JP2017108115A - ウエハ形状物品の表面を処理するための装置 - Google Patents
ウエハ形状物品の表面を処理するための装置 Download PDFInfo
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- JP2017108115A JP2017108115A JP2016213939A JP2016213939A JP2017108115A JP 2017108115 A JP2017108115 A JP 2017108115A JP 2016213939 A JP2016213939 A JP 2016213939A JP 2016213939 A JP2016213939 A JP 2016213939A JP 2017108115 A JP2017108115 A JP 2017108115A
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- 230000002093 peripheral effect Effects 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 24
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012636 effector Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
- B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
- B23B31/16—Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially
- B23B31/16004—Jaws movement actuated by one or more spiral grooves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2260/00—Details of constructional elements
- B23B2260/10—Magnets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/19—Radially reciprocating jaws
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/19—Radially reciprocating jaws
- Y10T279/1926—Spiral cam or scroll actuated
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Machine Tool Units (AREA)
Abstract
Description
Claims (20)
- ウエハ形状物品を処理するための回転チャックであって、
一連のグリップピンを有するチャック本体を備え、前記一連のグリップピンは、前記グリップピンが相対的に前記チャック本体内に後退した第1位置から、前記グリップピンが相対的に前記チャック本体から突き出して、所定の直径のウエハ形状物品を支持するように配置される第2位置へ、水平方向に、前記チャック本体と協調的に移動可能である、
回転チャック。 - 請求項1に記載の回転チャックであって、
前記グリップピンの各々は、前記チャック本体内に取り付けられた近位部分と、前記チャック本体から外向きに突出した遠位部分とを備え、前記遠位部分は、前記第1位置および前記第2位置の間で移動する際に前記チャック本体のそれぞれの開口部を通して摺動する、回転チャック。 - 請求項2に記載の回転チャックであって、
前記遠位部分は、前記第1位置から前記第2位置へ移動する際に、前記チャック本体の中心に向かって前記それぞれの開口部を通して水平方向に摺動する、回転チャック。 - 請求項2に記載の回転チャックであって、
前記遠位部分の各々は、ウエハ形状物品が前記回転チャックによって保持された時に前記ウエハ形状物品の周縁部に接触して支持するように構成されたそれぞれの遠位端を備え、前記遠位端は、前記一連のグリップピンの前記第1および第2位置で互いに向かい合う、回転チャック。 - 請求項4に記載の回転チャックであって、
前記遠位端の各々は、水平ノッチを備える、回転チャック。 - 請求項1に記載の回転チャックであって、
前記チャック本体は、リング形状であり、回転中心軸に関して回転されるように適合されている、回転チャック。 - 請求項6に記載の回転チャックであって、
前記リング形状のチャック本体は、前記所定の直径以上の内径を有する、回転チャック。 - 請求項6に記載の回転チャックであって、
前記グリップピンの各々は、前記チャック本体内に取り付けられた近位部分と、前記チャック本体から外向きに突出した遠位部分とを備え、前記遠位部分は、前記第1位置から前記第2位置へ移動する際に前記回転中心軸に向かって前記チャック本体のそれぞれの開口部を通して水平方向に摺動する、回転チャック。 - 請求項6に記載の回転チャックであって、
さらに、前記チャック本体と相対的に制限された回転をするように前記チャック本体内に同軸で取り付けられた駆動リングを備え、前記駆動リングは、一連のカム面を備え、前記一連のカム面の各々は、前記駆動リングと前記チャック本体との相対回転中に前記一連のグリップピンのそれぞれと係合して、前記一連のグリップピンを前記第2位置から前記第1位置へ移動させる、回転チャック。 - 請求項9に記載の回転チャックであって、
前記一連のカム面の各々は、前記駆動リングに形成された対応するスロットに含まれ、各前記スロットは、前記回転中心軸に向かって斜めに伸びており、前記一連のグリップピンの各々の近位部分が、前記スロットの内の対応するスロット内に配置されている、回転チャック。 - 請求項9に記載の回転チャックであって、
前記駆動リングは、前記駆動リングが前記チャック本体の回転に関して静止して保持されることを可能にすることにより、前記一連のグリップピンを前記第2位置から前記第1位置へ移動させるために、少なくとも1つの永久磁石を取り付けられている、回転チャック。 - 請求項1に記載の回転チャックであって、
前記回転チャックは、所定の直径D2のウエハ形状物品を保持するように構成され、前記チャック本体は、直径D1を有する中央開口部を規定し、D1≧D2−10mmであることにより、直径D2のウエハ形状物品の周囲領域と前記回転チャックとの重なりが最大5mmである、回転チャック。 - 請求項1に記載の回転チャックであって、
前記チャック本体は、周りの磁気ステータによって接触なしに回転駆動されるように適合された磁気リングロータである、回転チャック。 - ウエハ形状物品を処理するための装置であって、
処理チャンバと、前記処理チャンバ内に配置された回転チャックと、を備え、前記回転チャックは、一連のグリップピンを有するチャック本体を備え、前記一連のグリップピンは、前記グリップピンが相対的に前記チャック本体内に後退した第1位置から、前記グリップピンが相対的に前記チャック本体から突き出して、所定の直径のウエハ形状物品を支持するように配置される第2位置へ、水平方向に、前記チャック本体と協調的に移動可能である、
装置。 - 請求項14に記載の装置であって、
前記グリップピンの各々は、前記チャック本体内に取り付けられた近位部分と、前記チャック本体から外向きに突出した遠位部分とを備え、前記遠位部分は、前記第1位置および前記第2位置の間で移動する際に前記チャック本体のそれぞれの開口部を通して摺動する、装置。 - 請求項15に記載の装置であって、
前記遠位部分は、前記第1位置から前記第2位置へ移動する際に、前記チャック本体の中心に向かって前記それぞれの開口部を通して水平方向に摺動する、装置。 - 請求項15に記載の装置であって、
前記遠位部分の各々は、ウエハ形状物品が前記回転チャックによって保持された時に前記ウエハ形状物品の周縁部に接触して支持するように構成されたそれぞれの遠位端を備え、前記遠位端は、前記一連のグリップピンの前記第1および第2位置で互いに向かい合う、装置。 - 請求項14に記載の装置であって、
前記チャック本体は、リング形状であり、回転中心軸に関して回転されるように適合されており、前記装置は、さらに、前記チャック本体と相対的に制限された回転をするように前記チャック本体内に同軸で取り付けられた駆動リングを備え、前記駆動リングは、一連のカム面を備え、前記一連のカム面の各々は、前記駆動リングと前記チャック本体との相対回転中に前記一連のグリップピンのそれぞれと係合して、前記一連のグリップピンを前記第2位置から前記第1位置へ移動させる、装置。 - 請求項18に記載の装置であって、
前記駆動リングは、前記駆動リングが前記チャック本体の回転に関して静止して保持されることを可能にすることにより、前記一連のグリップピンを前記第2位置から前記第1位置へ移動させるために、少なくとも1つの永久磁石を取り付けられている、装置。 - 請求項14に記載の装置であって、
前記チャック本体は、磁気リングロータであり、前記処理チャンバは、前記処理チャンバの外面に取り付けられて前記磁気リングロータを取り囲む磁気ステータを備え、前記処理チャンバの円筒壁が前記磁気ステータと前記磁気リングロータとの間に配置される、装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/931,577 | 2015-11-03 | ||
US14/931,577 US9887120B2 (en) | 2015-11-03 | 2015-11-03 | Apparatus for treating surfaces of wafer-shaped articles |
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JP2017108115A true JP2017108115A (ja) | 2017-06-15 |
JP2017108115A5 JP2017108115A5 (ja) | 2020-01-16 |
JP6792414B2 JP6792414B2 (ja) | 2020-11-25 |
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JP2016213939A Active JP6792414B2 (ja) | 2015-11-03 | 2016-11-01 | ウエハ形状物品の表面を処理するための装置 |
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US (1) | US9887120B2 (ja) |
JP (1) | JP6792414B2 (ja) |
KR (1) | KR102644438B1 (ja) |
CN (1) | CN106952859B (ja) |
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WO2021065236A1 (ja) * | 2019-10-04 | 2021-04-08 | 株式会社荏原製作所 | 基板ホルダ及び基板処理装置 |
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CN110976933B (zh) * | 2019-12-10 | 2021-10-29 | 安庆师范大学 | 一种机械精加工用机床 |
TWI831361B (zh) * | 2022-09-06 | 2024-02-01 | 天正國際精密機械股份有限公司 | 檢測元件的承載裝置 |
Citations (2)
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JP2012522391A (ja) * | 2009-03-31 | 2012-09-20 | ラム・リサーチ・アーゲー | 円盤状の物品を処理するための装置 |
JP2013526018A (ja) * | 2010-04-16 | 2013-06-20 | ラム・リサーチ・アーゲー | 接地されたチャック |
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Also Published As
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TW201727821A (zh) | 2017-08-01 |
CN106952859A (zh) | 2017-07-14 |
KR20170054279A (ko) | 2017-05-17 |
JP6792414B2 (ja) | 2020-11-25 |
US9887120B2 (en) | 2018-02-06 |
CN106952859B (zh) | 2020-10-02 |
US20170125281A1 (en) | 2017-05-04 |
TWI710056B (zh) | 2020-11-11 |
KR102644438B1 (ko) | 2024-03-06 |
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