SG11201605280UA - Imprint apparatus and method of manufacturing article - Google Patents

Imprint apparatus and method of manufacturing article

Info

Publication number
SG11201605280UA
SG11201605280UA SG11201605280UA SG11201605280UA SG11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA
Authority
SG
Singapore
Prior art keywords
imprint apparatus
manufacturing article
article
manufacturing
imprint
Prior art date
Application number
SG11201605280UA
Inventor
Kazuhiro Sato
Noriyasu Hasegawa
Takahiro Matsumoto
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG11201605280UA publication Critical patent/SG11201605280UA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1861—Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70158—Diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5816—Measuring, controlling or regulating temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Epidemiology (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG11201605280UA 2014-01-24 2015-01-20 Imprint apparatus and method of manufacturing article SG11201605280UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014011784A JP6294680B2 (en) 2014-01-24 2014-01-24 Imprint apparatus and article manufacturing method
PCT/JP2015/051950 WO2015111739A1 (en) 2014-01-24 2015-01-20 Imprint apparatus and method of manufacturing article

Publications (1)

Publication Number Publication Date
SG11201605280UA true SG11201605280UA (en) 2016-08-30

Family

ID=53681535

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201605280UA SG11201605280UA (en) 2014-01-24 2015-01-20 Imprint apparatus and method of manufacturing article

Country Status (6)

Country Link
US (2) US10300640B2 (en)
JP (1) JP6294680B2 (en)
KR (2) KR101996771B1 (en)
CN (2) CN105917442B (en)
SG (1) SG11201605280UA (en)
WO (1) WO2015111739A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005975A (en) * 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
JP6604793B2 (en) * 2015-09-17 2019-11-13 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6797627B2 (en) * 2015-11-24 2020-12-09 キヤノン株式会社 Imprinting equipment, imprinting methods, and manufacturing methods for articles
JP6685821B2 (en) * 2016-04-25 2020-04-22 キヤノン株式会社 Measuring apparatus, imprint apparatus, article manufacturing method, light quantity determination method, and light quantity adjustment method
JP6758967B2 (en) * 2016-07-12 2020-09-23 キヤノン株式会社 Imprinting equipment, imprinting method, and manufacturing method of goods
JP6827785B2 (en) * 2016-11-30 2021-02-10 キヤノン株式会社 Imprinting equipment, imprinting methods, and manufacturing methods for articles
JP6971567B2 (en) * 2016-12-16 2021-11-24 キヤノン株式会社 Alignment equipment, alignment methods, lithography equipment, and article manufacturing methods
US10998190B2 (en) * 2017-04-17 2021-05-04 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP6606567B2 (en) * 2017-04-17 2019-11-13 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6921600B2 (en) * 2017-04-20 2021-08-18 キヤノン株式会社 Imprint device, control data generation method, and article manufacturing method
JP6894285B2 (en) * 2017-04-26 2021-06-30 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
JP6937203B2 (en) 2017-09-14 2021-09-22 キオクシア株式会社 Imprinting equipment, imprinting method and manufacturing method of semiconductor equipment
US10996561B2 (en) * 2017-12-26 2021-05-04 Canon Kabushiki Kaisha Nanoimprint lithography with a six degrees-of-freedom imprint head module
JP7030533B2 (en) 2018-01-15 2022-03-07 キオクシア株式会社 Imprint device, imprint method, and manufacturing method of semiconductor device
JP7091151B2 (en) 2018-06-01 2022-06-27 キオクシア株式会社 Alignment marks, imprinting methods, and manufacturing methods for semiconductor devices
EP3614194A1 (en) * 2018-08-24 2020-02-26 ASML Netherlands B.V. Matching pupil determination
TWI771623B (en) * 2018-11-08 2022-07-21 日商佳能股份有限公司 Imprint apparatus and product manufacturing method
JP7267801B2 (en) 2019-03-26 2023-05-02 キヤノン株式会社 IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1211868A (en) * 1982-04-16 1986-09-23 Yoshikazu Nishiwaki Method of forming diffraction gratings and optical branching filter elements produced thereby
US4734746A (en) * 1985-06-24 1988-03-29 Nippon Kogaku K. K. Exposure method and system for photolithography
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
EP1154323A4 (en) * 1999-11-12 2003-07-16 Nippon Sheet Glass Co Ltd Photosensitive composition, and optical waveguide element and process for producing the same
US7322287B2 (en) * 2000-07-18 2008-01-29 Nanonex Corporation Apparatus for fluid pressure imprint lithography
JP2004022797A (en) * 2002-06-17 2004-01-22 Nikon Corp Device and method for detecting position of mark
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
JP2004259985A (en) 2003-02-26 2004-09-16 Sony Corp Resist pattern forming device, method for forming resist pattern and method for manufacturing semiconductor device using the forming method
TW571087B (en) * 2003-06-02 2004-01-11 Chen-Hung He Method and system for monitoring the mold strain in nanoimprint lithography technique
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
JP4795300B2 (en) * 2006-04-18 2011-10-19 キヤノン株式会社 Alignment method, imprint method, alignment apparatus, imprint apparatus, and position measurement method
US8221963B2 (en) * 2007-12-27 2012-07-17 Seiko Epson Corporation Method for producing fine structure
EP2131245A3 (en) * 2008-06-02 2012-08-01 ASML Netherlands BV Lithographic apparatus and its focus determination method
JPWO2009153925A1 (en) * 2008-06-17 2011-11-24 株式会社ニコン Nanoimprint method and apparatus
JP5451450B2 (en) * 2010-02-24 2014-03-26 キヤノン株式会社 Imprint apparatus, template thereof, and article manufacturing method
JP5539011B2 (en) * 2010-05-14 2014-07-02 キヤノン株式会社 Imprint apparatus, detection apparatus, alignment apparatus, and article manufacturing method
JP6140966B2 (en) 2011-10-14 2017-06-07 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same
JP5686779B2 (en) * 2011-10-14 2015-03-18 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same
JP2013098291A (en) * 2011-10-31 2013-05-20 Canon Inc Imprint device, imprint method, and object manufacturing method using the same
JP5817442B2 (en) 2011-11-04 2015-11-18 ヤマハ株式会社 Electrostatic electroacoustic transducer, electrostatic speaker, and electrostatic microphone
JP6066565B2 (en) * 2012-01-31 2017-01-25 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6029495B2 (en) * 2012-03-12 2016-11-24 キヤノン株式会社 Imprint method, imprint apparatus, and article manufacturing method using the same
JP6039917B2 (en) * 2012-05-22 2016-12-07 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method

Also Published As

Publication number Publication date
KR20160107324A (en) 2016-09-13
KR101996771B1 (en) 2019-07-04
US10919195B2 (en) 2021-02-16
CN109324476A (en) 2019-02-12
WO2015111739A1 (en) 2015-07-30
US10300640B2 (en) 2019-05-28
JP6294680B2 (en) 2018-03-14
CN109324476B (en) 2022-06-03
KR20180059565A (en) 2018-06-04
US20190240880A1 (en) 2019-08-08
CN105917442A (en) 2016-08-31
KR101894167B1 (en) 2018-08-31
US20160297117A1 (en) 2016-10-13
CN105917442B (en) 2018-12-11
JP2015138963A (en) 2015-07-30

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