持接触驱动环330的对应斜面332。
卡盘基体321和驱动环330通过螺旋弹簧340连接，以便驱动环330容许销328的远端位于最靠近环形卡盘320中心的位置。沿着圆周排列有三个这种螺旋弹簧340，其安装于卡盘基体321的安装点325以及齿圈的安装点335。
所有销靠近弹簧326合在一起的力可选择为足够大，以致可忽略伸长弹簧340，或者这种弹簧可排列以推动驱动环进入相反方向，使得即使是在销远端夹持晶片时，斜面332也可保持与销接触。
锁定磁体355固定于气压缸350的远端。锁定磁体355对应齿圈330的永磁体333。
例如，为了打开和关闭销以抓住和释放晶片，进行以下程序。抬升悬浮的卡盘320，以便圆筒形壁360(参见图3c)不再位于锁定磁体355和卡盘320之间的空隙中。因此，圆筒形壁未图示在图3a和3c中。此后，转动卡盘320，以便永磁体朝向锁定磁体355(图3a和3c)。
然后气压缸350移动锁定磁体355靠近卡盘320，但是不接触卡盘320，以便锁定磁体锁定永磁体333和驱动环330。
此时，逆时针方向(Tccw)转动卡盘320，同时驱动器环330保持不动，从而销相对轴X倾斜，以及打开销328(图3c)，同时螺旋弹簧340伸长，压缩螺旋压缩弹簧326。晶片W(虚线)位于销之间。然后顺时针方向(见图1d)转动卡盘基体321以及倾斜销，以便销朝着中心移动并牢固的支持晶片W。螺旋销弹簧326确保该关闭位置。
进一步的程序类似于图1a-1f中所描述的。

Claims (9)

1.一种用流体处理盘状制品的设备，所述设备包括用于在所述盘状制品上分配流体的分配工具以及用于支持所述盘状制品并绕垂直于所述盘状制品的轴A转动所述盘状制品的卡盘，所述卡盘包括基体、驱动环以及用于接触所述盘状制品的边缘的夹持件，其中所述夹持件相对所述盘状制品的中心离心移动，其中所述夹持件的所述离心移动由驱动环驱动，其中所述驱动环可转动地安装于所述基体，使得所述驱动环相对所述基体绕所述轴A转动从而驱动所述夹持件，其中所述驱动环相对所述基体的所述相对的转动通过支持所述基体并转动所述驱动环而进行或者通过支持所述驱动环并转动所述基体而进行，因此待支持部件通过磁力支持无需接触相应的待支持部件,并且其中所述驱动环为齿圈以及所述夹持件为离心地安装于小齿轮的凸轮，所述小齿轮由所述齿圈驱动。
2.根据权利要求1所述的设备，其中待转动部件通过磁力转动无需接触相应的待转动部件。
3.根据权利要求1所述的设备，其中所述基体形成具有环形室的中空环并且所述驱动环容纳在所述环形室内。
4.根据权利要求1所述的设备，其中所述卡盘通过磁轴承自由悬浮。
5.根据权利要求1所述的设备，其中所述卡盘通过驱动装置悬浮和转动，所述驱动装置选自主动磁轴承和高温超导磁体所支持的轴承。
6.根据权利要求1所述的设备，其中所述驱动环被弹性元件支持在待用位置，从而所述夹持件被推入关闭位置。
7.根据权利要求1所述的设备，其中所述设备进一步包括环绕所述卡盘的壁，并且在处理所述盘状制品期间，所述卡盘自由悬浮在所述壁内。
8.根据权利要求7所述的设备，其中环绕所述卡盘的所述壁为封闭室的一部分。
9.根据权利要求1所述的设备，其中提供分配工具以无阻碍分配流体到所述盘状制品的两个面上。
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TW201448113A (zh) 2014-12-16
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JP2016178317A (ja) 2016-10-06
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JP2014212338A (ja) 2014-11-13

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