JP2014212338A - 円盤状の物品を処理するための装置 - Google Patents
円盤状の物品を処理するための装置 Download PDFInfo
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- JP2014212338A JP2014212338A JP2014136534A JP2014136534A JP2014212338A JP 2014212338 A JP2014212338 A JP 2014212338A JP 2014136534 A JP2014136534 A JP 2014136534A JP 2014136534 A JP2014136534 A JP 2014136534A JP 2014212338 A JP2014212338 A JP 2014212338A
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- 238000007667 floating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/17—Socket type
- Y10T279/17615—Obliquely guided reciprocating jaws
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Gripping On Spindles (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manipulator (AREA)
Abstract
Description
2つの永久磁石:第1の磁石は、駆動リングに固定され、第2の磁石は、半径方向に(軸Aに対して半径方向に)移動させることができる移動部材に取り付けられる。このような移動部材は、例えば、空気圧シリンダまたは電気リニアモータによって駆動することができる。
1つの永久磁石および1つの電磁石:第1の磁石は駆動リングに固定され、電磁石は装置の非回転パーツ(例えばチャンバ壁)に取り付けられる。
Claims (10)
- 流体を用いて円盤状の物品を処理するための装置であって、
前記円盤状の物品の上に流体を分配するための分配手段と、
円盤状の物品に垂直な軸Aを中心に前記円盤状の物品を保持する及び回転させるためのチャックと、
を備え、前記チャックは、ベース本体と、駆動リングと、前記円盤状の物品の縁に接触するための把持部材とを含み、前記把持部材は、前記円盤状の物品の中心に対して偏心して移動可能であり、前記把持部材の前記偏心移動は、駆動リングによって駆動され、前記駆動リングは、前記軸Aを中心に前記ベース本体に対して回転可能であることによって前記把持部材を駆動するように、前記ベース本体に回転可能に取り付けられ、前記ベース本体に対する前記駆動リングの前記相対的回転移動は、前記ベース本体を保持するとともに前記駆動リングを回転させること、または前記駆動リングを保持するとともに前記ベース本体を回転させることによって実行され、これによって、前記保持対象パーツ(駆動リングまたはベース本体)は、前記それぞれの保持対象パーツに触れることなく磁力によって保持される、装置。 - 請求項1に記載の装置であって、
前記回転対象パーツ(それぞれベース本体または駆動リング)は、前記それぞれの回転対象パーツに触れることなく磁力によって回転される、装置。 - 請求項1に記載の装置であって、
前記ベース本体は、環状チャンバを伴う中空リングとして形成され、前記駆動リングは前記環状チャンバ内に収容される、装置。 - 請求項1に記載の装置であって、
前記チャックは、磁気軸受によって自由に浮揚される、装置。 - 請求項1に記載の装置であって、
前記チャックは、アクティブ磁気軸受と、高温超電導磁石によって支えられた軸受とからなる群より選択される駆動メカニズムによって浮揚および回転される、装置。 - 請求項1に記載の装置であって、
前記駆動リングは、ギアリングであり、前記把持部材は、前記ギアリングによって駆動される小ギアに偏心して取り付けられた(前記小ギアの回転軸に対して偏心している)カムである、装置。 - 請求項1に記載の装置であって、
前記駆動リングは、弾性部材によって待機位置に保持され、これによって、前記把持部材は、閉じ位置に位置される、装置。 - 請求項1に記載の装置であって、
前記装置は、更に、前記チャックを取り囲む壁を含み、前記円盤状の物品を処理する間、前記チャックは、前記壁内で自由に浮揚される、装置。 - 請求項1に記載の装置であって、
前記チャックを取り囲む前記壁は、閉じられたチャンバの一部である、装置。 - 請求項1に記載の装置であって、
前記円盤状の物品の両側に妨げなく流体を分配するための分配手段が提供される装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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AT5122009 | 2009-03-31 | ||
ATA512/2009 | 2009-03-31 |
Related Parent Applications (1)
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JP2012502851A Division JP5575873B2 (ja) | 2009-03-31 | 2010-03-25 | 円盤状の物品を処理するための装置 |
Related Child Applications (1)
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JP2016084097A Division JP6328686B2 (ja) | 2009-03-31 | 2016-04-20 | 円盤状の物品を処理するための装置 |
Publications (2)
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JP2014212338A true JP2014212338A (ja) | 2014-11-13 |
JP5925841B2 JP5925841B2 (ja) | 2016-05-25 |
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JP2012502851A Active JP5575873B2 (ja) | 2009-03-31 | 2010-03-25 | 円盤状の物品を処理するための装置 |
JP2014136534A Active JP5925841B2 (ja) | 2009-03-31 | 2014-07-02 | 円盤状の物品を処理するための装置 |
JP2016084097A Active JP6328686B2 (ja) | 2009-03-31 | 2016-04-20 | 円盤状の物品を処理するための装置 |
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JP2012502851A Active JP5575873B2 (ja) | 2009-03-31 | 2010-03-25 | 円盤状の物品を処理するための装置 |
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Country Status (7)
Country | Link |
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US (2) | US8490634B2 (ja) |
EP (1) | EP2415075B1 (ja) |
JP (3) | JP5575873B2 (ja) |
KR (2) | KR101513774B1 (ja) |
CN (2) | CN102356460B (ja) |
TW (2) | TWI538094B (ja) |
WO (1) | WO2010113089A2 (ja) |
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US9892955B2 (en) | 2015-09-29 | 2018-02-13 | SCREEN Holdings Co., Ltd. | Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method |
JP2018067683A (ja) * | 2016-10-21 | 2018-04-26 | 株式会社プレテック | ウェーハ保持装置及びウェーハ処理装置 |
US10192771B2 (en) | 2015-09-29 | 2019-01-29 | SCREEN Holdings Co., Ltd. | Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method |
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US8490634B2 (en) | 2013-07-23 |
KR101541674B1 (ko) | 2015-08-03 |
WO2010113089A3 (en) | 2011-03-31 |
CN104392953A (zh) | 2015-03-04 |
TWI538094B (zh) | 2016-06-11 |
CN104392953B (zh) | 2017-07-04 |
EP2415075A2 (en) | 2012-02-08 |
JP5925841B2 (ja) | 2016-05-25 |
CN102356460A (zh) | 2012-02-15 |
KR20140119819A (ko) | 2014-10-10 |
CN102356460B (zh) | 2014-12-03 |
EP2415075B1 (en) | 2019-09-25 |
EP2415075A4 (en) | 2014-01-15 |
JP5575873B2 (ja) | 2014-08-20 |
WO2010113089A2 (en) | 2010-10-07 |
JP6328686B2 (ja) | 2018-05-23 |
TW201041083A (en) | 2010-11-16 |
US20110304107A1 (en) | 2011-12-15 |
US8833380B2 (en) | 2014-09-16 |
JP2016178317A (ja) | 2016-10-06 |
TWI591757B (zh) | 2017-07-11 |
JP2012522391A (ja) | 2012-09-20 |
TW201448113A (zh) | 2014-12-16 |
KR101513774B1 (ko) | 2015-04-20 |
KR20110134435A (ko) | 2011-12-14 |
US20110253181A1 (en) | 2011-10-20 |
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