SG10201703225PA - Imprint apparatus, imprint method, and method of manufacturing article - Google Patents

Imprint apparatus, imprint method, and method of manufacturing article

Info

Publication number
SG10201703225PA
SG10201703225PA SG10201703225PA SG10201703225PA SG10201703225PA SG 10201703225P A SG10201703225P A SG 10201703225PA SG 10201703225P A SG10201703225P A SG 10201703225PA SG 10201703225P A SG10201703225P A SG 10201703225PA SG 10201703225P A SG10201703225P A SG 10201703225PA
Authority
SG
Singapore
Prior art keywords
imprint
manufacturing article
imprint apparatus
article
manufacturing
Prior art date
Application number
SG10201703225PA
Other languages
English (en)
Inventor
Shiode Yoshihiro
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG10201703225PA publication Critical patent/SG10201703225PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B29C2043/5858—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage for preventing tilting of movable mould plate during closing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
SG10201703225PA 2016-04-25 2017-04-19 Imprint apparatus, imprint method, and method of manufacturing article SG10201703225PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016087383A JP6700936B2 (ja) 2016-04-25 2016-04-25 インプリント装置、インプリント方法、および物品の製造方法

Publications (1)

Publication Number Publication Date
SG10201703225PA true SG10201703225PA (en) 2017-11-29

Family

ID=60089303

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201703225PA SG10201703225PA (en) 2016-04-25 2017-04-19 Imprint apparatus, imprint method, and method of manufacturing article

Country Status (6)

Country Link
US (1) US10828808B2 (ja)
JP (1) JP6700936B2 (ja)
KR (1) KR102126177B1 (ja)
CN (1) CN107305317B (ja)
SG (1) SG10201703225PA (ja)
TW (1) TWI718288B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6942491B2 (ja) * 2016-03-15 2021-09-29 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7134717B2 (ja) * 2018-05-31 2022-09-12 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7129259B2 (ja) * 2018-07-24 2022-09-01 キヤノン株式会社 検査方法、インプリント装置、および物品製造方法
JP7150535B2 (ja) * 2018-09-13 2022-10-11 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
US11759994B2 (en) 2019-07-24 2023-09-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and article manufacturing method
JP7309572B2 (ja) 2019-11-08 2023-07-18 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP7341769B2 (ja) * 2019-07-24 2023-09-11 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP7414627B2 (ja) 2020-04-15 2024-01-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US11869813B2 (en) 2020-12-15 2024-01-09 Canon Kabushiki Kaisha Planarization apparatus, planarization process, and method of manufacturing an article

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080160129A1 (en) 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US7636999B2 (en) 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
CN101604124B (zh) 2005-06-08 2011-07-27 佳能株式会社 模子、图案形成方法以及图案形成设备
JP4736821B2 (ja) 2006-01-24 2011-07-27 株式会社日立製作所 パターン形成方法およびパターン形成装置
TWI388418B (zh) * 2008-10-09 2013-03-11 Hitachi Ind Equipment Sys Precision imprinting device and its embossing load control method
KR20100135353A (ko) 2009-06-17 2010-12-27 주식회사 동진쎄미켐 임프린트 또는 롤-프린트 리소그래피용 스탬프 제조장치 및 제조방법
JP5822597B2 (ja) * 2010-10-01 2015-11-24 キヤノン株式会社 インプリント装置、及びそれを用いた物品の製造方法
JP6061524B2 (ja) 2011-08-11 2017-01-18 キヤノン株式会社 インプリント装置および物品の製造方法
JP5893303B2 (ja) 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
KR101924309B1 (ko) * 2011-12-20 2018-11-30 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
JP6166516B2 (ja) * 2012-07-17 2017-07-19 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP2015050437A (ja) * 2013-09-04 2015-03-16 キヤノン株式会社 インプリント装置および物品の製造方法
JP6363838B2 (ja) * 2014-01-08 2018-07-25 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2016021440A (ja) * 2014-07-11 2016-02-04 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6472189B2 (ja) * 2014-08-14 2019-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6553926B2 (ja) * 2015-04-09 2019-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6748461B2 (ja) 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法

Also Published As

Publication number Publication date
US20170305043A1 (en) 2017-10-26
JP2017199730A (ja) 2017-11-02
CN107305317B (zh) 2021-06-15
CN107305317A (zh) 2017-10-31
TW201738067A (zh) 2017-11-01
US10828808B2 (en) 2020-11-10
JP6700936B2 (ja) 2020-05-27
KR20170121707A (ko) 2017-11-02
KR102126177B1 (ko) 2020-06-24
TWI718288B (zh) 2021-02-11

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