JP6758967B2 - Imprinting equipment, imprinting method, and manufacturing method of goods - Google Patents

Description

The present invention relates to an imprinting apparatus, an imprinting method, and a method for manufacturing an article.

An imprinting apparatus is known in which an imprint material supplied on a substrate is brought into contact with a mold and energy for curing is given to the imprint material to form a pattern of a cured product to which the uneven pattern of the mold is transferred. ing.

In Patent Document 1, a replica mold having a uniform thickness and having an uneven pattern formed by using an electron beam drawing apparatus is used, and a replica mold to which the uneven pattern of the master mold is transferred by imprint processing is duplicated. It is stated that it should be done. The replica mold has a recess formed on the side opposite to the side where the pattern is formed, which is not found in the master mold.

JP 2013-175671

The duplicated replica mold is used as a mold for forming a pattern on the substrate. Therefore, as a mold (mold) for forming a pattern on an object such as a substrate or a replica mold, a mold having an almost constant thickness such as a master mold may be used, or a recess like a replica mold is provided. A mold may be used.

When adjusting the relative positions of the mold and the substrate, an image formed by the light (detection light) transmitted through the mold, which is the light from the marks provided on the mold and the object, is detected. However, the distance (thickness) through which the detection light passes through the mold differs depending on the presence or absence of the recess between the case where the master mold is used and the case where the replica mold is used. As a result, the imaging position of the image formed by the light from the mark shifts in the optical axis direction of the detection light, and it becomes difficult to detect the image with high resolution. Therefore, there is a possibility that an error may occur in the above-mentioned relative position adjustment.

An object of the present invention is to provide an imprinting apparatus capable of accurately detecting an image formed by light from a mark used for alignment even if the type of mold used for pattern formation changes.

The present invention is an imprinting device that forms a pattern of an imprint material on an object using a mold, and receives light from the mold and a mark provided on at least one of the objects through the mold. It has an image detecting means provided with a light receiving element, and an adjusting means for adjusting the focus state of an image formed on the light receiving element by light from the mark according to the type of the mold used for forming the pattern. It is characterized by that.

According to the present invention, even if the type of mold used for pattern formation changes, the image formed by the light from the mark used for alignment can be detected with high accuracy.

It is a figure which shows the structure of the imprint apparatus which concerns on 1st Embodiment. It is a figure which shows the example of the combination of the mold and the object to be processed. It is a figure which shows the structure of the imprint apparatus which concerns on 2nd Embodiment. It is a figure explaining the position of the optical member and the mark of the detection target which concerns on 3rd Embodiment. It is a flowchart which shows the adjustment method of the optical path length which concerns on 3rd Embodiment. It is a figure which shows the structure of the modification of the imprint apparatus which concerns on 3rd Embodiment. It is a figure explaining the position of the optical member and the mark of the detection target which concerns on 4th Embodiment. It is a figure explaining the deformation example of the position of the optical member and the mark of the detection target which concerns on 4th Embodiment. It is a figure which shows the structure of the imprint apparatus which concerns on 5th Embodiment. It is a figure which shows the structure of the imprint apparatus which concerns on 5th Embodiment. It is a figure which shows the structure of the drive mechanism. It is a flowchart which shows the adjustment method of the optical path length which concerns on 5th Embodiment. It is a figure explaining the operation of a drive mechanism. It is a figure which shows the structure of the imprint apparatus which concerns on 6th Embodiment. It is a figure which shows the structure of the imprint apparatus which concerns on 7th Embodiment. It is a figure which shows the structure of the deviation prevention means. It is a figure which shows the structure of the modification of the deviation prevention means. It is a figure which shows the manufacturing method of an article.

[First Embodiment]
(Configuration of imprint device)
FIG. 1 is a diagram showing a configuration of an imprint device 100 according to the first embodiment. The axis in the vertical direction is the Z axis, and the two axes orthogonal to each other in the plane perpendicular to the Z axis are the X axis and the Y axis.

In the present embodiment, the adjusting means for adjusting the focus state of the image in the image pickup element (light receiving element) 2b that receives the detection light 2d is the drive mechanism 3b. The drive mechanism 3b drives an optical element in the optical path of the detection light (first light) 2b along the optical path based on the information indicating the presence or absence of the recess 6d of the mold 6 to adjust the focus state.

In the imprint device 100, the imprint material 30 supplied on the substrate (object) 9 is brought into contact with the mold (mold) 6, and energy for curing is given to the imprint material 30, so that the uneven pattern of the mold 6 is formed. It is a device that forms a pattern of the transferred cured product.

As the imprint material 30, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as the energy for curing. The electromagnetic wave is, for example, light such as infrared rays, visible rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less.

The curable composition is a composition that is cured by irradiation with light or by heating. Of these, the photocurable composition that is cured by light may contain at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material 30 is supplied onto the substrate 9 by the supply unit 40. When the supply unit 40 is a spin coater, a slit coater, or the like, it is supplied in a film form on the substrate 9. When the supply unit 40 is a liquid injection head, it may be supplied on the substrate 9 in the form of droplets or islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

Glass, ceramics, metal, semiconductors, resins and the like are used for the substrate 9, and if necessary, a member made of a material different from the substrate may be formed on the surface thereof. Specific examples of the substrate include silicon wafers, compound semiconductor wafers, and quartz glass.

In the present embodiment, the case where the imprint material 30 cured by the light (second light) 1a emitted from the irradiation unit 1 is used will be described.

The outer circumference of the mold 6 when viewed from the + Z direction is rectangular, and a three-dimensional pattern (for example, an uneven shape such as a circuit pattern) 6b to be transferred to the imprint material 30 is formed on the side facing the substrate 9. It has a patterned portion 6c. A plurality of mold-side marks 6a are provided on the pattern portion 6c. A recess 6d is provided on the side opposite to the pattern portion 6c.

The recess 6d may have a cylindrical shape or a prismatic shape. The imprinting apparatus 100 supplies gas to the recess 6d to bring the pattern portion 6c into contact with the imprinting material 30 while bending it downward, so that air bubbles are generated between the imprinting material 30 and the mold 6 at the time of contact. Suppress entry.

As the material of the mold 6, a material capable of transmitting the light 1a and the detection light 2d detected by the detection system 2 is used.

The detection system (image detection means) 2 receives the detection light 2d from at least one mark of the mold side mark 6a and the substrate side mark 9a provided on the substrate 9, and the detection light 2d is the image sensor 2b. It has a scope 2a having a detection optical system 2c leading to. As a result, the image formed by the light from the mark to be detected is detected. That is, the image formed by the light reflected or diffracted from the mark to be detected is detected. It is preferable to have a plurality of scopes 2a in order to detect an image formed by light from a plurality of marks at the same time.

The light that illuminates the mark to be detected may be the light emitted from the detection system 2 or the light emitted from another optical system. A part of the light illuminated on the mark to be detected becomes the detection light 2d.

The detection light 2d is a detection system via a relay optical system 3 which includes two optical elements 3a and other optical elements (not shown) and forms an intermediate image of an image formed by light from a mark to be detected. It is incident on 2. The drive mechanism 3b moves the optical element in the optical path of the detection light (first light) 2d along the optical path of the detection light 2d.

The wavelength of the detection light 2d may be any wavelength band as long as the light has a wavelength that does not cure the imprint material 30. In particular, it is preferable to include light in a wide wavelength band among λ = 450 to 1200 nm. The light having a wide wavelength band may be light having a continuous wavelength band or light including light having a plurality of discrete wavelengths. As a result, even if the substrate side mark 9a has a lower detection accuracy for light of a specific wavelength depending on the process of the substrate pattern previously formed on the substrate 9, the substrate side mark 9a is detected with high accuracy. be able to.

The drive mechanism 4 drives the mold 6 along the Z-axis direction in the contact operation and the pulling operation of the imprint material 30 and the mold 6. The drive mechanism 4 may include a drive mechanism that drives the mold 6 in the X-axis direction, the Y-axis direction, and the rotation direction around each XYZ axis. The holding portion 5 holds the mold 6 by a vacuum suction force or an electrostatic force. The holding portion 8 holds the substrate 9 by a vacuum suction force or an electrostatic force. A space 70 is formed in the central portion of the holding portion 5 and the driving mechanism 4.

The stage 7 on which the holding portion 8 is placed moves the substrate 9 together with the holding portion 8 along the X-axis direction and the Y-axis direction. The stage 7 moves the substrate 9 based on the detection result of the detection system 2 and aligns the mold 6 with the substrate 9. The position of the stage 7 is measured by a measuring means (not shown) such as an interferometer or an encoder. The stage 7 may move the substrate 9 in the Z-axis direction or in the rotation direction around each XYZ axis. The contact operation and the pulling operation of the imprint material 30 and the mold 6 may be performed only by the stage 7 or by moving both the stage 7 and the drive mechanism 4 along the Z-axis direction.

The control unit 60 is connected to the lighting unit 1, the drive mechanism 4, the holding unit 5, the holding unit 8, the driving mechanism 3b, and the supply unit 40 by wire or wirelessly, and forms a pattern by imprint processing, which will be described later. These are controlled during the imprint process. The control unit 60 includes a CPU and a storage unit (not shown).

(About mark detection)
One mold-side mark 6a and a substrate-side mark 9a are configured by, for example, a concave-convex structure exhibiting a rectangle, a line and space having a predetermined pitch, a paddy shape, a cross shape, and the like.

The substrate side marks 9a are provided in each of the plurality of shot regions (processed regions) on the substrate 9. The shot region is a unit region of the base layer for which the pattern has already been formed, and one shot region has a size of, for example, about 26 mm × 33 mm. One or a plurality of chip size patterns desired by the user are formed in one shot area, and are separated by a scribe line (not shown) on which a substrate side mark 9a is formed.

FIG. 1 shows how the detection system 2 detects moire fringes (images formed by light from the marks) generated by light diffracted in order by the substrate side mark 9a and the mold side mark 6a. Moire fringes can be formed by adopting lines and spaces having different pitches as the mold side mark 6a and the substrate side mark 9a. Based on the detection result, the amount of misalignment (relative position) between the mold 6 and the substrate 9 is acquired. The stage 7 moves the substrate 9 so that the acquired misalignment amount is reduced.

The detection system 2 may detect an image of the mold-side mark 6a different from the mark that causes the moire fringes described above. Based on the amount of misalignment between the reference mark 7a and the mold side mark 6a obtained from the image detection result of the reference mark 7a and the mold side mark 6a on the stage 7, the control unit 60 determines the position of the mold 6 with respect to the holding unit 5. You may get it.

The detection system 2 may detect a substrate-side mark 9a and a reference mark 7a, which are different from the above-mentioned marks that cause moire fringes. The control unit 60 may calculate the arrangement of the shot region based on the positional deviation between the reference mark 7a and the substrate side mark 9a obtained from the detection result.

The detection system 2 may acquire the shape difference between the mold 6 and the shot region on the substrate 9 based on the detection results from the plurality of scopes 2a. The control unit 60 may deform the mold 6 in order to improve the superposition accuracy by using the information of the shape difference.

In the following description, a case of detecting moire fringes will be described.

(Adjustment of focus state)
2 (a) to 2 (d) show the duplicated mold 6 (master mold) when the mold 6 is duplicated as in Patent Document 1, and the blank mold 13 as an object on which a pattern is formed. The combination with 14 is illustrated. In FIGS. 2 (a) to 2 (d), the illumination unit 1, the detection system 2, the relay optical system 3, the drive mechanism 3b, the optical member 10, the supply unit 40, and the control unit 60 are not shown.

The blank molds 13 and 14 have substantially the same outer shape as the mold 6, and are molds in which the uneven pattern 6b is not formed. The blank mold 13 has a recess 13d, and the blank mold 14 has no recess. FIGS. 2A and 2B show how a pattern is formed using a mold 6 (second mold) having a recess 6d. FIGS. 2 (c) and 2 (d) show how a pattern is formed by using a mold 6 (first mold, mold having a uniform thickness) having no recess.

The detection light 2d passes through the mold 6 and heads toward the scope 2a. However, when the mold 6 having the recess 6d and the mold 6 having no recess 6d are used in the same imprint device 100, the optical path length of the detection light 2d changes by the amount of the recess 6d depending on the presence or absence of the recess 6d in the mold 6.

For example, when the total thickness of the mold 6 is about H2 = 10 mm and the thickness of the recess 6d is about H1 = 8 to 9 mm, the change in the optical path length is as much as 2.5 mm. Since the depth of focus in the scope 2a with NA of 0.1 is about 30 μm, when the mold 6 with the recess 6d is simply changed to the mold 6 without the recess 6d (or vice versa), the mark to be detected can be detected. It disappears or the detection accuracy decreases.

In order to compensate for the difference in detection accuracy, the imprint device 100 has an adjusting means for adjusting the focus state of the image formed by the light from the mark to be detected in the image sensor 2a. In this embodiment, the drive mechanism 3b is provided.

The control unit 50 confirms the type of mold in advance. That is, information indicating the presence or absence of the recess 6d of the mold 6 is acquired before the start of the alignment operation. The information is information input by the user to the imprint device 100 via the interface.

Next, according to the instruction of the control unit 50, the drive mechanism 3b moves the optical element in the relay optical system 3 along the optical path of the detection light 2d. As a result, the drive mechanism 3b can keep the mark to be detected within the depth of focus of the scope 2a. The optical element is preferably a zoom optical system capable of enlarging or reducing the image of the incident detection light 2d by moving along the optical path. The drive mechanism 3b may move a plurality of optical elements included in the relay optical system 3 as a whole along the optical path of the detection light 2d.

In this way, the drive mechanism 3b adjusts the focus state of the image from the mark to be detected on the image sensor 2b based on the information indicating the presence or absence of the recess 6d, that is, according to the type of the mold 6. As a result, the change in the focus state due to the change in the type of the mold 6 is reduced, and the detection system 2 can detect the moire fringes with high accuracy.

If the misalignment between the substrate 9 and the mold 6 can be detected with high accuracy, a pattern can be formed on the substrate 9 in a state where the misalignment is reduced in the stage 7. As a result, it is possible to improve the superposition accuracy of the underlying pattern and the newly formed pattern.

When the detection system 2 detects moire fringes without going through the relay optical system 3, the detection optical system 2c may be moved in advance along the optical path of the detection light 2d according to the type of the mold 6. Alternatively, the drive mechanism 3b may move the position of the image pickup element 2b instead of the optical element along the optical path of the detection light 2d.

[Second Embodiment]
The imprint device 200 according to the second embodiment will be described with reference to FIGS. 3 to 5. The same members as those in FIGS. 1 are designated by the same reference numerals with respect to FIGS. 3 to 4, and detailed description thereof will be omitted.

The imprint device 200 includes an optical member 80 and a drive mechanism (control means) 81 as adjustment means for adjusting the focus state of the image in the image pickup device 2b that receives the detection light 2d. In the present embodiment, the optical member 80 and the drive mechanism 81 are used so that the optical path of the detection light 2d becomes an optical path according to the type of the mold 6 and the position of the optical member 80, and an image is taken from the mark to be detected. The optical path length up to the element 2a is adjusted.

The two optical members 80 are fixedly arranged and each has a shape extended in the Y-axis direction. As shown in FIG. 4, the optical member 80 is arranged outside the optical path of the light 1a.

As the material of the optical member 80, a material capable of transmitting the detection light 2d is used. For example, glasses such as quartz glass, silicic acid-based glass, calcium fluoride, magnesium fluoride, and acrylic glass may be used. The material of the mold may be a resin such as sapphire, gallium nitride, polycarbonate, polystyrene, acrylic, or polypropylene. Alternatively, these laminated materials may be used. When the material of the optical member 80 and the material of the mold 6 are the same, it is preferable that the optical member 80 has a thickness equal to the thickness of the recess 6d (distance in the Z direction).

The optical member 80 can be freely arranged as long as it is on the recess 6d side with respect to the mold 6. Since the detection light 2b from the mark 6a spreads in the space according to NA, a larger optical member 80 is required when the optical member 80 is arranged at a position away from the mold 6, as shown in FIG. It is preferably fixed to the holding portion 5.

The drive mechanism 81 controls the detection system 2. Specifically, only the detection optical system 2c or the scope 2a is moved in a plane (in the XY plane) intersecting the optical axis of the detection light 2d. The drive mechanism 81 is connected to the control unit 60 (not shown).

Further, it has a partition wall portion 31 that separates the space in which the detection system 2 is arranged (first space) and the space in which the pattern is formed (second space).

The program shown in the flowchart of FIG. 5 is stored in the storage unit of the control unit 60.
While the CPU of the control unit 60 reads the program, the control unit 60 controls each component connected to the control unit 60.

In order to make the optical path of the detection light 2d different depending on the presence or absence of the recess 6d, the mold 6 and the substrate 9 in which the marks to be detected are formed at different positions are carried into the imprint device 200. In the present embodiment, it is utilized that the positions of the marks to be detected are different.

Next, the flowchart of FIG. 5 will be described. First, in S11, the control unit 60 confirms information regarding the type of mold. That is, information indicating the presence or absence of the recess 6d of the mold 6 is acquired before the start of the alignment operation between the substrate 9 and the mold 6. The information is information input by the user to the imprint device 100 via the interface. In S12, the control unit 60 determines the presence or absence of the recess 6d.

A case where Yes is determined in S12 will be described. 4 (a) and 4 (b) are views of the optical member 80 and the mold 6 as viewed from the + Z direction. FIG. 4A corresponds to FIG. 3A, and shows a state of detecting moire fringes formed by the mold side mark 6a and the substrate side mark 9a of the mold 6 having the recess 6d. In the mold 6 having the recess 6d, the mold side mark 6a is arranged along the short side (the side along the Y-axis direction) of the pattern portion 6c. The control unit 12 notifies the drive mechanism 81 of the approximate positions of the mold side mark 6a and the substrate side mark 9a.

In S13, the drive mechanism 81 moves the plurality of scopes 2a in the XY plane, respectively, and the scopes 2a are arranged at positions where the detection light 2d from the mold side mark 6a and the substrate side mark 9a passes through the optical member 80.

The case where No is determined in S12 will be described. FIG. 4B corresponds to FIG. 3B, and shows a state in which the mold side mark 6a of the mold 6 having no recess 6d is detected. In the mold 6 having no recess 6d, the mold side mark 6a is arranged along the long side (the side along the X-axis direction) of the pattern portion 6c.

In S14, the drive mechanism 81 moves the plurality of scopes 2a according to the instruction of the control unit 60, and moves the scopes 2a to a position where the detection light 2d does not pass through the optical member 80.

After moving the scope 2a or in parallel with the movement of the scope 2a, the imprint material 30 is supplied, the contact operation between the mold 6 and the imprint material, the curing of the imprint material 30, the mold 6 and the imprint material An imprint process including separation from 30 is performed.

Before or during the contact between the mold 6 and the imprint material 30, in S15, the detection system 2 detects the mold side mark 6a and the substrate side mark 9a, and based on the detection result, the mold 6 and the mold 6 The relative position with respect to the substrate 9 is calculated. Based on the obtained relative position information, the drive mechanism 4 and the stage 7 are used to align the mold 6 and the substrate 9 on the XY plane. This completes the description of the flowchart.

In the imprint device 200, the optical path length of the detection light 2b, which is shortened due to the formation of the recess 6d, is complemented by transmitting the optical member 80 through the detection light 2d. That is, the optical path length of the detection light 2b when the mold 6 having the recess 6d is used is close to the optical path length of the detection light 2b when the mold 6 without the recess 6d is used. Specifically, the drive mechanism 81 drives the scope 2a so that the optical path of the detection light 2d becomes an optical path according to the type of the mold 6 and the position of the optical member 80.

By adjusting the optical path length in this way, the difference in optical path length due to the presence or absence of the recess 6d can be reduced, and moire fringes can be detected with substantially the same accuracy regardless of the presence or absence of the recess 6d. That is, this reduces the change in the focus state due to the change in the type of the mold 6, and the detection system 2 can detect the moire fringes with high accuracy.

If the misalignment between the substrate 9 and the mold 6 can be detected with high accuracy, a pattern can be formed on the substrate 9 in a state where the misalignment is reduced in the stage 7. As a result, it is possible to improve the superposition accuracy of the underlying pattern and the newly formed pattern.

The imprint device 200 can be configured more compactly than the imprint device 100 as compared with the case where the optical element is moved along the optical path length.

Further, by having the partition wall portion 31, it is possible to prevent particles that are likely to be generated when the scope 2a is moved from entering the space where the pattern is formed. As a result, when the mold 6 and the imprint material 30 are brought into contact with each other, it is possible to reduce damage to the mold 6 and poor pattern formation due to particles being sandwiched in the recesses of the pattern 6b.

The information indicating the type of the mold 6 input to the imprint device 100 by the user may be information indicating the position of the mold side mark 6a formed on the mold 6 carried into the imprint device 200. In this case, the drive mechanism 81 moves the scope 2a based on the information without making a determination in S12. After confirming that the position of the mold side mark 6a corresponds to the transmission / non-transmission of the optical member 80, the detection of moire fringes may be started.

When the optical member 80 may enter the optical path of the light 1a, the scope 2a is such that the detection light 2d passes through the oblique mold 6 with respect to the optical axis of the light 1a as shown in FIG. 6A. It is good to place. Compared with the above-described embodiment, the optical members 80 can be arranged on the left and right sides in the X-axis direction, and the occurrence of uneven exposure of the light 1a can be suppressed.

Further, as shown in FIG. 6B, it is still preferable to arrange the optical member 80 diagonally so that the detection light 2d is vertically incident on the optical member 80. As a result, it is possible to suppress a decrease in the detection accuracy (decrease in resolution) of moire fringes due to the tilting of the optical axis of the detection light 2d.

[Third Embodiment]
The optical member 80 used in the second embodiment constitutes a portion in which the optical path length for the detection light 2d to pass through the optical member 80 is an optical path length that complements the optical path length difference depending on the presence or absence of the recess 6d. Was.

The imprint device 300 according to the third embodiment is different from the imprint device 200 in that the optical member 80 has a portion 80a and a portion 80b having different optical path lengths for the detection light 2d to pass through. The optical path length may be different depending on the thickness of the portion 80a and the portion 80b, or the optical path length may be different due to the difference in the material.

By using such an optical member 80, three types of molds 6 having different optical path lengths for the detection light 2d to pass through can be used in one imprinting device 300.

For example, when the materials of the three types of molds 6 are the same and the detection light 2d transmits the mold along the Z-axis direction, the three types of molds 6 having different thicknesses of the portions through which the detection light 2d transmits are used. Can be used. For example, two molds 6 having recesses 6d of different depths and a mold 6 without recesses 6d.

Mold side marks 6a are provided at different positions for the three types of molds 6. This makes it possible to select three optical paths: an optical path that does not allow the optical member 80 to pass through the detection light 2d, an optical path that allows the portion 80a to pass through the detection light 2d, and an optical path that allows the portion 80b to pass through the detection light 2d.

7 (a) to 7 (c) are views of the optical member 80 and the mold 6 as viewed from the + Z direction. FIG. 7 shows a case where the mold side mark 6a is arranged at a position outside the pattern portion 6c. In FIG. 7, the same members as those in the above drawings are designated by the same reference numerals, and detailed description thereof will be omitted.

The control unit 60 acquires information indicating the thickness of the mold 6 of the portion through which the detection light 2d passes as information indicating the type of the mold 6, and moves the scope 2a based on the information indicating the thickness.

For example, when a mold 6 having a thickness A is used, the scope 2a is moved to a position where the mold side mark 6a below the portion 80a of the optical member 80 can be detected as shown in FIG. When the mold 6 having a thickness B is used, the scope 2a is moved to a position where the mold side mark 6a below the portion 80a of the optical member 80 can be detected. When the mold 6 having a thickness C is used, the scope 2a is moved to a position where the detection light 2d does not pass through the optical member 80.

However, it is assumed that the thickness A <thickness B <thickness C, and the optical path length in the portion 80a> the optical path length in the portion 80c.

In particular, it is preferable to detect at least two mold-side marks 6a arranged so as to be offset in the X-axis direction (first direction) and the Y-axis direction (second direction). Thereby, the positional deviation between the mold 6 and the substrate 9 in the X-axis direction and the Y-axis direction, and the positional deviation in the rotation direction can be measured.

According to this embodiment, it has the same effect as the imprinting apparatus 200. Furthermore, more types of molds 6 can be used than the imprinting apparatus 200.

The number of regions having different optical path lengths may be changed as appropriate. As shown in FIG. 8, an optical member 80 having four portions 80c, 80d, 80e, and 80f having different optical path lengths may be arranged along each side of the pattern portion 6c. By detecting four mold-side marks 6a and four substrate-side marks 9a with the detection light 2d transmitted through the region having the same optical path length, it is possible to correspond to the thicknesses of the four types of molds 6.

[Fourth Embodiment]
The imprint device 400 according to the fourth embodiment uses a romvoid prism as the fixedly arranged optical member 80 as shown in FIG. In FIG. 9, the same members as those in FIG. 3 are designated by the same reference numerals, and detailed description thereof will be omitted. The supply unit 40 and the control unit 60 are not shown.

The romvoid prism is an optical member that reflects the vertically incident detection light 2d twice on the inner surface and then emits the light toward the scope 2a. Instead of the romvoid prism, two reflection mirrors may be arranged obliquely with respect to the Z-axis direction for each luminous flux of one detection light 2d.

In this embodiment as well, the drive mechanism 81 drives the scope 2a so that the optical path is set according to the type of the mold 6 and the position of the optical member 80. This has the same effect as that of the second embodiment.

Further, by bending the optical path of the detected light 2d in the horizontal direction using a romvoid prism, the optical path length that passes through the optical member 80 can be lengthened for the thickness. As a result, even when the change in the optical path length in the mold 6 is large depending on the presence or absence of the recess 6d, or when there is not enough space for arranging the thick optical member 80 in the optical axis direction of the detection light 2d, the moire fringes are accurate. It can be detected well.

[Fifth Embodiment]
FIG. 10 is a diagram showing the configuration of the imprint device 500 according to the fifth embodiment. The imprint device 500 includes an optical member 10 and a drive mechanism (arrangement means) 11 as adjustment means for adjusting the focus state of the image in the image pickup device 2b that receives the detection light 2d. The position of the optical member 10 is variable, and the drive mechanism 11 arranges the optical member 10 at a position corresponding to the type of the mold 6 to adjust the optical path length from the mark to be detected to the image sensor 2a. For example, the optical member 10 is arranged in or outside the optical path of the detection light 2d.

The program shown in the flowchart of FIG. 12, which will be described later, is stored in the storage unit of the control unit 60. In addition, the same members as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.

As the material of the optical member 10, a material capable of transmitting light 1a and detection light 2d is used. For example, any or a combination of the materials exemplified in the optical member 80 may be used. When the material of the optical member 10 and the material of the mold 6 are the same, it is preferable that the optical member 10 has a thickness equal to the thickness of the recess 6d (distance in the Z direction).

The configuration of the adjusting means including the optical member 10 and the drive mechanism 11 is illustrated in FIGS. 11A to 11C. The drive mechanism 11 shown in FIG. 11A has a shaft portion 16a and a drive portion 17 that rotates the shaft portion 16a around the Z axis. The support portion 10a is a member that supports the optical member 10, and is connected to the support portion 10b connected to the shaft portion 16a. The drive mechanism 11 arranges the optical member 10 in or out of the optical path of the detection light 2d by rotating the shaft portion 16a.

In the drive mechanism 11 shown in FIG. 11B, the drive unit 17b rotates the shaft portion 16b around the Y-axis to arrange the optical member 10 in or out of the optical path of the detection light 2d.

The drive mechanism 11 shown in FIG. 11C moves the optical member 10 in the uniaxial direction along the guide 20 by a drive mechanism such as a ball screw or a linear motor. By moving the optical member 10, the optical member 10a is arranged in or out of the optical path of the detection light 2d. The configuration of the drive mechanism 11 is not limited to these examples as long as the optical member 10 can be arranged in the optical path of the detection light 2d or outside the optical path.

Next, the step of adjusting the optical path length of the detection light 2d will be described with reference to the flowchart shown in FIG. 12 and the diagram explaining the movement of the drive mechanism 11 shown in FIG. In FIGS. 13A and 13B, the illumination unit 1, the detection system 2, the relay optical system 3, the supply unit 40, and the control unit 60 are not shown.

The CPU of the control unit 60 reads the program shown in the flowchart of FIG. 12 from the storage unit and executes the program.

In S21, the control unit 60 confirms information regarding the type of mold. That is, information indicating the presence or absence of the recess 6d of the mold 6 is acquired before the start of the alignment operation between the substrate 9 and the mold 6. The information is information input by the user through the interface to the imprint device 500. In S12, the control unit 60 determines the presence or absence of the recess 6d.

In S22, the control unit 50 determines whether or not the mold 6 has the recess 6d. When the control unit 60 determines that the recess 6d is present, the drive mechanism 11 is controlled to arrange the optical member 10 in the optical path of the detection light 2d as shown in FIG. 13A (S23). When the control unit 60 determines that there is no recess 6, the drive mechanism 11 is controlled to arrange the optical member 10 outside the optical path of the detection light 2d as shown in FIG. 13 (b) (S24).

The preferable thickness of the optical member 10 will be described. For the sake of simplicity, the materials of the mold 6 having no recess 6d, the mold 6 having the recess 6d, and the optical member 10 have the same refractive index. In FIG. 13, the thickness of the mold 6 having the recess is H1, the thickness of the mold without the recess 6d is H2, the thickness of the recess 6d of the mold 6 is H3, and the thickness of the optical member 10 is H.

In this case, it is preferable to keep the optical path length of the detection light 2d constant regardless of the thickness of the mold 6. That is, the sum of the thickness H2 of the portion through which the detection light 2d of the mold 6 having the recess 6d is transmitted and the thickness H of the optical member 10 and the thickness H2 of the portion through which the detection light 2d of the mold 6 without the recess is transmitted. , Are preferably equal. That is, it is preferable that the relational expression of H1 + H4 = H2 is established. From this, it is preferable that the thickness H4 of the optical member 10 is equal to the thickness H3 of the recess 6d.

When the refractive index characteristic of the optical member 10 is different from that of the mold 6, it is preferable that the thickness of the optical member 10 is determined regardless of the above-mentioned relational expression. For example, the sum of the optical path length for the detection light 2d to pass through the optical member 10 and the optical path length for passing through the mold 6 having the recess 6d is equal to the optical path length of the portion passing through the mold 6 without the recess 6d. Is preferable.

After the optical member 10 is arranged in or out of the optical path of the detection light 2d, or in parallel with the movement of the optical member 10, the imprint process is performed. The imprint process includes the supply of the imprint material 30, the contact operation between the mold 6 and the imprint material, the curing of the imprint material 30, and the separation of the mold 6 and the imprint material 30.

In S25, the detection system 2 detects the mold side mark 6a and the substrate side mark 9a before or during the contact between the mold 6 and the imprint material 30, and based on the detection result, the mold 6 and the imprint material 30 are contacted. The relative position with respect to the substrate 9 is calculated. Based on the obtained relative position information, the drive mechanism 4 and the stage 7 are used to align the mold 6 and the substrate 9 on the XY plane. After the alignment, the imprint device 500 uses the irradiation unit 10 to cure the imprint material 30.

In the imprint device 500, the optical path length shortened due to the formation of the recess 6d is complemented by transmitting the optical member 10 through the detection light 2d. That is, the optical path length of the detection light 2b when the mold 6 having the recess 6d is used is close to the optical path length of the detection light 2b when the mold 6 without the recess 6d is used. Specifically, when the drive mechanism 11 is a mold 6 having a recess 6d, the optical member 10 is arranged in the optical path of the detection light 2d, and in the case of the mold 6 having no recess 6d, the optical member 10 is placed in the optical path of the detection light 2d. Place it outside.

By adjusting the optical path length in this way, the difference in optical path length due to the presence or absence of the recess 6d can be reduced, and moire fringes can be detected with substantially the same accuracy regardless of the presence or absence of the recess 6d. As a result, the change in the focus state due to the change in the type of the mold 6 is reduced, and the detection system 2 can detect the moire fringes with high accuracy.

If the misalignment between the substrate 9 and the mold 6 can be detected with high accuracy, a pattern can be formed on the substrate 9 in a state where the misalignment is reduced in the stage 7. As a result, it is possible to improve the superposition accuracy of the underlying pattern and the newly formed pattern.

Further, in the imprint device 500, when the optical member 10 is arranged in the optical path of the detection light 2d, the optical member 10 is also arranged in the optical path of the illumination light 1a. As a result, it is possible to compensate for the change in the optical path length of the illumination light 1a due to the change in the type of the mold 6, so that the exposure unevenness on the substrate 9 can be reduced.

[Sixth Embodiment]
Like the imprint device 500, the optical member 10 is located in the mold 6 of the optical path of the detection light 2d from the optical path in the optical path of the relay optical system 3 from the viewpoint of detection accuracy of the substrate side mark 9a and the mold side mark 6a. It is preferable that they can be arranged on the near side. The optical path length varies depending on the presence or absence of the recess 6d because it is closer to the mold 6 than the pupil surface in the optical path of the relay optical system 3. However, if it can be arranged in the optical path of the detection light 2d, it may be arranged at another position.

FIG. 14 is a diagram showing the configuration of the imprint device 600 according to the second embodiment. In FIG. 14, the same members as those in FIG. 10 are designated by the same reference numerals, and detailed description thereof will be omitted. The supply unit 40, the transport mechanism 50, and the control unit 60 are not shown.

It differs from the imprint device 500 in that the optical member 10 and the drive mechanism 11 are provided in the detection system 2, that is, in the optical path of the detection light 2d, closer to the detection system 2 than the pupil surface of the relay optical system 3. .. The optical member 10 and the drive mechanism 11 corresponding to each of the plurality of scopes 2a may be provided.

Similar to the imprint device 500, the drive mechanism 11 arranges the optical member 10 in or out of the optical path of the detection light 2d according to the type of the mold 6 conveyed to the imprint device 600.

Further, when the optical member 10 is arranged in the optical path of the detection light 2d, the drive mechanism 11d drives the optical member 10d to arrange the optical member 10d in the optical path of the light 1a.

As a result, the same effect as that of the fifth embodiment can be obtained.

The imprinting devices 500 and 600 may include a plurality of types of optical members 10 having different materials and thicknesses. Even when molds 6 having different optical path lengths for transmitting the detection light 2d are used, appropriate optical members 10 are combined and arranged in the optical path according to the mold 6 used. As a result, the optical path length from the mark to be detected to the image sensor 2b can be brought close to a predetermined optical path length.

[7th Embodiment]
FIG. 15 is a diagram showing the configuration of the imprint device 700 according to the third embodiment. In FIG. 15, the same members as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. The supply unit 40 and the control unit 60 are not shown.

The imprint device 700 is a drive mechanism capable of mounting the optical member 10 on the mold 6 according to the types of the optical member 10 and the mold 6 as an adjusting means for adjusting the focus state of the image in the image sensor 2b that receives the detection light 2d. (Placement means) 55.

The drive mechanism 55 has a holding portion 56 that holds the optical member 10 by an electrostatic force or a vacuum suction force. The transport mechanism 50 transports only the mold 6 or the mold 6 on which the optical member 10 is placed to the holding portion 5.

The steps S21 to S23 shown in FIG. 12 are similarly carried out in this embodiment. When the mold held by the holding unit 5 is a mold 6 having a recess 6d, in S13, the drive mechanism 55 places the optical member 10 in the recess 6d based on the instruction of the control unit 60 (not shown). On the other hand, when the mold held by the holding unit 5 is a mold 6 having no recess 6d, in S13, the control unit 60 instructs the drive mechanism 55 to stand by, and the drive mechanism 55 molds the optical member 10 6 Do not place it on.

After that, the imprint device 700 starts the imprint process after passing through the step of transporting the mold 6 to the holding portion 5 by using the transport mechanism 50 before S25. After that, the stage 7 starts the alignment of the mold 6 and the substrate 9 based on the detection result of the image formed by the light from the mark by the detection system 2.

As described above, for the mold 6 having the recess 6d, the optical path length for the detection light 2d to pass through the mold 6 having the recess 6d and the optical path length for the detection light 2d to pass through the mold 6 without the recess 6d. An optical member 10 that complements the difference is placed. By placing the optical member 10 and adjusting the optical path length from the mark to be detected to the image sensor 2a, the focus state of the image from the mark on the image sensor 2a is adjusted.

The change in the focus state due to the change in the type of the mold 6 is reduced, and the detection system 2 can detect the moire fringes with high accuracy.

If the misalignment between the substrate 9 and the mold 6 can be detected with high accuracy, a pattern can be formed on the substrate 9 in a state where the misalignment is reduced in the stage 7. As a result, it is possible to improve the superposition accuracy of the underlying pattern and the newly formed pattern.

In particular, since the drive mechanism 55 is driven at a position far from the space below the holding portion 5 where the pattern is formed, the particles driven by the drive mechanism 55 cause damage to the mold 6 and pattern defects during the imprint process. The fear can be reduced.

The imprint device 700 may include a plurality of types of optical members 10. Regardless of the presence or absence of the recess 6d, it is driven according to the type of the mold 6 in which the thickness of the mold 6 through which the detection light 2d is transmitted, the material of the mold 6, the thickness (depth) of the recess 6d, etc. are different. The mechanism 55 may mount an appropriate optical member 10.

A modified example of the third embodiment will be described with reference to FIGS. 16 and 17. FIG. 16 is a diagram showing the configuration of the optical member 10 and the mold 6 having means for preventing the positional deviation between the optical member 10 and the mold 6, respectively. As shown in FIG. 16A, the displacement preventing means are a chamfered portion 21 provided on the optical member 10 and a chamfered portion 22 provided on the mold 6. The chamfered portion 21 and the chamfered portion 22 are provided so that the horizontal length d2 of the bottom portion of the optical member 10 is longer than the horizontal length d1 of the bottom portion of the recess 6d.

The misalignment preventing means shown in FIG. 16B is a convex portion 23 provided at the bottom of the optical member 10 and a local concave portion 24 provided at the concave portion 6d, and the convex portion 23 and the concave portion 24 are engaged with each other to form optics. Prevents the member 10 from shifting.

The displacement preventing means shown in FIG. 17 is an opening 26 opened in the mold 6 at a position facing the optical member 10 when placed in the recess 6d. The mold 6 is mounted on the hand 25 of the transport mechanism 50 that transports the mold 6 to the holding portion 5, and the mold 6 is attracted to the hand 25 by exhausting the inside of the opening 26 and the flow path 27.

By these deviation prevention means, the optical member 10 is slightly tilted with respect to the mold 6 during transportation to the holding portion 5, so that an error occurs in the optical path length of the detection light 2d and the detection accuracy is lowered. It can be suppressed.

[8th Embodiment]
Depending on the individual difference of the mold 6, the thickness of the mold 6 and the formation position of the mark 6a may be slightly different. Therefore, in the present embodiment, the adjusting means described in the first to seventh embodiments roughly adjusts the focus state of the image formed on the image pickup device 2d by the detection light 2b, and then the optical element in the optical path of the detection light 2b. Fine-tune the focus state by moving the sensor along the optical path. As the fine adjustment, the optical element is arranged at a position where the best focus state is obtained by moving the optical element by a predetermined distance. That is, the adjusting means adjusts the focus state according to the type of the mold 6, and the optical element makes fine adjustments for reducing a minute error in the focus state caused by individual differences of the mold 6.

Thereby, in addition to the above-mentioned effect, it is possible to reduce the error of the focus state caused by the individual difference of the mold 6. In particular, when this embodiment is carried out in combination with the second to seventh embodiments, the optical element is compared with the case where the focus state is adjusted only by moving the optical element in the optical path of the detection light 2b along the optical path. It is possible to reduce the time required for the movement and the space required for the movement.

[Other Embodiments]
Other embodiments applicable to the first to eighth embodiments will be described.

When the type of mold 6 is different, the shape of the mold (presence or absence of the recess 6d), the thickness (depth) of the recess 6d, the material of the mold 6, the thickness of the portion through which the detection light 2d is transmitted, etc. This refers to a case where the optical path length of the detection light 2d transmitted through the mold 6 is different due to the difference.

The adjusting means according to each embodiment includes information indicating the presence or absence of the recess 6d of the mold 6, information indicating the thickness of the portion through which the detection light is transmitted (mold thickness), and information indicating the position of the mold side mark 6a. Alternatively, the focus state is adjusted based on the information indicating the material of the mold 6. The information indicating the material of the mold 6 may be the material name or the refractive index. The adjustment amount of the adjusting means may be determined based on only one of the above-mentioned four types of information, or the adjustment amount may be determined based on a plurality of pieces of information.

The adjustment amount referred to here is the drive amount of the drive mechanism 3b in the first embodiment. In the second to fourth embodiments, it is the driving amount of the driving mechanism 81, and in the fifth to seventh embodiments, it is the type of the optical member 10 to be used. It is preferable that the adjustment amount corresponding to the acquired information is stored in the storage unit of the control unit 60 in advance.

The information acquired in S11 or S21 may be information acquired by identifying the type of the mold 6 using the identification unit of the imprinting apparatus. Examples of the identification unit include a mechanism for measuring the thickness of the mold 6 and a reading unit for reading an identifier such as a barcode and a predetermined mark given to the mold 6.

The imprinting apparatus according to each embodiment may form a pattern on the replica mold 13 or the replica mold 14 instead of the substrate 9. Even if the type of mold used for pattern formation changes, the image formed by the light from the mark used for alignment can be detected with high accuracy.

The materials of the optical members 10 and 80 may be the same as or different from those of the mold 6. When the detection light 2d includes light having a wide bandwidth or light having a plurality of wavelengths, it is preferable that the detection light 2d is made of the same material as the mold 6. If it is easy to detect light with a wavelength different from the light of the specific wavelength depending on the type of the mark 9a on the substrate side, if the refractive index characteristics with respect to the wavelength differ between the optical member 10 and the mold 6, the optical path of the detection light 2d There may be a difference in length. If the materials of the optical member 10 and the mold 6 are the same, there is no such concern and the dependence on the process and wavelength can be reduced.

Each of the above-described embodiments may be combined as appropriate.

[Manufacturing method of goods]
The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily when producing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the article, or is temporarily used as a resist mask. The resist mask is removed after etching or ion implantation in the substrate processing process. Furthermore, the method for producing the article may include other well-known processing steps (development, oxidation, film formation, vapor deposition, flattening, resist peeling, dicing, bonding, packaging, etc.).

Next, a specific manufacturing method of the article will be described. As shown in FIG. 18A, a substrate 9z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, a substrate 9z such as a silicon wafer is introduced into the surface of the work material 2z by an inkjet method or the like. The printing material 30 is applied. Here, a state in which a plurality of droplet-shaped imprint materials 30 are applied onto the substrate is shown.

As shown in FIG. 18B, the imprint mold 6 is opposed to the imprint material 30 on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 18C, the substrate 9 to which the imprint material 30 is applied is brought into contact with the mold 6 to apply pressure. The imprint material 30 is filled in the gap between the mold 6 and the work material 2z. In this state, when light is irradiated through the mold 6 as energy for curing, the imprint material 30 is cured.

As shown in FIG. 18D, when the mold 6 and the substrate 9z are separated from each other after the imprint material 30 is cured, a pattern of the cured product of the imprint material 30 is formed on the substrate 9z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the uneven pattern of the mold 6 is transferred to the imprint material 30. It will have been done.

As shown in FIG. 18E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z that has no cured product or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 18 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the work material 2z can be obtained. Although the pattern of the cured product is removed here, it may be used as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article, without being removed even after processing.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

1 Mold 2 Detection system 2a Image sensor (light receiving element)
3 Relay optical system (adjustment means of the first embodiment)
3b drive mechanism (adjustment means of the first embodiment)
6a Mold side mark 9 Substrate (object)
13, 14 Replica mold (object)
9a Substrate side mark 10 Optical member (adjustment means of the fifth and sixth embodiments)
11 Drive mechanism (adjustment means of the fifth and sixth embodiments) (arrangement means)
30 Imprint material 55 Drive mechanism 55 (Adjusting means of the seventh embodiment)
80 Optical member (adjustment means of the second to fourth embodiments)
81 Drive mechanism (adjustment means of the second to fourth embodiments)
100, 200, 300, 200, 500, 600, 700 imprint device

Claims (25)

An imprinting device that forms a pattern of imprint material on an object using a mold, and includes a light receiving element that receives light from a mark provided on at least one of the mold and the object through the mold. Image detection means and
An imprinting apparatus comprising: adjusting means for adjusting the focus state of an image formed on the light receiving element by light from the mark according to the type of the mold used for forming the pattern. The imprinting apparatus according to claim 1, wherein the adjusting means is a means for reducing a change in the focus state due to a change in the type of mold used for forming the pattern. The imprinting apparatus according to claim 1 or 2, wherein the optical path length for the amount of light passing through the mold differs depending on the type of the mold. The adjusting means includes information indicating the presence or absence of a recess of the mold, information indicating the thickness of the mold, information indicating the position of a mark formed on the mold, and the information indicating the position of a mark formed on the mold, which are different depending on the type of the mold. The imprinting apparatus according to any one of claims 1 to 3, wherein the focus state is adjusted based on at least one of the information indicating the material of the mold. The adjusting means according to any one of claims 1 to 4, wherein the adjusting means adjusts the focus state by driving at least one of the optical member and the light receiving element in the optical path of the light along the optical path of the light. The imprint device according to any one of the items. The imprint according to any one of claims 1 to 4, wherein the adjusting means adjusts the focus state by adjusting the optical path length of the light from the mark to the light receiving element. apparatus. The mold used for forming the pattern is the first mold having a first distance of the optical path length for the light to pass through, or the second mold having a second distance with the optical path length for the light passing through being shorter than the first distance. Type 2
The adjusting means includes an optical member including a portion in which the optical path length of the light is an optical path length that complements the difference between the first distance and the second distance.
When the pattern is formed using the first mold, the portion is not transmitted to the light, and when the pattern is formed using the second mold, the portion is transmitted to the light. The imprinting apparatus according to claim 6, wherein the adjusting means adjusts the optical path length. The adjusting means further includes a control means for controlling the image detecting means.
7. The control means is characterized in that the image detecting means is controlled so that the optical path of the light becomes an optical path according to the type of the mold used for forming the pattern and the position of the portion. The imprinting device described. The adjusting means includes an optical member including a plurality of portions having different optical path lengths for transmitting the light, a type of mold used for the optical path of the light to form the pattern, and positions of the plurality of portions. The imprinting apparatus according to claim 6, further comprising a control means for controlling the image detecting means so as to have an optical path corresponding to the above. The image detecting means includes a detection optical system that guides light from the mark to the light receiving element.
The imprint device according to claim 8 or 9, wherein the control means changes the optical path of the light by moving the detection optical system in a direction intersecting the optical axis thereof. The invention according to any one of claims 6 to 10, further comprising a partition wall portion that separates the first space in which the image detecting means is arranged and the second space that communicates with the space that forms the pattern. Imprint device. The imprinting apparatus according to any one of claims 8 to 11, wherein when the optical paths of the light are different, the positions where the marks that generate the light forming the image are provided are different. The light is a first light, and the imprint material is an imprint material that receives and cures a second light having a wavelength band different from that of the first light.
The imprint device according to any one of claims 6 to 12, wherein the first light transmits through the mold in an oblique direction with respect to the optical axis of the second light. The imprint device according to any one of claims 7 to 10 , wherein the optical member is fixedly arranged on the side opposite to the side on which the object is arranged with respect to the mold. The imprinting apparatus according to claim 7, wherein the adjusting means further includes an arranging means for driving the optical member and arranging the portion at a position corresponding to a type of mold used for forming the pattern. .. The light is a first light, and the imprint material is an imprint material that receives and cures a second light having a wavelength band different from that of the first light.
The imprint device according to claim 15, wherein the arrangement means arranges the portion in the optical path of the light so that the optical member is also arranged in the optical path of the second light. The light is a first light, and the imprint material is an imprint material that receives and cures a second light having a wavelength band different from that of the first light.
The optical member is a first optical member and
The arrangement means is the first arrangement means,
The first arranging means arranges the first optical member in the optical path of the first light and outside the optical path of the second light, and places the second optical member in the optical path of the second light. The imprinting apparatus according to claim 15, further comprising a second arranging means for arranging. The imprinting apparatus according to claim 6, wherein the adjusting means is a mounting means capable of mounting an optical member on the mold according to the type of mold used for forming the pattern. The mold used for forming the pattern is the first mold having a first distance of the optical path length for the light to pass through, or the second mold having a second distance with the optical path length for the light passing through being shorter than the first distance. Type 2
The optical member is an optical member in which the optical path length for which the light is transmitted is an optical path length that complements the difference between the first distance and the second distance.
The preceding means is
When the mold used for forming the pattern is the first mold, the optical member is not placed on the mold.
The imprinting apparatus according to claim 18, wherein when the mold used for forming the pattern is the second mold, the optical member is arranged in the mold. The second type has a recess on the side opposite to the side facing the object, the said placing means according to請Motomeko 19 you characterized by placing said optical element in the recess Imprint device. The image according to any one of claims 1 to 20, wherein the image is an image formed by a mark provided on the object by the light receiving element and light from a mark provided on the mold. Imprint device. A first aspect of the present invention, wherein the adjusting means roughly adjusts the focus state of the image, and then moves an optical element on the optical path of the light along the optical path to finely adjust the focus state of the image. 21. The imprinting apparatus according to any one item. An imprinting device that forms a pattern of imprint material on an object using a mold, and includes a light receiving element that receives light from a mark provided on at least one of the mold and the object through the mold. Image detection means and
When the mold is the first mold having a first distance for the optical path length for which the light is transmitted or the second mold having a second distance where the optical path length for which the light is transmitted is shorter than the first distance. An optical member including a portion in which the optical path length of the light is an optical path length that complements the difference between the first distance and the second distance.
When the pattern is formed using the first mold, the optical path of the light becomes the first optical path toward the image detecting means without passing through the portion from the mark provided at the first position. By controlling the image detection means,
When the pattern is formed using the second mold, the optical path of the light passes through the portion from the mark provided at the second position different from the first position and heads toward the image detecting means. An imprinting apparatus comprising: a control means for controlling the image detecting means so as to be an optical path of the above. An imprinting method for forming a pattern of an imprint material on an object using a mold, which is a step of acquiring information indicating the type of the mold used for forming the pattern, and
A step of adjusting the focus state of an image formed on a light receiving element in which light from a mark provided on at least one of the mold and the object is received through the mold, based on the acquired information.
An imprinting method comprising a step of detecting the image in a state where the focus state is adjusted. A step of forming a pattern on the object using the imprinting apparatus according to any one of claims 1 to 23.
A method for manufacturing an article, which comprises a step of processing an object on which a pattern is formed in the step.

Images